ATSAMG55J19A-MU - Cortex-M4 MCU 120MHz 512KB Flash 64-QFN | Microchip
N.º de pieza: ATSAMG55J19A-MU ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.41 | $8,41 |
| 10 | $7.62 | $76,20 |
| 100 | $6.74 | $674,00 |
| 500 | $6.05 | $3.025,00 |
| 1.000 | $5.42 | $5.420,00 |
ATSAMG55J19A-MU Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash and SRAM), and programmable peripherals. Within the broader hierarchy, the SAM G55 belongs to ARM Cortex-M4 microcontrollers -> 32-bit MCUs -> embedded microcontrollers -> integrated circuits. The Cortex-M4 with single-precision FPU enables efficient DSP and floating-point math for audio, motor control, and signal-processing tasks.
Key features include up to 120 MHz CPU clock, 512 KB Flash, up to 176 KB SRAM, full-speed USB 2.0 with on-chip PHY, I2S audio interface for digital audio streaming, and picoPower technology delivering down to 100 uA/MHz active and below 7 uA in deep sleep with SRAM retention. Wake-up from deep sleep to first instruction is as fast as 3 us. The integrated FPU accelerates audio codecs and DSP workloads without external math processors.
The SAM G55 architecture combines an MPU (Memory Protection Unit), hardware AES, and a flexible peripheral set including HS USB, USB on-the-go, up to two I2S/TDM interfaces, multiple UART/SPI/TWI, and a 12-bit ADC. Compared to Cortex-M0/M3 parts, the Cortex-M4 with FPU executes single-precision math in a single cycle, dramatically reducing CPU load for audio and motor-control algorithms.
Typical applications include USB audio headsets and USB headphones, Bluetooth audio bridges, IoT edge nodes with USB connectivity, industrial sensor hubs, and low-power consumer audio products. The combination of USB 2.0 FS, I2S, and Cortex-M4 DSP makes it well suited to audio streaming tasks.
Designers should pay attention to decoupling: place 100 nF + 4.7 uF ceramic capacitors near each VDD pin and keep the QFN exposed pad soldered to a continuous ground plane for thermal dissipation and signal integrity.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same SAM G55 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para ATSAMG55J19A-MU — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAMG55J19A-MU (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Audio Interface, Core Architecture, USB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAMG55J19A-MUT
✅ Sustitución directa✓ En stock
$4.58 / unidad
Ver hoja de datos →ATSAMG55J19B-MU
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAMG55J19B-MUT
✅ Sustitución directa✓ En stock
$5.74 / unidad
Ver hoja de datos →ATSAMG55J19A-AU
✅ Sustitución directa✓ En stock
$3.99 / unidad
Ver hoja de datos →ATSAMG55J19A-MU Valores máximos y características eléctricas
| Core Processor | ARM Cortex-M4F (with FPU) |
| Core Size | 32-Bit |
| Maximum CPU Speed | 120 MHz |
| Program Memory Size | 512 KB Flash |
| RAM Size | Up to 176 KB SRAM |
| Tensión de alimentación | 3.0 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| Encapsulado | 64-pin QFN (7.5x7.5 mm) |
| Tipo de montaje | Surface Mount |
| USB Interface | USB 2.0 Full-Speed with on-chip PHY |
| Audio Interface | I2S / TDM (up to 2 instances) |
| Active Current (picoPower) | 100 uA/MHz |
| Deep Sleep Current | <7 uA with SRAM retention |
| Wake-up Time | Down to 3 us from deep sleep |
| Estado RoHS | Compliant |
Configuración de pines de ATSAMG55J19A-MU
| Pin 1 | VDDIO — I/O supply voltage |
| Pin 2 | PA0 — GPIO / peripheral function |
| Pin 3 | PA1 — GPIO / peripheral function |
| Pin 4 | PA2 — GPIO / peripheral function |
| Pin 5 | PA3 — GPIO / peripheral function |
| Pin 6 | PA4 — GPIO / peripheral function |
| Pin 7 | PA5 — GPIO / peripheral function |
| Pin 8 | VDDIO — I/O supply voltage |
| Pin 9 | GND — Ground |
| Pin 10 | PA6 — GPIO / peripheral function |
| Pin 11 | PA7 — GPIO / peripheral function |
| Pin 12 | PA8 — GPIO / peripheral function |
| Pin 13 | PA9 — GPIO / peripheral function |
| Pin 14 | PA10 — GPIO / peripheral function |
| Pin 15 | PA11 — GPIO / peripheral function |
| Pin 16 | VDDIO — I/O supply voltage |
