CL05A226MQ5QUNC - 22µF 6.3V X5R MLCC 0402 | Samsung Electro-Mechanics
부품 번호: CL05A226MQ5QUNC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0.0252 | $0.03 |
| 10 | $0.023 | $0.23 |
| 100 | $0.018 | $1.80 |
| 500 | $0.0145 | $7.25 |
| 1,000 | $0.0115 | $11.50 |
| 5,000 | $0.0092 | $46.00 |
CL05A226MQ5QUNC 개요
An MLCC (multilayer ceramic capacitor) is a passive surface-mount component constructed by stacking alternating metal-electrode and ceramic-dielectric layers in a single monolithic body, then sintering and terminating the stack with nickel-barrier solder lands. The X5R dielectric is a Class-2 (mid-stability) formulation balancing volumetric efficiency against temperature and DC-bias performance; X5R sits in the ceramic capacitor family hierarchy MLCC > ceramic capacitor > capacitor > passive component, and is the standard choice for general-purpose decoupling, bulk bypass, and filtering in 5V-or-less rails.
Key features of the CL05A226MQ5QUNC include a 22 µF capacitance in the smallest common SMD case (0402), a ±20% capacitance tolerance, X5R temperature characteristic (EIA standard), nickel-barrier solder terminations with matte-tin plating for excellent solderability, and compliance with RoHS3. The terminations support reflow soldering up to 260 °C peak and the device is rated MSL 1 (unlimited floor life). According to the manufacturer datasheet, designers should evaluate capacitance behavior in the actual system because X5R capacitance varies with applied DC voltage (DC bias) and temperature.
Typical applications include bulk decoupling of low-voltage IC rails (PMIC, SoC core supplies), bypass on portable/wearable electronics, smoothing on audio codec supplies, and general-purpose filtering on 3.3V and 5V power domains. Designers using this part should derate for DC-bias losses (effective capacitance drops as DC voltage approaches rated voltage) and verify in-system ripple current. The Samsung CL series shares identical land patterns across the family, allowing flexibility to step down to 10 µF or up to 47 µF in the same 0402 footprint when the BOM or sourcing requires it.
드롭인 대체품: CL05A226MQ5QUNC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
CL05A226MP5QUNC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
CL05A226MQ5NUNC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
CL05A226KQ5QUNC
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
GRM155R60J226ME44D
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
C1005X5R0J226M050BC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
CC0402MRX5R5B226
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
CL05A226MQ5QUNC 최대 정격 & 전기적 특성
| Capacitance | 22 µF |
| Capacitance Tolerance | ±20% |
| Rated Voltage | 6.3 V |
| Dielectric (Temperature Characteristic) | X5R (EIA) |
| 패키지 / 케이스 | 0402 (1005 metric) |
| Package Dimensions | 1.0 mm × 0.5 mm |
| 실장 유형 | Surface Mount (SMD/SMT) |
| 동작 온도 범위 | -55 °C to +85 °C |
| Termination Style | Nickel barrier with matte-tin plating |
| MSL 레벨 | MSL 1 (Unlimited floor life) |
| Capacitor Class | Class 2 MLCC (mid-stability) |
| RoHS 상태 | RoHS3 Compliant |
| REACH Status | REACH Unaffected |
| Reflow Soldering Peak | 260 °C peak (compatible) |
| Application Category | General Purpose / Consumer |
| Manufacturer Series | Samsung CL series MLCC |
CL05A226MQ5QUNC 1.0 mm × 0.5 mm 핀 구성 가이드
CL05A226MQ5QUNC(1.0 mm × 0.5 mm 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: CL05A226MQ5QUNC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
CL05A226MQ5QUNC 적합 용도: 6 애플리케이션s: Smartphone SoC Power Decoupling, Wearable Device Battery Rail Filtering, Audio Codec Power Supply Bypass, IoT Sensor Module Power Conditioning, PMIC Output Bulk Capacitor, USB Type-C VBUS Local Decoupling.
Smartphone SoC Power Decoupling
The CL05A226MQ5QUNC is well suited as a bulk decoupling capacitor on smartphone SoC power rails operating at 3.3V to 5V. With 22 µF nominal capacitance in the ultra-compact 0402 case, it provides a local reservoir of charge adjacent to the SoC power pins, suppressing instantaneous voltage droops when core logic blocks switch. The X5R dielectric maintains ±15% capacitance variation from -55 °C to +85 °C, which covers typical handset thermal environments. Place one CL05A226MQ5QUNC per SoC supply domain plus smaller 100 nF MLCCs in parallel for high-frequency decoupling; the X5R part will handle bulk transients while the smaller caps handle >10 MHz switching noise.
추천
Wearable Device Battery Rail Filtering
Battery-powered wearables such as fitness bands and smartwatches benefit from the CL05A226MQ5QUNC's 0402 footprint that fits within space-constrained PCBs while delivering 22 µF of bulk capacitance. The 6.3V rated voltage comfortably derates for 3.7V Li-ion battery rails, and the X5R temperature characteristic ensures stable performance against body-worn thermal swings. Place this MLCC at the output of LDO regulators that supply low-power MCUs, BLE radios, and sensor hubs. Its sub-10 mΩ ESR at audio frequencies reduces output ripple to negligible levels, keeping noise-sensitive analog front-ends clean.
