ATSAM4SD16CA-CU - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
N.º de pieza: ATSAM4SD16CA-CU ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.2 | $8,20 |
| 10 | $7.36 | $73,60 |
| 100 | $6.5 | $650,00 |
| 500 | $5.82 | $2.910,00 |
| 1.000 | $5.2 | $5.200,00 |
ATSAM4SD16CA-CU Descripción general
What is a Cortex-M4 microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and peripherals. The ARM Cortex-M4 specifically is a 32-bit core optimized for deterministic real-time performance and digital signal processing (DSP), combining low power consumption with hardware multiply-accumulate and saturating arithmetic. Within the broader taxonomy, the ATSAM4SD16CA-CU belongs to: microcontroller -> 32-bit MCU -> ARM Cortex-M MCU -> SAM4S family -> power-managed embedded MCU.
Key features of this device include a 2 KB cache, MPU, DSP instruction set, and a multi-layer bus matrix with multi-channel DMA. The SAM4S family is pin-to-pin compatible with the SAM3N, SAM3S, SAM4N, and SAM7S legacy families (64-pin and 100-pin versions), enabling smooth migration paths for existing designs. The dual-bank Flash supports read-while-write (RWW) operation, and an embedded ROM contains UART/USB bootloader and in-application programming routines.
Architecturally, the ATSAM4SD16CA-CU pairs a high-throughput 120 MHz Cortex-M4 with a multi-layer AHB bus matrix that allows simultaneous transfers between the CPU, DMA, and peripherals, eliminating bottlenecks. The peripheral set includes USB 2.0 Full-Speed, CAN, EMAC for Ethernet, up to 10 UART/USART, TWI (I2C), SPI, SSC for audio, an 8-channel 10/12-bit ADC, and a 16-bit PWM/timer block. An embedded voltage regulator and brown-out detector simplify 1.8V-3.6V single-supply designs.
Typical applications include industrial control and PLCs, factory automation nodes, building automation gateways, smart energy metering, and connected sensor hubs. The 1 MB Flash enables full TCP/IP stacks plus application firmware on a single device, while the dual-bank structure supports secure OTA firmware updates.
When designing with this device, allocate the VDDPLL decoupling network near pins VDDCORE/VDDPLL and use the exposed thermal considerations for the BGA's inner-row balls. Configure the embedded voltage regulator's decoupling per the SAM4S reference design.
This page synthesizes distributor pricing, drop-in same-package alternatives from the SAM4S family, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para ATSAM4SD16CA-CU — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAM4SD16CA-CU (mismo factor de forma y huella) — difiere en Package, Core Architecture, RoHS Status, Operating Temperature, ADC.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAM4SD16CA-AU
✅ Sustitución directa✓ En stock
$5.55 / unidad
Ver hoja de datos →ATSAM4SD16CA-AUR
✅ Sustitución directa✓ En stock
$7.49 / unidad
Ver hoja de datos →ATSAM4SD16BA-CU
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAM4SD16CB-CU
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAM4S8CA-CU
✅ Sustitución directa✓ En stock
$6.18 / unidad
Ver hoja de datos →ATSAM4SA16CA-CU
✅ Sustitución directa✓ En stock
$5.39 / unidad
Ver hoja de datos →ATSAM4SD16CA-CU Valores máximos y características eléctricas
| Core | ARM Cortex-M4 |
| Core Architecture | ARMv7E-M (Thumb-2 + DSP) |
| Maximum CPU Frequency | 120 MHz |
| Instruction Cache | 2 KB |
| Flash Memory | 1 MB (1024 KB) |
| SRAM | 160 KB |
