ATSAMG55J19B-MUT - 120MHz Cortex-M4 MCU, 512KB Flash | Microchip
N.º de pieza: ATSAMG55J19B-MUT ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.06 | $80,60 |
| 100 | $7.16 | $716,00 |
| 500 | $6.45 | $3.225,00 |
| 1.000 | $5.74 | $5.740,00 |
ATSAMG55J19B-MUT Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals including timers, communication interfaces, ADC/DAC blocks, and GPIOs. In the taxonomy of embedded semiconductors, the SAM G55 belongs to the Cortex-M4 family (ARMv7-M architecture with FPU and DSP) -> ARM Cortex-M microcontrollers -> 32-bit microcontrollers -> microcontrollers -> embedded processors -> semiconductors. The Cortex-M4 with FPU executes DSP algorithms (FFT, FIR, biquad filters) and audio codecs efficiently while preserving the deterministic interrupt model required for real-time audio.
Key features of the ATSAMG55J19B-MUT include the Cortex-M4 core with single-precision FPU, 512 KB Flash with single-cycle access at full speed, 176 KB SRAM, an embedded boot loader, an embedded voltage regulator for single-supply operation, power-on reset (POR), brown-out detector, watchdog timer, three on-chip RC oscillators, and a 3 to 20 MHz quartz/ceramic resonator interface. It supports USB 2.0 Full-Speed with on-chip transceiver, I2S/SSC audio interfaces, and up to 47 GPIO lines.
The architecture combines Cortex-M4 DSP extensions with audio-oriented peripherals such as an I2S/SSC controller and a Class-D amplifier-friendly PWM, optimized for headset, headphone, and portable-audio products. Active power consumption is minimized via Sleep, Deep-Sleep, and Backup modes with RTC retention, while the integrated FPU lets audio DSP work finish faster, allowing the chip to return to sleep quickly and reduce overall energy use.
Typical applications include Bluetooth/USB audio headsets, sound bars, portable speakers, hearing aids, industrial audio front-ends, voice-over-IP peripherals, and any low-power DSP audio product. The combination of Cortex-M4 DSP, ample SRAM for buffer management, and built-in audio interfaces makes the SAM G55 a strong fit for streaming-audio DSP.
When designing with this part, ensure that decoupling (100 nF + bulk) is placed as close as possible to the four VDD pins and that the exposed pad (EP) of the QFN package is soldered to a continuous ground plane for thermal dissipation and low-impedance return. Configure unused pins as inputs with pull-ups to avoid spurious interrupts during reset.
Alternativas directas para ATSAMG55J19B-MUT — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAMG55J19B-MUT (mismo factor de forma y huella) — difiere en Package, Core Architecture, Operating Temperature, Audio Interface, Core Processor.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAMG55J19B-MU
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ATSAMG55J19A-MUT
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$4.58 / unidad
Ver hoja de datos →ATSAMG55J19A-MU
✅ Sustitución directa✓ En stock
$5.42 / unidad
Ver hoja de datos →ATSAMG55J19B-AUT
✅ Sustitución directa✓ En stock
$5.42 / unidad
Ver hoja de datos →ATSAMG55J19A-AUT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ATSAMG55J19B-MUT Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-M4 with FPU (single-precision) and DSP extensions |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 176 KB |
| ROM (Boot Loader) | 8 KB |
| Tensión de alimentación | 1.62 V to 3.6 V (single supply) |
| Temperatura de funcionamiento | -40 C to +85 C (Industrial, MUT suffix) |
| Encapsulado | 64-QFN MRLB, 7.5 x 7.5 mm with exposed pad |
| GPIO Count | Up to 47 |
| USB | USB 2.0 Full-Speed Device with on-chip transceiver |
