DSPIC33EP256GM710-H/PF - 70 MIPS 16-Bit DSC 256KB Flash | Microchip
N.º de pieza: DSPIC33EP256GM710-H/PF ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.12 | $8,12 |
| 10 | $7.35 | $73,50 |
| 100 | $6.55 | $655,00 |
| 500 | $5.9 | $2.950,00 |
| 1.000 | $5.25 | $5.250,00 |
DSPIC33EP256GM710-H/PF Descripción general
A digital signal controller is a hybrid class of semiconductor that merges the compute architecture of a microcontroller unit (MCU) with the math acceleration of a digital signal processor (DSP). In the power-management hierarchy, the dsPIC33EP series sits above simple 8-bit MCUs and competes directly with 32-bit MCUs in real-time control applications such as motor control, digital power conversion, and embedded sensing, where deterministic single-cycle DSP multiply-accumulate operations matter more than raw clock speed.
Key features include the 70 MIPS dsPIC DSC core built on a Harvard architecture with a 16-bit data path and 24-bit instruction words, 256KB of self-programmable Flash for code and data EEPROM emulation, an integrated high-speed PWM module suite for motor and power conversion, dual operational amplifiers, advanced analog peripherals, four Quadrature Encoder Interface (QEI) inputs, and Peripheral Pin Select (PPS) that remaps digital peripherals onto flexible RPn pins to ease board routing.
Technically, the GM710 variant uses the dsPIC33EP enhanced core with hardware DSP support including single-cycle MAC, modulo and bit-reversed addressing, and a dual-VDD core/regulator architecture operating from a 3.3V rail. The H suffix denotes a maximum ambient rating of 150C versus 85C for the standard I grade, which matters in under-hood and industrial-oven environments.
Typical applications include precision BLDC and PMSM motor control in automotive and industrial drives, digital power supplies such as LLC and PFC stages, solar inverters, and high-temperature industrial sensing nodes.
Design consideration: the PF 100-pin TQFP differs in body thickness and thermal characteristics from the PT 12x12 TQFP variant - always confirm footprint drawings before PCB layout.
This page synthesizes distributor availability, drop-in same-family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Alternativas directas para DSPIC33EP256GM710-H/PF — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP256GM710-H/PF (mismo factor de forma y huella) — difiere en Package, Program Memory Size, Core, RAM Size, CAN Modules.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP256GM710-H/PT
✅ Sustitución directa✓ En stock
$6.35 / unidad
Ver hoja de datos →DSPIC33EP256GM710-I/PF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP256GM710-I/PT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP256GM710-E/PF
✅ Sustitución directa✓ En stock
$5.75 / unidad
Ver hoja de datos →DSPIC33EP128GM710-H/PF
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.9 / unidad
Ver hoja de datos →DSPIC33EP256GM710-H/PF Valores máximos y características eléctricas
| Core Processor | dsPIC 33E (dsPIC DSC) |
| Core Size | 16-bit |
| Architecture | Harvard (dsPIC) |
| CPU Speed | 70 MIPS |
| Program Memory Size | 256KB Flash |
| Program Memory Type | FLASH |
| RAM Size | 16KB |
| Tensión de alimentación | 3.3 V |
| Temperatura de funcionamiento | -40C to +150C |
| Qualification | Automotive, AEC-Q100 |
| Encapsulado | 100-TQFP |
| Recuento de pines | 100 |
| Tipo de montaje | Surface Mount |
| Quadrature Encoder Interfaces | 4 (QEI) |
| On-Chip Op Amps | 2 |
| Peripherals | High-Speed PWM, IC/OC, QEI, Op Amps, Peripheral Pin Select |
Guía de configuración de pines de DSPIC33EP256GM710-H/PF 100-tqfp
Configuración de pines para DSPIC33EP256GM710-H/PF (encapsulado 100-tqfp). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP256GM710-H/PF.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP256GM710-H/PF es adecuado para 6 aplicacións: Precision BLDC/PMSM Motor Control, Digital Power Conversion (PFC/LLC), Solar Inverters and Renewable Energy Converters, Industrial Automation and Robotics, High-Temperature Industrial Sensing, Automotive Body and Powertrain Auxiliary Modules.