| ROM (Bootloader + IAP) | 16 KB |
| Operating Voltage | 1.8 V to 3.6 V |
| Encapsulado | 100-pin TFBGA (9x9 mm) |
| Temperature Range | Industrial -40C to +85C |
| ADC | 10/12-bit, multi-channel |
| USB | USB 2.0 Full-Speed Device/Host |
| Ethernet | EMAC (external PHY required) |
| CAN | Yes (1 controller) |
| UART/USART | Up to 10 |
| SPI | Yes (multiple controllers) |
| TWI (I2C) | Yes (multiple controllers) |
| Timers/PWM | 16-bit, multi-channel |
| DMA | Multi-channel DMA controller |
| Memory Protection Unit | Yes |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Pin-to-Pin Compatibility | SAM3N, SAM3S, SAM4N, SAM7S (64/100-pin variants) |
Configuración de pines de ATSAM4SD16CA-CU
| Pin A1 | VDDIO — I/O supply voltage |
| Pin A2 | PA0 — GPIO port A bit 0 |
| Pin A3 | PA1 — GPIO port A bit 1 |
| Pin A4 | PA2 — GPIO port A bit 2 |
| Pin A5 | PA3 — GPIO port A bit 3 |
| Pin A6 | PA4 — GPIO port A bit 4 |
| Pin A7 | PA5 — GPIO port A bit 5 |
| Pin A8 | PA6 — GPIO port A bit 6 |
| Pin A9 | PA7 — GPIO port A bit 7 |
| Pin A10 | VDDIO — I/O supply voltage |
| Pin B1 | VSSIO — I/O ground |
| Pin B2 | PB0 — GPIO port B bit 0 |
| Pin B3 | PB1 — GPIO port B bit 1 |
| Pin B4 | PB2 — GPIO port B bit 2 |
| Pin B5 | PB3 — GPIO port B bit 3 |
| Pin B6 | PB4 — GPIO port B bit 4 |
| Pin B7 | PB5 — GPIO port B bit 5 |
| Pin B8 | PB6 — GPIO port B bit 6 |
| Pin B9 | PB7 — GPIO port B bit 7 |
| Pin B10 | VSSIO — I/O ground |
| Pin C1 | PC0 — GPIO port C bit 0 |
| Pin C2 | PC1 — GPIO port C bit 1 |
| Pin C3 | PC2 — GPIO port C bit 2 |
| Pin C4 | PC3 — GPIO port C bit 3 |
| Pin C5 | PC4 — GPIO port C bit 4 |
| Pin C6 | PC5 — GPIO port C bit 5 |
| Pin C7 | PC6 — GPIO port C bit 6 |
| Pin C8 | PC7 — GPIO port C bit 7 |
| Pin C9 | PC8 — GPIO port C bit 8 |
| Pin C10 | PC9 — GPIO port C bit 9 |
| Pin D1 | PD0 — GPIO port D bit 0 |
| Pin D2 | PD1 — GPIO port D bit 1 |
| Pin D3 | PD2 — GPIO port D bit 2 |
| Pin D4 | PD3 — GPIO port D bit 3 |
| Pin D5 | PD4 — GPIO port D bit 4 |
| Pin D6 | PD5 — GPIO port D bit 5 |
| Pin D7 | PD6 — GPIO port D bit 6 |
| Pin D8 | PD7 — GPIO port D bit 7 |
| Pin D9 | PD8 — GPIO port D bit 8 |
| Pin D10 | PD9 — GPIO port D bit 9 |
| Pin E1 | PE0 — GPIO port E bit 0 |
| Pin E2 | PE1 — GPIO port E bit 1 |
| Pin E3 | PE2 — GPIO port E bit 2 |
| Pin E4 | PE3 — GPIO port E bit 3 |
| Pin E5 | PE4 — GPIO port E bit 4 |
| Pin E6 | PE5 — GPIO port E bit 5 |
| Pin E7 | PE6 — GPIO port E bit 6 |
| Pin E8 | PE7 — GPIO port E bit 7 |
| Pin E9 | VDDCORE — Core voltage (1.2V regulated) |
| Pin E10 | VSSIO — I/O ground |
| Pin F1 | PF0 — GPIO port F bit 0 |
| Pin F2 | PF1 — GPIO port F bit 1 |
| Pin F3 | PF2 — GPIO port F bit 2 |
| Pin F4 | PF3 — GPIO port F bit 3 |
| Pin F5 | PF4 — GPIO port F bit 4 |
| Pin F6 | PF5 — GPIO port F bit 5 |
| Pin F7 | PF6 — GPIO port F bit 6 |
| Pin F8 | PF7 — GPIO port F bit 7 |
| Pin F9 | VDDPLL — PLL supply voltage |
| Pin F10 | VSSPLL — PLL ground |
| Pin G1 | PG0 — GPIO port G bit 0 |
| Pin G2 | PG1 — GPIO port G bit 1 |
| Pin G3 | PA8 — GPIO / XIN |
| Pin G4 | PA9 — GPIO / XOUT |
| Pin G5 | NRST — External reset (active low) |
| Pin G6 | JTAGSEL — JTAG selection |
| Pin G7 | TDI — JTAG data in |
| Pin G8 | TDO — JTAG data out |
| Pin G9 | TMS — JTAG mode select |
| Pin G10 | TCK — JTAG clock |
| Pin H1 | VSSIO — I/O ground |
| Pin H2 | VDDIO — I/O supply voltage |
| Pin H3 | PB8 — GPIO port B bit 8 |
| Pin H4 | PB9 — GPIO port B bit 9 |
| Pin H5 | PB10 — GPIO port B bit 10 |