추천
Audio Codec Power Supply Bypass
Audio codecs and DACs require clean, low-ripple supply rails to preserve signal-to-noise ratio and avoid audible artifacts. The CL05A226MQ5QUNC serves as a bulk bypass capacitor on 3.3V AVDD or 5V DVDD rails feeding audio CODECs, where its X5R dielectric provides low ESR (<10 mΩ at 1 kHz to 100 kHz) and high capacitance density. Combined with smaller 100 nF and 1 nF MLCCs in parallel, it suppresses both low-frequency supply ripple and high-frequency switching noise. Designers should account for DC-bias loss: at 3.3V applied, the effective capacitance may be 30-50% lower than the 22 µF nominal, so two parallel parts may be needed for critical audio rails.
추천
IoT Sensor Module Power Conditioning
IoT sensor modules integrating MEMS accelerometers, gyroscopes, or environmental sensors require clean, stable supply rails for accurate readings. The CL05A226MQ5QUNC provides 22 µF of bulk capacitance in a 0402 footprint, ideal for sensor module PCBs where every square millimeter matters. At 6.3V rated and operating at typical 1.8V to 3.3V sensor supply levels, the part has substantial voltage derating margin, extending long-term reliability. Combined with a 100 nF decoupling cap, it suppresses ripple from upstream DC-DC converters and minimizes cross-talk between adjacent sensor channels on shared power domains.
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PMIC Output Bulk Capacitor
Power management ICs (PMICs) that supply multiple low-voltage rails to a host SoC benefit from local bulk capacitance at each output. The CL05A226MQ5QUNC is well matched as a 22 µF / 6.3V X5R bulk capacitor at PMIC outputs of 1.0V to 5V. The 0402 footprint lets engineers place the cap directly at the PMIC output pin, minimizing parasitic inductance. Designers should pair it with a smaller 1 µF or 100 nF MLCC for high-frequency decoupling; the CL05A226MQ5QUNC handles bulk load transients while the smaller cap suppresses switching ripple from the PMIC's internal FETs.
추천
USB Type-C VBUS Local Decoupling
USB Type-C ports deliver 5V VBUS to connected devices, and the CL05A226MQ5QUNC is a compact bulk-decoupling option on the VBUS rail downstream of the source-side protection FET. At 6.3V rated voltage, it has appropriate derating margin above 5V nominal. Its 22 µF capacitance in 0402 footprint handles inrush during USB Type-C attach/detach events, providing local charge to downstream loads and reducing voltage droop. Place it close to the CC controller or VBUS switch output, and pair with an ESD protection diode for a complete USB Type-C front-end.
추천
추천 제품 요약
엔지니어링 참조 데이터: CL05A226MQ5QUNC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | CL05A226MP5QUNC | CL05A226MQ5NUNC | GRM155R60J226ME44D | C1005X5R0J226M050BC | CC0402MRX5R5B226 |
|---|---|---|---|---|---|---|
| Brand | Samsung Electro-Mechanics | Samsung Electro-Mechanics | Samsung Electro-Mechanics | Murata Manufacturing | TDK | YAGEO |
| Package | 0402 (1005 metric) | 0402 (1005 metric) | 0402 (1005 metric) | 0402 (1005 metric) | 0402 (1005 metric) | 0402 (1005 metric) |
| Capacitance | 22 µF | 22 µF | 22 µF | 22 µF | 22 µF | 22 µF |
| Rated Voltage | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V |
| Capacitance Tolerance | ±20% | ±20% | ±20% | ±20% | ±20% | ±20% |
| Dielectric | X5R | X5R | X5R | X5R | X5R | X5R |
| Operating Temperature | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C |
| RoHS Compliance | RoHS3 Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant |
주요 차별점
- Industry-standard 22µF 6.3V X5R 0402 with multi-source second-source ecosystem (vs GRM155R60J226ME44D (Murata))
- RoHS3 and REACH unaffected for global market compliance (vs C1005X5R0J226M050BC (TDK))
- MSL 1 unlimited floor-life simplifies handling (vs CC0402MRX5R5B226 (YAGEO))
설계 노트
The CL05A226MQ5QUNC is a 0402 (1005 metric) MLCC requiring a land pattern of approximately 0.5 mm × (0.5 to 0.6 mm) per pad with a 0.4 mm solder-gap. Use NSMD (non-solder mask defined) pads for better solder-joint reliability on small ceramic components. Place the cap as close as physically possible to the IC power pin it decouples - trace length above 1 mm adds parasitic inductance that defeats the purpose of a bulk decoupling cap. For multi-layer boards, place at least one via-in-pad or two adjacent vias to the inner ground/power plane to minimize loop inductance.
X5R MLCCs exhibit significant DC-bias capacitance loss. The CL05A226MQ5QUNC at 22 µF nominal may drop to roughly 30-50% of that value (7-11 µF effective) when 5V DC is applied. Designers must verify in-system capacitance with the actual rail voltage, not the open-circuit nominal. Always check the manufacturer's DC-bias curve for the specific part family before committing to a single part for a tight-ripple design. For 3.3V rails or below, DC-bias loss is much smaller and the part delivers close to its rated capacitance.
MLCCs are sensitive to mechanical flex because the ceramic dielectric cracks under board strain. The CL05A226MQ5QUNC 0402 body has no flex mitigation beyond the standard PCB design rules. Place the part away from high-strain areas such as board edges, screw mounting points, and connector keep-out zones. Do not place large ceramic-only MLCCs directly under a BGA package that experiences CTE mismatch with the PCB during thermal cycling - the resulting shear stress can crack the MLCC. Distribute multiple smaller caps rather than relying on one large one when board flex is a concern.
규정 준수 정보
RoHS3 Compliant and REACH Unaffected per manufacturer product page (PartGenie aggregation of Samsung Electro-Mechanics data). AEC-Q100 is not applicable - this is a passive component, not an active semiconductor. Halogen-free status and conflict-minerals compliance not stated in the verified data; set to 'unknown' rather than guess.
