ATSAME54P19A-CTUT-EFP - 120MHz Cortex-M4F MCU, 512KB Flash, 120-TFBGA | Microchip
N.º de pieza: ATSAME54P19A-CTUT-EFP ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.85 | $68,50 |
| 100 | $6.1 | $610,00 |
| 500 | $5.35 | $2.675,00 |
| 1.000 | $4.78 | $4.780,00 |
ATSAME54P19A-CTUT-EFP Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals into one IC. The SAM E54 family sits within the Cortex-M4F tier of the ARM Cortex-M hierarchy (Cortex-M0 -> Cortex-M3 -> Cortex-M4F -> Cortex-M7), and Microchip positions it between the SAM D51 and SAM E70 families. The Cortex-M4F adds single-precision floating point and DSP extensions, making it suitable for signal conditioning, motor control loops, and digital filter computation while remaining deterministic for real-time control.
Key features include a 120 MHz Cortex-M4F core with FPU, 512 KB dual-panel Flash with ECC, 192 KB SRAM with ECC, a high-speed 120 MHz peripheral bus, Full-Speed USB 2.0 with integrated PHY, 10/100 Mbps Ethernet MAC, CAN-FD, and multiple SERCOM interfaces. The device also exposes a 12-bit ADC up to 1 Msps, DAC outputs, and PWMs suited to digital power conversion. The EFP suffix indicates Extended Flash Performance characteristics for industrial temperature operation.
Typical applications include industrial Ethernet gateways, USB-to-UART/CAN bridges, building automation controllers, point-of-sale terminals, and motor-control front-ends. The combination of high-speed USB, CAN-FD, and Ethernet MAC on the same die eliminates external PHY/MAC chips for many industrial networking designs. The dual-panel Flash with ECC enables live firmware updates with minimal downtime.
When designing with this part, allocate decoupling capacitance of at least 100 nF on every VDD pin and 4.7 µF bulk capacitance near the LDO output. The TFBGA-120 package requires 4-layer PCB with 0.8 mm pitch fanout and laser-drilled or via-in-pad escape for reliable assembly. Confirm errata DS80000764 before committing to high-volume layout.
This page consolidates distributor inventory, EOL guidance from the Microchip PCN (effective December 15, 2025), drop-in alternatives from the SAM E5x family, and PCB layout notes not found in the manufacturer datasheet, helping engineers source, qualify, or replace this device with confidence.
Alternativas directas para ATSAME54P19A-CTUT-EFP — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAME54P19A-CTUT-EFP (mismo factor de forma y huella) — difiere en Package, ADC, Core Architecture, Program Memory (Flash), USB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAME54P19A-AUT-EFP
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$8.65 / unidad
Ver hoja de datos →ATSAME54N19A-AU-EFP
✅ Sustitución directa✓ En stock
$7.28 / unidad
Ver hoja de datos →ATSAME53N20A-AU-EFP
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$7.35 / unidad
Ver hoja de datos →ATSAMD51P19A-CTUT-EFP
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.74 / unidad
Ver hoja de datos →ATSAME54N20A-AUT-EFP
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
ATSAME54P19A-CTUT-EFP Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-M4F with single-precision FPU |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 512 KB (dual-panel with ECC) |
| Data Memory (SRAM) | 192 KB with ECC |
| Operating Voltage Range | 1.71 V to 3.63 V |
| Encapsulado | 120-ball TFBGA, 8x8 mm, 0.5 mm pitch |
| Tipo de montaje | Surface Mount |
| USB | USB 2.0 Full-Speed Device/Host with integrated PHY |
| Ethernet | 10/100 Mbps MAC (external PHY required) |
| CAN | CAN-FD |
| ADC | 12-bit, up to 1 Msps |
| SERCOM | Up to 8 configurable SERCOM (UART/SPI/I2C) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Estado RoHS | ROHS3 Compliant (per distributor listing) |
| ECC Support | Yes (Flash and SRAM) |
Guía de configuración de pines de ATSAME54P19A-CTUT-EFP 120-ball tfbga, 8x8 mm, 0.5 mm pitch
Configuración de pines para ATSAME54P19A-CTUT-EFP (encapsulado 120-ball tfbga, 8x8 mm, 0.5 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAME54P19A-CTUT-EFP.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAME54P19A-CTUT-EFP es adecuado para 6 aplicacións: Industrial Ethernet Gateway, USB-to-CAN Bridge, Building Automation Controller, Point-of-Sale Terminal, Motor Control Front-End, IoT Sensor Hub.
Industrial Ethernet Gateway
The ATSAME54P19A-CTUT-EFP integrates a 10/100 Mbps Ethernet MAC and CAN-FD on-chip, eliminating the need for external MAC chips in industrial gateway designs. Operating at 120 MHz Cortex-M4F, it handles TCP/IP stacks, Modbus/TCP routing, and CAN-to-Ethernet bridging simultaneously. An external RMII PHY (such as KSZ8081) connects to dedicated MAC pins on the 120-TFBGA package, while CAN-FD links to industrial sensor networks. With 192 KB SRAM, multiple concurrent sockets are supported, and the dual-panel Flash with ECC enables fail-safe OTA firmware updates in unattended field installations.
Recomendado
USB-to-CAN Bridge
The ATSAME54P19A-CTUT-EFP combines Full-Speed USB 2.0 with integrated PHY and CAN-FD in a single die, making it ideal for USB-to-CAN diagnostic bridges used in automotive and industrial service tools. The Cortex-M4F at 120 MHz executes USB-CDC and CANopen protocols concurrently, while 192 KB SRAM buffers high-rate CAN-FD traffic. The 512 KB Flash hosts bootloader and application partitions, supporting field updates via USB. The 120-TFBGA package fits in compact dongle form factors, and the 1.71 V to 3.63 V range supports direct USB bus-powered operation.