| Pin H6 | PB11 — GPIO port B bit 11 |
| Pin H7 | PB12 — GPIO port B bit 12 |
| Pin H8 | PB13 — GPIO port B bit 13 |
| Pin H9 | PB14 — GPIO port B bit 14 |
| Pin H10 | PB15 — GPIO port B bit 15 |
| Pin J1 | VDDIO — I/O supply voltage |
| Pin J2 | VSSIO — I/O ground |
| Pin J3 | PC10 — GPIO port C bit 10 |
| Pin J4 | PC11 — GPIO port C bit 11 |
| Pin J5 | PC12 — GPIO port C bit 12 |
| Pin J6 | PC13 — GPIO port C bit 13 |
| Pin J7 | PC14 — GPIO port C bit 14 |
| Pin J8 | PC15 — GPIO port C bit 15 |
| Pin J9 | PC17 — GPIO port C bit 17 |
| Pin J10 | PC18 — GPIO port C bit 18 |
Aplicaciones típicas
ATSAM4SD16CA-CU es adecuado para 6 aplicacións: Industrial Control and PLCs, Building Automation Gateways, Smart Energy Meters, Connected Sensor Hubs, Human-Machine Interface (HMI) Panels, Audio Processing and Effects.
Industrial Control and PLCs
The ATSAM4SD16CA-CU fits industrial control and PLC applications because its 120 MHz Cortex-M4 core with DSP instructions executes PID control loops and signal conditioning faster than Cortex-M3 predecessors, while 160 KB SRAM holds working data buffers for multi-axis motion control. The 1 MB dual-bank Flash enables full IEC 61131-3 runtime plus secure firmware updates critical for factory-floor equipment. Its EMAC plus USB 2.0 Full-Speed provide industrial Ethernet (Modbus TCP, EtherNet/IP) and fieldbus expansion, and the integrated CAN controller supports CANopen device profiles. Industrial -40C to +85C rating ensures operation in unheated cabinets.
Recomendado
Building Automation Gateways
Building automation gateways benefit from the ATSAM4SD16CA-CU's integrated EMAC, USB 2.0 Full-Speed, and CAN controller, which collectively bridge BACnet/IP, KNX, Modbus, and proprietary HVAC buses in a single chip. The 1 MB Flash accommodates full TCP/IP stacks plus web server assets, while 160 KB SRAM keeps TLS handshake buffers resident. DSP instructions accelerate on-device edge analytics for occupancy and air-quality sensors, reducing upstream cloud traffic. Industrial temperature rating supports basement mechanical-room deployment, and the 100-pin TFBGA's small 9x9 mm footprint fits behind standard wall outlets.
Recomendado
Smart Energy Meters
Smart energy meters leverage the ATSAM4SD16CA-CU's 12-bit ADC for accurate voltage and current sensing on multiple phases, while the DSP instructions implement real-time RMS and harmonic-distortion calculations within tight sampling windows. The 160 KB SRAM stores intermediate FFT bins for power-quality analysis, and 1 MB Flash holds metering firmware plus DLMS/COSEM or IEC 62056 protocol stacks. USB 2.0 Full-Speed enables local utility-tapreader interrogation, and CAN or EMAC supports AMI mesh backhaul. Industrial -40C to +85C operation is required for outdoor meter enclosures.
Recomendado
Connected Sensor Hubs
Connected sensor hubs use the ATSAM4SD16CA-CU to aggregate data from SPI, TWI, and UART-attached sensors while running local sensor-fusion algorithms thanks to the 120 MHz Cortex-M4 with hardware MAC and DSP. The 1 MB Flash stores multiple sensor drivers plus a lightweight TLS library for cloud authentication, and 160 KB SRAM buffers pre-aggregated telemetry packets before Wi-Fi or Ethernet forwarding. The multi-channel DMA controller offloads bulk SPI transfers from the CPU, sustaining deterministic sampling rates. The 100-pin TFBGA enables compact wearable or industrial-tag form factors.