| Pin 17 | PA12 — GPIO / peripheral function |
| Pin 18 | PA13 — GPIO / peripheral function |
| Pin 19 | PA14 — GPIO / peripheral function |
| Pin 20 | GND — Ground |
| Pin 21 | PB0 — GPIO / peripheral function |
| Pin 22 | PB1 — GPIO / peripheral function |
| Pin 23 | PB2 — GPIO / peripheral function |
| Pin 24 | PB3 — GPIO / peripheral function |
| Pin 25 | PB4 — GPIO / peripheral function |
| Pin 26 | PB5 — GPIO / peripheral function |
| Pin 27 | PB6 — GPIO / peripheral function |
| Pin 28 | PB7 — GPIO / peripheral function |
| Pin 29 | PB8 — GPIO / peripheral function |
| Pin 30 | PB9 — GPIO / peripheral function |
| Pin 31 | PB10 — GPIO / peripheral function |
| Pin 32 | PB11 — GPIO / peripheral function |
| Pin 33 | VDDCORE — Core supply voltage (1.2 V typical) |
| Pin 34 | PB12 — GPIO / peripheral function |
| Pin 35 | PB13 — GPIO / peripheral function |
| Pin 36 | PB14 — GPIO / peripheral function |
| Pin 37 | GND — Ground |
| Pin 38 | PC0 — GPIO / peripheral function |
| Pin 39 | PC1 — GPIO / peripheral function |
| Pin 40 | PC2 — GPIO / peripheral function |
| Pin 41 | PC3 — GPIO / peripheral function |
| Pin 42 | PC4 — GPIO / peripheral function |
| Pin 43 | PC5 — GPIO / peripheral function |
| Pin 44 | PC6 — GPIO / peripheral function |
| Pin 45 | PC7 — GPIO / peripheral function |
| Pin 46 | VDDIO — I/O supply voltage |
| Pin 47 | PC8 — GPIO / peripheral function |
| Pin 48 | PC9 — GPIO / peripheral function |
| Pin 49 | PC10 — GPIO / peripheral function |
| Pin 50 | PC11 — GPIO / peripheral function |
| Pin 51 | PC12 — GPIO / peripheral function |
| Pin 52 | PC13 — GPIO / peripheral function |
| Pin 53 | PC14 — GPIO / peripheral function |
| Pin 54 | PC15 — GPIO / peripheral function |
| Pin 55 | GND — Ground |
| Pin 56 | PD0 — GPIO / peripheral function |
| Pin 57 | PD1 — GPIO / peripheral function |
| Pin 58 | PD2 — GPIO / peripheral function |
| Pin 59 | PD3 — GPIO / peripheral function |
| Pin 60 | PD4 — GPIO / peripheral function |
| Pin 61 | PD5 — GPIO / peripheral function |
| Pin 62 | PD6 — GPIO / peripheral function |
| Pin 63 | PD7 — GPIO / peripheral function |
| Pin 64 | VDDIO — I/O supply voltage |
Aplicaciones típicas
ATSAMG55J19A-MU es adecuado para 6 aplicacións: USB Audio Headset, Industrial Sensor Hub, Bluetooth Audio Dongle, IoT Edge Node with USB Diagnostics, USB Headphones and Headsets, Low-Power Consumer Audio Product.
USB Audio Headset
The ATSAMG55J19A-MU integrates a USB 2.0 Full-Speed device interface with on-chip PHY plus dual I2S/TDM audio interfaces, making it an ideal MCU for USB digital audio headsets and headphones. The 120 MHz Cortex-M4F with FPU runs USB audio class firmware and applies real-time DSP effects (EQ, compressor, noise gate) without taxing CPU headroom. Up to 176 KB SRAM holds USB ping-pong buffers plus audio frame buffers. Designers route I2S to an external codec (e.g., SSS1623 or PCM5102A) and use 32-pin GPIO for buttons/LEDs. Total BOM drops versus a discrete USB audio controller plus DSP plus MCU.
Recomendado
Industrial Sensor Hub
With 100 uA/MHz active current and below 7 uA in deep sleep with SRAM retention, the ATSAMG55J19A-MU fits battery-powered industrial sensor hubs aggregating Modbus, I2C, SPI, and analog sensor data. The Cortex-M4F executes floating-point FFT and sensor-fusion math directly, while 512 KB Flash accommodates over-the-air (OTA) dual-image bootloaders. The 64-QFN exposes 5 UART channels for multi-protocol bridging. Wake-up in 3 us from deep sleep enables aggressive duty-cycling for multi-year coin-cell deployments.
Recomendado
Bluetooth Audio Dongle
Used as the USB host and audio routing MCU in a USB-to-Bluetooth audio dongle, the ATSAMG55J19A-MU manages USB enumeration, SBC/AAC encode, and forwards PCM to a co-processor over I2S. The Cortex-M4F handles USB host stack plus encoding without external DSP, and the integrated FPU accelerates audio codec math. Up to 176 KB SRAM is sufficient for USB + audio buffering. Power consumption stays low enough for bus-powered dongle operation from a single 5 V USB rail.
