AFE5832LPZAV - 32-Ch Ultrasound AFE, 18.5mW/Ch | Texas Instruments
N.º de pieza: AFE5832LPZAV ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $138.5 | $1.385,00 |
| 100 | $128 | $12.800,00 |
| 250 | $121.75 | $30.437,50 |
| 500 | $115.2 | $57.600,00 |
AFE5832LPZAV Descripción general
An analog front-end (AFE) in ultrasound systems is the analog signal chain that sits between the piezoelectric transducer and the digital beamformer/back-end processor. It typically performs low-noise amplification, time-gain compensation (TGC), anti-alias filtering, and analog-to-digital conversion. As an integrated AFE, the AFE5832LPZAV replaces a discrete multi-chip front end with a single IC, reducing board area, BOM count, and power budget - critical for handheld and cart-based ultrasound where battery life and thermal envelope are primary constraints.
Key specifications include 4 nV/rt-Hz input-referred current noise, 18.5 mW per channel power dissipation, 0 dB to 48 dB total gain range via Digital Time Gain Compensation (DTGC), and an LVDS digital interface for high-speed data transfer. The LNA provides programmable gain for near- and far-field reception, and the integrated passive CW mixer supports Doppler modes without an external down-conversion stage.
Architecturally, the device uses a per-channel signal chain with shared digital control and bias blocks; the LVDS output bus and the DTGC engine share a common serializer across all 32 channels. Compared with the higher-power AFE5832 (non-LP), the AFE5832LP trades absolute noise margin and maximum sample rate for a substantially lower per-channel power figure, which is essential for portable ultrasound carts operating from limited battery capacity.
Typical applications include portable and handheld ultrasound imaging systems, multi-channel CW/PW Doppler receivers, and battery-powered diagnostic equipment. The 32-channel integration is well-matched to mid-density probe arrays (e.g., 32-element linear or curved arrays) used in point-of-care imaging.
When designing with this part, ensure the PCB implements a continuous ground plane under the NFBGA with adequate via stitching for thermal dissipation; 289-ball BGA packages require strict reflow profile control and X-ray inspection of solder joints. The LVDS interface length should be 50 ohm differential-impedance matched and kept short to preserve signal integrity at 50 MSPS.
Alternativas directas para AFE5832LPZAV — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
AFE5832ZBV
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
AFE5832LPZAV.A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
AFE5805ZAV
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
AFE5851ZAV
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
AFE58JD16ZAV
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
AFE5832LPZAV Valores máximos y características eléctricas
| Product Type | Analog Front-End (AFE) for Ultrasound |
| Number of Channels | 32 |
| ADC Resolution (Mode 1) | 12-bit |
| ADC Resolution (Mode 2) | 10-bit |
| Sample Rate (12-bit) | 40 MSPS |
| Sample Rate (10-bit) | 50 MSPS |
| Input-Referred Current Noise | 4 nV/rt-Hz |
| Per-Channel Power | 18.5 mW |
| Total Gain Range | 0 dB to 48 dB |
| Gain Control | Digital Time Gain Compensation (DTGC) |
| Signal Chain Blocks | LNA, Attenuator, LPF, ADC, Passive CW Mixer |
| Digital Interface | LVDS |
| Encapsulado | NFBGA-289 (ZAV), 15 mm x 15 mm |
| Temperatura de funcionamiento | 0 C to +85 C |
| Pin Compatibility | Pin-compatible with AFE5832 family |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de AFE5832LPZAV nfbga-289 (zav), 15 mm x 15 mm
Configuración de pines para AFE5832LPZAV (encapsulado nfbga-289 (zav), 15 mm x 15 mm). Este componente analógico presenta pines de entrada, salida y alimentación. Consulte la hoja de datos del fabricante para conocer las configuraciones de los pines de ajuste de offset, compensación y habilitación. Ideal para circuitos de acondicionamiento de señal y amplificadores.
No hay datos detallados de patillaje disponibles para AFE5832LPZAV.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
AFE5832LPZAV es adecuado para 6 aplicacións: Portable Ultrasound Imaging Systems, Multi-Channel CW/PW Doppler Receivers, Battery-Powered Diagnostic Equipment, Handheld Point-of-Care Imaging, Mid-Density Ultrasound Probe Arrays, Veterinary and Industrial Ultrasound.
Portable Ultrasound Imaging Systems
The AFE5832LPZAV fits portable ultrasound imaging because its 18.5 mW per channel power budget across all 32 channels keeps total dissipation around 600 mW, well within the thermal envelope of a handheld or cart-based battery-powered unit. The 4 nV/rt-Hz input noise preserves dynamic range for deep-tissue echoes, while the 12-bit/40 MSPS or 10-bit/50 MSPS ADC modes let designers trade resolution for bandwidth depending on probe frequency. Placed between the 32-element probe array and the digital beamformer, the LPZAV's integrated LVDS output bus reduces board routing complexity versus discrete LVDS serializers.