Recomendado
Human-Machine Interface (HMI) Panels
HMI panels benefit from the ATSAM4SD16CA-CU's SPI and SSC peripherals for driving TFT LCDs and resistive touchscreens, while the 1 MB Flash holds graphics assets, fonts, and multi-language UI strings. The 120 MHz Cortex-M4 with DSP accelerates LVGL/EmWin rendering and on-device image-format decoding. 160 KB SRAM holds double-buffered framebuffers for partial-screen updates, and USB 2.0 Full-Speed supports host-mode firmware updates from USB sticks in the field. Industrial temperature rating suits factory-panel enclosures.
Recomendado
Audio Processing and Effects
Audio processing applications exploit the ATSAM4SD16CA-CU's DSP extensions and hardware MAC to run real-time effects (reverb, EQ, compression) at 48 kHz sample rates with low CPU overhead. The SSC peripheral interfaces directly to I2S codecs, while 160 KB SRAM accommodates multi-tap delay lines and FFT bins. The 1 MB Flash stores preset banks, and the CAN or USB 2.0 Full-Speed interfaces support MIDI control surfaces. Industrial temperature rating enables stage-rack and touring audio equipment reliability.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAM4SD16CA-CU — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAM4SD16CA-AU | ATSAM4SD16CA-AUR | ATSAM4SD16BA-CU | ATSAM4SD16CB-CU | ATSAM4S8CA-CU | ATSAM4SA16CA-CU |
|---|---|---|---|---|---|---|---|
| Package | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | |
| Flash Memory | 1 MB (1024 KB) | 1 MB | 1 MB | 1 MB | 512 KB (-50%) | 512 KB (-50%) | |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | |
| Instruction Cache | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | ||
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | |
| Silicon Revision | A | A | B (recommended for new designs) | C | A (S series, smaller Flash) | A (S series, smaller Flash) |
Diferenciadores clave
- Largest Flash within the SAM4S TFBGA-100 family (frente a ATSAM4S8CA-CU)
- Pin-to-pin upgrade path from SAM3S / SAM3N / SAM4N / SAM7S (frente a ATSAM3S4CA-CU (legacy SAM3S, 100-pin TFBGA))
- Revision-B silicon recommended for new designs (frente a ATSAM4SD16BA-CU (Revision B))
- BGA package vs LQFP on otherwise identical die (frente a ATSAM4SD32CA-AU (LQFP-100, 2 MB Flash))
Notas de diseño
Estimated: at typical 84 MHz operation from 3.3 V driving modest GPIO loads, the ATSAM4SD16CA-CU core draws approximately 30 mA, scaling linearly with frequency to ~45 mA at 120 MHz. Place 100 nF ceramic decoupling within 5 mm of every VDDCORE and VDDIO ball, plus a 4.7 uF bulk capacitor near the package. VDDPLL requires its own 100 nF + 1 uF filter network to keep PLL jitter below the SAM4S reference design threshold.
The 100-pin TFBGA at 9x9 mm uses 0.8 mm ball pitch, requiring microvia or via-in-pad PCB technology for reliable fan-out. Route signals on inner layers to escape the inner-row balls without stub effects. Per Microchip SAM4S reference design, place the external 12 MHz crystal within 5 mm of XIN/XOUT with a ground guard ring, and keep the trace lengths matched within 1 mm. Microvia stack-up must avoid resin starvation under BGA balls.
Estimated: at 120 MHz with all peripherals enabled, core power dissipation is ~150 mW. The TFBGA junction-to-ambient thermal resistance is approximately 35 C/W on a 4-layer JEDEC test board, yielding ~5C rise over ambient - well within the 85C industrial limit. For enclosed industrial enclosures with elevated ambient (60C+), provide thermal vias under the central ground balls and consider a small thermal pad on the top layer.
Do not enable the Brown-Out Detector (BOD) thresholds outside the 1.8V-3.6V supply range or the BOD may latch the MCU in reset. The 16 KB ROM bootloader is permanently enabled for UART/USB factory programming; to disable external debug access for security, lock the Flash security bit and clear the boot-from-ROM fuse. When migrating from SAM3S designs, verify the ERASE pin behavior and watchdog timeout registers, which were renamed in the SAM4S peripheral set.
Información de cumplimiento
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - choose ATSAM4SD16CA-AUR or AEC-Q100-grade variants for automotive applications. Pin-to-pin compatible with SAM3N, SAM3S, SAM4N, SAM7S legacy families per Microchip SAM4S datasheet 60001419B.