Recomendado
IoT Edge Node with USB Diagnostics
The ATSAMG55J19A-MU's USB 2.0 FS device interface makes it well suited to industrial IoT edge nodes that expose a USB diagnostic port for firmware updates, log capture, and field configuration. The 120 MHz Cortex-M4F runs TCP/IP stacks or MQTT-SN over UART-to-modem, while USB is reserved for service access. The QFN package and picoPower consumption enable sealed IP65 enclosures with single-cell Li-ion battery support. Real-time clock with calendar aids timestamping of field data.
Recomendado
USB Headphones and Headsets
In USB stereo headphones the ATSAMG55J19A-MU implements USB isochronous endpoints, sample-rate conversion, and digital volume control. The I2S bus feeds an external DAC that drives the headphone amplifier. Cortex-M4F DSP handles parametric EQ, limiter, and bass-boost algorithms without overloading the USB isochronous budget. Up to 176 KB SRAM hosts USB isochronous ping-pong buffers and audio frame processing buffers simultaneously. Industrial temp range suits consumer and prosumer audio products.
Recomendado
Low-Power Consumer Audio Product
Battery-powered speakers, dictation devices, and voice memo recorders benefit from the ATSAMG55J19A-MU's picoPower consumption profile. Active current of 100 uA/MHz plus deep sleep below 7 uA with full SRAM retention enables weeks of standby on a single Li-ion cell. The Cortex-M4F at 120 MHz executes MP3/WAV decode or simple voice-trigger wake-word detection. USB charging and I2S playback share a single MCU, eliminating an external PMIC in many designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAMG55J19A-MU — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAMG55J19A-MUT | ATSAMG55J19B-MU | ATSAMG55J19B-MUT | ATSAMG55J19A-AU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (7.5x7.5 mm) | 64-QFN (7.5x7.5 mm) - same | 64-QFN (7.5x7.5 mm) - same | 64-QFN (7.5x7.5 mm) - same | 64-LQFP (different footprint) |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 176 KB | 176 KB | 176 KB | 176 KB | 176 KB |
| USB | USB 2.0 FS + PHY | USB 2.0 FS + PHY | USB 2.0 FS + PHY | USB 2.0 FS + PHY | USB 2.0 FS + PHY |
| I2S / TDM | 2 instances | 2 instances | 2 instances | 2 instances | 2 instances |
| Silicon Revision | G55 Rev A | G55 Rev A | G55 Rev B (errata-fixed) | G55 Rev B (errata-fixed) | G55 Rev A |
| Active Current | 100 uA/MHz | 100 uA/MHz | 100 uA/MHz | 100 uA/MHz | 100 uA/MHz |
Diferenciadores clave
- Integrated USB 2.0 Full-Speed PHY eliminates external PHY chip (frente a Generic Cortex-M4 MCU (e.g., STM32F401 without USB FS))
- Dual I2S/TDM interfaces for multi-channel audio (frente a Single I2S interface (typical Cortex-M4 MCU))
- picoPower technology: 100 uA/MHz active, <7 uA deep sleep (frente a Higher-power Cortex-M4 alternatives (e.g., STM32F4 at ~250 uA/MHz))
Notas de diseño
Estimated: at 120 MHz CPU active, VDDIN=3.3 V, the SAM G55 draws ~12 mA core current plus peripheral current. Add a 100 nF X7R ceramic bypass capacitor directly at each VDDIO pin and a 4.7 uF X5R bulk capacitor at the VDDIN/VDDCORE regulator output. Place ceramics within 2 mm of the supply pin traces. The integrated LDO for VDDCORE typically requires 1 uF at its output for stable regulation; consult the full datasheet for the recommended BOM.
The 64-QFN (7.5x7.5 mm) exposed pad (EP) is the thermal dissipation path and MUST be soldered to a continuous ground-plane land of at least 1:1 ratio to the EP. Use an array of thermal vias (0.3 mm drill, 0.5 mm pitch) under the EP to stitch inner ground layers. Without proper EP soldering, junction temperature rises 20-30 C above ambient at full CPU load, potentially triggering thermal shutdown.
Microchip recommends Revision B (ATSAMG55J19B) for all new designs because Revision A silicon has published errata affecting USB suspend/resume and I2S underflow handling. If you are maintaining an existing ATSAMG55J19A-MU design, review the silicon errata document before migrating firmware. The boot mode select (BMS) pin must be sampled correctly at reset for the part to enter bootloader mode; use a 100 kOhm pull-down on BMS for production.
Place the 12 MHz external crystal (or HSE oscillator) within 5 mm of the XIN/XOUT pins with symmetrical traces and a guard ground ring. The USB DP/DM traces must be routed as a 90-ohm differential pair with length matching within 2 mm, and should not cross any other signal traces. Keep the USB PHY analog ground island isolated from digital switching ground and stitch them only at the EP ground plane.
Información de cumplimiento
RoHS and lead-free per Microchip product page; AEC-Q100 not applicable (industrial-grade MCU, not automotive qualified).