Precision BLDC/PMSM Motor Control
The DSPIC33EP256GM710-H/PF is purpose-built for field-oriented control (FOC) of brushless DC and permanent-magnet synchronous motors. Its 70 MIPS dsPIC33E core executes single-cycle 16x16 MAC operations, so current-loop and speed-loop interrupt service routines complete deterministically even at high PWM carrier frequencies. Four QEI modules accept quadrature encoder feedback from multiple motors or from an encoder plus a resolver-style sensor simultaneously, while the high-speed PWM module generates complementary outputs with dead-time insertion. The AEC-Q100 qualification and -40C to +150C H grade allow deployment in under-hood actuators, pumps, and traction auxiliaries where consumer-grade MCUs fail. A typical FOC design uses one QEI plus two op amps for shunt-based phase-current sensing, leaving peripheral headroom for a second drive axis on the same 100-pin device.
Recomendado
Digital Power Conversion (PFC/LLC)
Digital switch-mode power supplies benefit directly from the GM710's high-speed PWM with fine edge resolution, phase-shifted topologies, and cycle-by-cycle current limiting implemented in hardware. The 70 MIPS core closes voltage and current loops with per-cycle update rates suitable for PFC and LLC stages operating at hundreds of kilohertz, and the single-cycle DSP MAC executes proportional-integral compensators without fixed-point scaling errors. The dual on-chip op amps condition shunt or current-transformer signals before the internal ADC, reducing external component count. The 3.3V rail and Peripheral Pin Select simplify interfacing with gate-driver ICs and supervisor circuits. Because the part is AEC-Q100 qualified, the same firmware platform can serve both industrial power supplies and automotive on-board charger sub-modules, consolidating code reuse across product lines.
Recomendado
Solar Inverters and Renewable Energy Converters
Grid-tied and off-grid solar converters require simultaneous MPPT tracking, inverter modulation, and safety monitoring - workloads the GM710 balances across its DSP core and peripheral set. The high-speed PWM module drives half-bridge or three-phase power stages while input-capture channels timestamp grid synchronization edges, and the 16KB RAM buffers phase-current and voltage samples for control-law computation at 70 MIPS. Peripheral Pin Select lets designers route PWM, capture, and UART (for monitoring) pins optimally for gate-driver placement, shortening critical high-current loops on the PCB. The -40C to +150C H grade suits outdoor combiner-box and string-optimizer environments with wide thermal swings. Firmware MPPT algorithms exploit the single-cycle MAC for fast perturb-and-observe or incremental-conductance calculations each control cycle.
Recomendado
Industrial Automation and Robotics
In factory automation nodes, the GM710 acts as a real-time motion and process controller: four QEI modules decode multiple encoder axes, PWM outputs drive servo amplifiers, and UART/SPI/I2C ports link to PLC-style communication modules. The Harvard architecture's deterministic execution keeps control-loop jitter low, which is essential for coordinated multi-axis motion. With 256KB Flash, firmware typically integrates protocol stacks, motion profiles, and a small HMI layer without external memory. The 100-pin package provides ample GPIO for limit switches, safety interlocks, and indicator channels, while Peripheral Pin Select adapts the same PCB to product variants via pin-map changes in software rather than hardware respins. The extended temperature range supports robotic cells near motors, drives, and heat-generating enclosures without forced-air cooling.
Recomendado
High-Temperature Industrial Sensing
The H temperature grade (-40C to +150C ambient) makes the DSPIC33EP256GM710-H/PF a strong fit for sensing and control electronics located near industrial ovens, compressors, exhaust systems, and geothermal equipment where electronics cannot be moved to a cooler zone. The on-chip op amps directly amplify signals from thermocouple front ends and pressure bridges, the 16-bit ADC front end digitizes conditioned signals, and 256KB Flash holds calibration tables and linearization curves locally. Digital communication over UART, SPI, or CAN (with an external transceiver) streams processed data to supervisory systems. Because computation is local, the sensor node can implement safety shutoffs autonomously even if the network link is lost - an important reliability property in continuous-process industries with costly downtime.