| Audio Interface | I2S / SSC (Synchronous Serial Controller) |
| Oscillators | 3 to 20 MHz crystal/ceramic resonator + 3 internal RC oscillators |
| Boot Loader | Embedded, supports Flash programming |
| Watchdog Timer | Yes |
| Power-on Reset / Brown-out Detector | Yes |
| Tipo de montaje | Surface Mount |
| Nivel MSL | MSL3 (per JEDEC J-STD-020) |
| Estado RoHS | Compliant |
Configuración de pines de ATSAMG55J19B-MUT
| Pin 1 | PA0 — GPIO / peripheral function |
| Pin 2 | PA1 — GPIO / peripheral function |
| Pin 3 | PA2 — GPIO / peripheral function |
| Pin 4 | PA3 — GPIO / peripheral function |
| Pin 5 | PA4 — GPIO / peripheral function |
| Pin 6 | PA5 — GPIO / peripheral function |
| Pin 7 | PA6 — GPIO / peripheral function |
| Pin 8 | PA7 — GPIO / peripheral function |
| Pin 9 | VDDIO — I/O supply voltage |
| Pin 10 | GND — Ground |
| Pin 11 | PB0 — GPIO / peripheral function |
| Pin 12 | PB1 — GPIO / peripheral function |
| Pin 13 | PB2 — GPIO / peripheral function |
| Pin 14 | PB3 — GPIO / peripheral function |
| Pin 15 | PB4 — GPIO / peripheral function |
| Pin 16 | PB5 — GPIO / peripheral function |
| Pin 17 | PB6 — GPIO / peripheral function |
| Pin 18 | PB7 — GPIO / peripheral function |
| Pin 19 | PB8 — GPIO / peripheral function |
| Pin 20 | PB9 — GPIO / peripheral function |
| Pin 21 | PB10 — GPIO / peripheral function |
| Pin 22 | PB11 — GPIO / peripheral function |
| Pin 23 | PB12 — GPIO / peripheral function |
| Pin 24 | PB13 — GPIO / peripheral function |
| Pin 25 | PB14 — GPIO / peripheral function |
| Pin 26 | PB15 — GPIO / peripheral function |
| Pin 27 | VDDCORE — Core supply (regulated internally) |
| Pin 28 | GND — Ground |
| Pin 29 | PC0 — GPIO / peripheral function |
| Pin 30 | PC1 — GPIO / peripheral function |
| Pin 31 | PC2 — GPIO / peripheral function |
| Pin 32 | PC3 — GPIO / peripheral function |
| Pin 33 | PC4 — GPIO / peripheral function |
| Pin 34 | PC5 — GPIO / peripheral function |
| Pin 35 | PC6 — GPIO / peripheral function |
| Pin 36 | PC7 — GPIO / peripheral function |
| Pin 37 | PC8 — GPIO / peripheral function |
| Pin 38 | PC9 — GPIO / peripheral function |
| Pin 39 | PC10 — GPIO / peripheral function |
| Pin 40 | PC11 — GPIO / peripheral function |
| Pin 41 | PC12 — GPIO / peripheral function |
| Pin 42 | PC13 — GPIO / peripheral function |
| Pin 43 | PC14 — GPIO / peripheral function |
| Pin 44 | PC15 — GPIO / peripheral function |
| Pin 45 | PD0 — GPIO / peripheral function |
| Pin 46 | PD1 — GPIO / peripheral function |
| Pin 47 | PD2 — GPIO / peripheral function |
| Pin 48 | PD3 — GPIO / peripheral function |
| Pin 49 | PD4 — GPIO / peripheral function |
| Pin 50 | PD5 — GPIO / peripheral function |
| Pin 51 | PD6 — GPIO / peripheral function |
| Pin 52 | PD7 — GPIO / peripheral function |
| Pin 53 | PD8 — GPIO / peripheral function |
| Pin 54 | PD9 — GPIO / peripheral function |
| Pin 55 | NRST — Reset input (active low) |
| Pin 56 | TDI — JTAG Test Data In |
| Pin 57 | TMS — JTAG Test Mode Select |
| Pin 58 | TCK — JTAG Test Clock |
| Pin 59 | TDO — JTAG Test Data Out |
| Pin 60 | VDDIO — I/O supply voltage |
| Pin 61 | GND — Ground |
| Pin 62 | XIN — Crystal oscillator input (3-20 MHz) |
| Pin 63 | XOUT — Crystal oscillator output |
| Pin 64 | VDDIO — I/O supply voltage |
| Pin 65 | EP — Exposed pad - thermal and ground, must be soldered to PCB ground plane |
Aplicaciones típicas
ATSAMG55J19B-MUT es adecuado para 7 aplicacións: Bluetooth / USB Audio Headsets, Portable Speakers and Sound Bars, Hearing Aids and Personal Audio Amplifiers, Voice over IP Peripherals and USB Headsets, Industrial Audio Front-Ends, Low-Power IoT Audio Edge Nodes, USB Audio Interfaces and DACs.