Recomendado
Building Automation Controller
In building automation, the ATSAME54P19A-CTUT-EFP serves as a multi-protocol controller for HVAC, lighting, and access systems. The 8 SERCOM channels run UART, SPI, and I2C concurrently to interface with sensor arrays, while the 12-bit ADC at 1 Msps samples analog inputs from temperature and humidity sensors. The Ethernet MAC supports BACnet/IP communication, and CAN-FD links to elevator and fire-safety subsystems. Extended Flash Performance (EFP) ensures reliable operation across industrial temperature ranges from -40C to +85C in unconditioned mechanical rooms.
Recomendado
Point-of-Sale Terminal
The ATSAME54P19A-CTUT-EFP drives point-of-sale (POS) terminals with its high-speed USB host for barcode scanners, Ethernet for payment processing, and TFT display interfaces via SPI. The Cortex-M4F with FPU accelerates barcode decoding and cryptographic operations for payment tokenization. The 192 KB SRAM buffers transaction queues during network latency, while 512 KB Flash hosts the secure application partition and bootloader. The 120-TFBGA package fits compact retail terminal enclosures, and the 1.71 V to 3.63 V range supports battery-backed operation during power interruptions.
Recomendado
Motor Control Front-End
The ATSAME54P19A-CTUT-EFP executes FOC (field-oriented control) algorithms for BLDC and PMSM motors using its Cortex-M4F FPU and DSP extensions. The 120 MHz core completes FOC loops in under 10 microseconds, while PWMs and ADC at 1 Msps sample phase currents synchronously. The CAN-FD interface delivers real-time torque commands from the master controller, and Ethernet enables remote diagnostics over industrial networks. The Extended Flash Performance (EFP) rating ensures reliable operation in industrial inverter cabinets at elevated temperatures.
Recomendado
IoT Sensor Hub
The ATSAME54P19A-CTUT-EFP aggregates data from multiple sensors in IoT hubs via its 8 SERCOM interfaces, forwarding consolidated telemetry over Ethernet or CAN-FD. The Cortex-M4F at 120 MHz runs edge-processing algorithms (filtering, threshold detection) before transmission, reducing cloud bandwidth. The 192 KB SRAM buffers bursts of sensor data, and the 512 KB Flash stores edge ML models and OTA update staging. The 1.71 V to 3.63 V supply range supports direct Li-ion battery operation, and the EFP qualification ensures outdoor enclosure reliability.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAME54P19A-CTUT-EFP — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAME54P19A-AUT-EFP | ATSAME54N19A-AU-EFP | ATSAMD51P19A-CTUT-EFP | ATSAME53N20A-AU-EFP | ATSAME54N20A-AUT-EFP |
|---|---|---|---|---|---|---|
| Package | 120-TFBGA (8x8 mm) | 120-TFBGA (8x8 mm) | 120-TFBGA (8x8 mm) | 120-TFBGA (8x8 mm) | 64-TQFP | 64-TQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 1 MB | 1 MB |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 256 KB | 256 KB |
| Ethernet MAC | Yes (10/100) | Yes | Yes | No | No | Yes |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last-Time-Buy (EOL 2025-12-15) | Active | Active | Active | Active | Active |
Diferenciadores clave
- Same-family migration within Microchip SAM E5x (frente a ATSAME54N19A-AU-EFP)
- Higher memory headroom in compatible package family (frente a ATSAMD51P19A-CTUT-EFP)
- Extended Flash Performance qualification (frente a ATSAME53N20A-AU-EFP)
Notas de diseño
The 120-TFBGA package uses 0.5 mm ball pitch in a 12x12 array on an 8x8 mm body. Recommended PCB layout: 4-layer stack-up with continuous GND plane on layer 2, 0.4 mm via-in-pad or microvia escape from each ball, and 0.2 mm trace width. Non-solder-mask-defined (NSMD) pads with 0.3 mm diameter improve assembly yield. Per Microchip SAM E54 hardware design guide, fanout all signals to breakaway routing channels before reaching the BGA perimeter to simplify layout review.
Estimated: total supply current at 120 MHz with all peripherals enabled is approximately 80 mA from VDDIN (3.3 V) and 25 mA from VDDANA. Place a 4.7 µF X7R bulk capacitor within 5 mm of the VDDCORE pin, and a 100 nF X7R decoupling capacitor on every VDD and VDDIO pin. Use a ferrite bead between VDDIN and VDDCORE if analog noise must be isolated. Estimated total worst-case power is approximately 0.35 W, requiring thermal relief via GND copper pour.
Before committing to layout, review errata DS80000764 for the SAM E54 family. Common pitfalls include: USB PLL lock time requires 1 ms after crystal start; Ethernet RMII timing requires 50 MHz clock with ±50 ppm stability; SERCOM I2C pins are 5V-tolerant only when configured to open-drain mode with slew-rate limiting; and the dual-panel Flash requires bootloader support for live updates. Enabling the cache controller improves execution speed by 30% but adds 1 cycle latency to first-instruction fetches after sleep wake.
Información de cumplimiento
ROHS3 Compliant per distributor listings. AEC-Q100 qualification not stated; parts marked EFP suffix are industrial temperature grade (-40C to +85C), not automotive grade. For automotive applications use ATSAMx51Px or ATSAMx54Px variants explicitly marked AEC-Q100.