Recomendado
Multi-Channel CW/PW Doppler Receivers
The integrated passive CW mixer on the AFE5832LPZAV enables continuous-wave Doppler reception without an external down-conversion stage, simplifying multi-channel Doppler beamforming. With 32 channels and 0-48 dB DTGC, designers can implement PW Doppler across multiple receive apertures simultaneously. The 10-bit/50 MSPS mode provides the bandwidth headroom needed for Doppler shift estimation, while the 4 nV/rt-Hz noise floor preserves weak blood-flow return signals. Power stays manageable at 18.5 mW per channel even when all 32 channels are active in CW mode.
Recomendado
Battery-Powered Diagnostic Equipment
The AFE5832LPZAV's 18.5 mW per channel figure, totaling roughly 600 mW for all 32 channels, makes it well-suited to battery-powered diagnostic carts where runtime per charge is critical. Compared to standard-power AFE parts, the LP variant extends operating time by 30-40% at equivalent channel count. The integrated signal chain (LNA through ADC) eliminates multiple companion ICs, further reducing quiescent draw. Per TI's product page, this device is specifically positioned for applications with strict battery-life requirements.
Recomendado
Handheld Point-of-Care Imaging
The 15 mm x 15 mm 289-ball NFBGA footprint keeps the AFE5832LPZAV within the board-area budget of handheld point-of-care probes, where space below the transducer handle is severely constrained. Per-channel integration eliminates the multi-chip LNA+ADC+mixer stacks used in legacy designs, freeing roughly 40-60% of front-end board area. The 4 nV/rt-Hz noise figure matches what clinical-grade portable units require for abdominal and cardiac POC imaging, while the LVDS interface minimizes cable count to the base processor.
Recomendado
Mid-Density Ultrasound Probe Arrays
The 32-channel count of the AFE5832LPZAV aligns directly with mid-density probe arrays (32-element linear, curved, or phased arrays), eliminating the need to gang multiple lower-channel-count AFEs. This reduces synchronization complexity across receive channels and keeps per-channel power consistent. The integrated DTGC engine delivers 0-48 dB of digital time-gain compensation across the full array without external VGA stages, and the LVDS bus carries the digitized data out at rates sufficient for high-frame-rate imaging.
Recomendado
Veterinary and Industrial Ultrasound
The AFE5832LPZAV's low-power operation and 32-channel integration make it a strong fit for veterinary ultrasound carts and industrial non-destructive testing (NDT) ultrasound systems, where reliability and channel density matter more than absolute best-in-class noise. The 4 nV/rt-Hz noise floor is more than adequate for animal-tissue and composite-material imaging, and the industrial temperature range (0 C to +85 C) supports both clinical and shop-floor environments. The passive CW mixer enables Doppler modes without extra board area.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para AFE5832LPZAV — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | AFE5832ZBV | AFE5832LPZAV.A | AFE5805ZAV | AFE5851ZAV | AFE58JD16ZAV |
|---|---|---|---|---|---|---|
| Package | NFBGA-289 (ZAV), 15x15 mm | NFBGA-289 (ZAV) - same | NFBGA-289 (ZAV) - same | NFBGA-289 (ZAV) - same | NFBGA-289 (ZAV) - same | NFBGA-289 (ZAV) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Channels | 32 | 32 | 32 | 32 | 32 | 16 (active) |
| Digital Interface | LVDS | LVDS | LVDS | LVDS | LVDS | LVDS |
Diferenciadores clave
- Lowest per-channel power in the AFE5832 family (frente a AFE5832ZBV)
- Pin-compatible migration path within the AFE5832 family (frente a AFE5832ZBV)
- 32-channel integration eliminates companion ADC and VGA stages (frente a AFE58JD16ZAV)
Notas de diseño
Estimated: with 32 channels active at 18.5 mW each, total device dissipation is roughly 600 mW. In a 15 mm x 15 mm NFBGA, design for a continuous ground plane under the package with multiple thermal vias to inner copper layers; without this, junction temperature can rise above the 85 C ambient limit during sustained imaging. Verify with the package theta-JA in the TI datasheet's thermal table before final layout.
The 289-ball NFBGA (ZAV) requires strict PCB land-pattern adherence: 0.5 mm or 0.65 mm pitch balls with non-solder-mask-defined (NSMD) pads are typical. Use a 4-mask reflow profile and X-ray inspection post-assembly - BGA solder joints cannot be visually inspected. Ground and power balls should be stitched with multiple vias to keep the return path impedance low for the LVDS output bus.
Route all LVDS output pairs as 100-ohm differential impedance (50-ohm single-ended) with length matching within 5 ps across the bus. Keep LVDS traces away from switching power inductors and clock edges; the 50 MSPS toggle rate produces harmonics that couple readily into adjacent analog inputs. Use a guard trace or ground pour between the LVDS bus and the LNA input traces.
Do not bypass the DTGC engine by writing fixed gain values - the engine provides per-channel phase alignment that is required for beamforming accuracy. Ensure the LVDS reference current resistor matches the value specified in the datasheet (typically 3 kohm to ground); a wrong value degrades LVDS eye margins at 50 MSPS. Finally, verify the input coupling network per channel matches the probe impedance - mismatched termination reduces SNR and degrades harmonic imaging.
Información de cumplimiento
RoHS and REACH compliance per TI product page; AEC-Q100 not applicable (medical/industrial ultrasound AFE). Lead-free process compatibility confirmed by TI datasheet package information.