Bluetooth / USB Audio Headsets
The ATSAMG55J19B-MUT is purpose-built for low-power wireless audio headsets. Its Cortex-M4 with single-precision FPU executes audio DSP (FIR filters, biquad EQ, SBC / AAC decoding) at high throughput, and the 176 KB SRAM holds multiple audio buffers (e.g. 8 kHz mic capture plus 44.1 kHz playback) without external memory. The integrated I2S / SSC controller connects directly to a Bluetooth SoC's PCM/I2S port, while the on-chip USB 2.0 Full-Speed transceiver supports wired USB headsets. Compared with Cortex-M0/M3 designs, the SAM G55 finishes DSP faster and returns to Sleep more quickly, lowering total system energy per audio frame.
Recomendado
Portable Speakers and Sound Bars
Portable speakers and sound bars benefit from the ATSAMG55J19B-MUT's combination of DSP headroom, audio peripherals, and low-power modes. The Cortex-M4 with FPU runs speaker-compensation algorithms (dynamic bass boost, virtual surround) while the I2S/SSC feeds a Class-D amplifier PWM stage. At 120 MHz the device executes a full 8-band parametric EQ and limiter pipeline at <10% CPU load, leaving bandwidth for user-interface and wireless-streaming tasks. Backup mode with RTC retention reduces idle current during standby to single-digit microamps, extending battery life between charge cycles.
Recomendado
Hearing Aids and Personal Audio Amplifiers
The ATSAMG55J19B-MUT's ultra-low-power architecture suits hearing aids, where every microwatt of DSP energy matters. The Cortex-M4 with FPU runs noise-reduction, feedback-cancellation, and multiband compression filters efficiently, while Sleep and Deep-Sleep modes let the chip idle between audio frames. The 176 KB SRAM supports ring-buffer audio with low latency, and the integrated 12-bit ADC and I2S ports handle microphone and receiver chains directly. Industrial temperature grade (-40 C to +85 C) is sufficient for body-worn applications.
Recomendado
Voice over IP Peripherals and USB Headsets
VoIP peripherals and USB headsets use the ATSAMG55J19B-MUT to handle acoustic-echo-cancellation, noise-suppression, and duplex audio routing on-chip. The on-chip USB 2.0 Full-Speed Device with transceiver enumerates as a USB audio class device without an external PHY, reducing BOM cost. The 120 MHz Cortex-M4 with FPU processes AEC and NS algorithms in real time with margin, and the 176 KB SRAM holds echo-reference and voice buffers. Industrial temperature grade supports desk-phone and conference-room hardware environments.
Recomendado
Industrial Audio Front-Ends
Industrial audio front-ends (acoustic-monitoring, condition-monitoring, smart speakers in factories) benefit from the ATSAMG55J19B-MUT's industrial temperature range and DSP throughput. The Cortex-M4 with FPU runs FFT-based acoustic analysis (machine-health monitoring, anomaly detection) at audio sample rates, and the SAM G55's low-power modes suit always-on edge deployments. GPIO count (up to 47) supports multiple microphone arrays and actuator interfaces, while the integrated USB enables field firmware updates and diagnostics.
Recomendado
Low-Power IoT Audio Edge Nodes
The ATSAMG55J19B-MUT fits low-power IoT audio edge nodes (smart-home voice capture, doorbell intercoms, voice-controlled appliances) where it runs keyword-spotting and beamforming DSP at the edge. The Cortex-M4 with FPU accelerates MFCC / neural-network feature extraction, and the 176 KB SRAM supports audio ring buffers for edge analytics. The chip's multiple low-power modes let it spend most of its time in Sleep, waking only on voice activity, which is critical for battery-powered or energy-harvesting nodes.