Recomendado
Automotive Body and Powertrain Auxiliary Modules
AEC-Q100 qualification plus the -40C to +150C H grade position this DSC for automotive auxiliary electronic modules: headlamp leveling, pump and fan control, throttle-by-wire actuators, and transmission sensor interfaces. The high-speed PWM module implements brushed or brushless actuator drives with hardware dead-time and fault shutdown inputs, and the four QEI modules read position sensors used in throttle, pedal, and seat-position feedback. The 3.3V core integrates with standard automotive 5V-clamped I/O strategies, and the 100-pin TQFP provides the GPIO density body controllers need for lamp diagnostics and switch matrices. Using one Microchip dsPIC33 platform across multiple modules reduces calibration tooling, flash-bootloader reuse, and AUTOSAR-style integration effort for tier-one suppliers.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP256GM710-H/PF — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP256GM710-H/PT | DSPIC33EP256GM710-I/PF | DSPIC33EP256GM710-I/PT | DSPIC33EP256GM710-E/PF | DSPIC33EP128GM710-H/PF |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (PF) | 100-TQFP (PT) - same family | 100-TQFP (PF) - same | 100-TQFP (PT) - same family | 100-TQFP (PF) - same | 100-TQFP (PF) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Program Memory | 256KB Flash | 256KB Flash | 256KB Flash | 256KB Flash | 256KB Flash | 128KB Flash |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB | 16KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +150C | -40C to +150C | -40C to +85C | -40C to +85C | Extended grade | -40C to +150C |
| AEC-Q100 Automotive | Qualified | Qualified | Qualified | Qualified | Qualified (extended) | Qualified |
Diferenciadores clave
- 150C-capable H temperature grade (frente a DSPIC33EP256GM710-I/PF)
- Extended-reliability E-grade option on same footprint (frente a DSPIC33EP256GM710-E/PF)
- Four QEI modules and dual op amps (frente a DSPIC33EP256MC506-I/PT)
- Cost optimization path at half the memory (frente a DSPIC33EP128GM710-H/PF)
Notas de diseño
The dsPIC33EP family uses an internal core regulator: supply VDD with a clean 3.3V rail and place the specified low-ESR capacitor on the VDDCORE/VCAP pin exactly as required in the Microchip datasheet (70000689d). Do not substitute the VCAP capacitor with a larger or smaller value than specified - wrong capacitance causes brown-out resets during Flash erase/write operations. Decouple each VDD pin pair with 0.1uF ceramics placed within 2 mm of the pin, plus bulk 10uF per supply domain.
The PF and PT 100-pin TQFP package codes describe different package outlines; before routing, download the package outline drawing for your specific MPN suffix from the Microchip package pages and match it against your footprint. A footprint drawn for a PT 12x12 outline will not accept a PF body reliably, and vice versa. Include thermal-relief pads on the exposed die-attach area and keep gate-driver or analog traces away from the PWM output pins to minimize ground-bounce coupling into the ADC.
Configure Peripheral Pin Select (PPS) early in bring-up: many pins default to digital I/O and PWM outputs must be locked (with the PPS unlock sequence) before motor operation. Also note that the H temperature grade reaches +150C only within the derated electrical limits in the datasheet - verify Flash retention and timing specs at the maximum temperature for your exact suffix. During Flash self-write, stall the CPU pipeline by scheduling writes outside critical control-loop interrupts.
With four QEI inputs and multiple high-speed PWM outputs active, route encoder signals as short, matched pairs with series termination, and use the on-chip digital filters on QEI inputs to reject motor brush noise. Keep the ADC reference pin on a quiet analog ground island separate from the PWM power return; the dual op amps share the ADC front end, so their outputs should be routed to dedicated analog channels with RC anti-alias filters sized above your control-loop sampling rate.
Información de cumplimiento
AEC-Q100 automotive qualification and 'Automotive' classification confirmed by Hotenda and distributor listings; other environmental compliance attributes not stated in the provided data - verify on the Microchip product page.