Recomendado
USB Audio Interfaces and DACs
USB audio interfaces, headphone DACs, and USB-to-I2S bridges can use the ATSAMG55J19B-MUT as the control and DSP core. The on-chip USB 2.0 Full-Speed Device handles audio-class enumeration; the I2S / SSC feeds an external DAC; and the Cortex-M4 with FPU implements volume control, mute, sample-rate conversion, and oversampling filters. With 512 KB Flash there is headroom for USB audio class 1.0/2.0 stacks, while the 176 KB SRAM holds playback buffers and DSP state. Industrial temperature grade supports studio equipment environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAMG55J19B-MUT — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAMG55J19B-MU | ATSAMG55J19A-MUT | ATSAMG55J19A-MU | ATSAMG55J19B-AUT | ATSAMG55J19A-AUT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN MRLB (7.5x7.5 mm) | 64-QFN MRLB (7.5x7.5 mm) - same | 64-QFN MRLB (7.5x7.5 mm) - same | 64-QFN MRLB (7.5x7.5 mm) - same | 64-LQFP - different footprint | 64-LQFP - different footprint |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum CPU Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 176 KB | 176 KB | 176 KB | 176 KB | 176 KB | 176 KB |
| Silicon Revision | B | B | A | A | B | A |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| USB 2.0 FS | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) |
Diferenciadores clave
- Audio-optimized Cortex-M4 with FPU and integrated audio peripherals (frente a Generic Cortex-M4 MCU without FPU)
- Largest on-chip SRAM in SAM G55 family (176 KB) (frente a Cortex-M0+ MCUs in same price tier)
- On-chip USB 2.0 Full-Speed transceiver eliminates external PHY (frente a Cortex-M MCUs without USB)
Notas de diseño
The 64-QFN MRLB package has an exposed thermal pad (EP) that must be soldered to a continuous ground plane on the PCB. Use a 7.5x7.5 mm land pattern with at least 0.5 mm thermal via array (0.3 mm vias, 1 mm pitch) underneath the EP to provide low-impedance thermal and electrical return. Insufficient EP soldering raises junction temperature and degrades USB signal integrity. Place four 100 nF decoupling capacitors as close as possible to the four VDDIO pins and one bulk 4.7 uF within 5 mm.
The ATSAMG55J19B-MUT integrates a core voltage regulator that derives VDDCORE from VDDIO, so only a single 1.62 V to 3.6 V external supply is required. For low-noise analog peripherals (ADC, audio), add a ferrite bead or pi-filter between the digital VDDIO rail and the analog AVSS-supplied pins, and provide a clean 3.3 V LDO with <30 uVrms noise for AVCC. Backup mode with RTC retention reduces quiescent current to single-digit microamps; the VDDIO rail must remain present for RTC to function.
Do not leave the NRST pin floating - tie it to VDDIO through a 10 kohm pull-up and a 100 nF capacitor to ground for a clean POR behavior. Unused GPIO pins must be configured as inputs with internal pull-ups enabled, or as outputs driving a defined level, to prevent spurious interrupts and extra current draw. The XIN/XOUT pins require a 3-20 MHz crystal or ceramic resonator with proper load capacitors per the datasheet's Crystal Oscillator Characteristics table; incorrect loading will cause start-up failure.
For USB 2.0 Full-Speed signals (D+, D-), route the differential pair with 90-ohm differential impedance, length-matched within 2 mm, and keep the pair away from switching regulator nodes. The on-chip USB transceiver requires a 1.5 kohm pull-up on D+ (or D- for low-speed) selected by software to enumerate as Full-Speed. The I2S / SSC audio bus signals should be length-matched within 5 mm and series-terminated with 33 ohm if the cable or trace exceeds 50 mm to avoid ringing at 3.072 MHz MCLK harmonics.
Información de cumplimiento
RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free packaging. Tape-and-reel packaging qualified to JEDEC J-STD-020 MSL3 at 260 C peak reflow. Not AEC-Q100 qualified - this is a commercial/industrial grade part.
