EP1AGX50DF780C6 - Arria GX FPGA, 50K LE, 780-FBGA | Intel
N.º de pieza: EP1AGX50DF780C6 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2.680,00 |
| 100 | $245 | $24.500,00 |
| 500 | $225 | $112.500,00 |
| 1.000 | $205 | $205.000,00 |
EP1AGX50DF780C6 Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, DSP slices, and hard IP cores such as transceivers and memory controllers, all of which can be reprogrammed post-manufacture to implement custom digital logic. FPGAs occupy the power-management IC -> programmable logic device -> semiconductor device -> integrated circuit hierarchy, sitting between fixed-function ASICs and software-driven microcontrollers in flexibility. The Arria GX family, in particular, was the first mid-range Altera/Intel family to integrate multi-gigabit transceivers and PCI Express hard IP at low cost.
Key features of the EP1AGX50DF780C6 include 50,160 logic elements arranged across 2,508 Logic Array Blocks (LABs), 2,475,072 bits of embedded RAM, embedded 18x18 multipliers for DSP operations, and high-speed serial transceivers capable of data rates up to 3.125 Gbps (Arria GX speed grade dependent). The 780-FBGA package exposes 350 general-purpose user I/Os and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O, simplifying board-level integration with DDR/DDR2 memory and a wide range of parallel peripherals.
The Arria GX architecture combines a 90 nm process technology with embedded transceiver circuitry to deliver deterministic low-latency serial I/O. The hard PCI Express x1/x4 endpoint and root-port blocks provide compliance with the PCI Express 1.0 specification, eliminating soft-logic implementation overhead and freeing fabric resources for application logic. Configuration is supported via JTAG, passive serial, or Altera fast passive parallel modes, with built-in decompression and encryption options via the enhanced configuration block.
Typical applications for the EP1AGX50DF780C6 include high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), broadcast video processing and format conversion, wireless baseband pre-processing, test and measurement instrumentation front-ends, and industrial imaging systems. The combination of mid-range logic density and integrated transceivers makes it a frequent choice for mid-volume designs that need SERDES capability without migrating to a higher-cost transceiver-rich Stratix device.
Designers should consult the Quartus II design software for synthesis, place-and-route, and timing closure; pin assignments must follow the 780-FBGA ball map carefully because multiple function multiplex options exist on many pins. Power estimation must be performed against actual utilization, since transceiver toggling, PLL usage, and clock-tree density dominate dynamic power.
This page consolidates distributor stock data, exact spec extract from the manufacturer datasheet, recommended drop-in alternatives within the Arria GX family, and practical design notes that complement the official datasheet reference material.
Alternativas directas para EP1AGX50DF780C6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1AGX50DF780C6 (mismo factor de forma y huella) — difiere en Speed Grade, Operating Temperature, Package, RoHS Status, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1AGX50DF780C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP1AGX50DF780I6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$255 / unidad
Ver hoja de datos →EP1AGX50DF780C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP1AGX35DF780C6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$199.5 / unidad
Ver hoja de datos →EP1AGX35DF780I6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$171 / unidad
Ver hoja de datos →EP1AGX50DF780C6 Valores máximos y características eléctricas
| Family | Arria GX |
| Logic Elements | 50,160 |
| Logic Array Blocks (LABs) | 2,508 |
| Embedded Memory (bits) | 2,475,072 |
| User I/O Count | 350 |
| Encapsulado | 780-pin FBGA (FineLine BGA) |
| Speed Grade | C6 |
| Temperature Grade | Commercial (0C to +85C) |
| Transceiver Data Rate (max) | Up to 3.125 Gbps |
| Hard PCI Express IP | Yes (x1/x4 endpoint and root port, PCIe 1.0) |
| Embedded Multipliers | 18x18 multipliers |
| Process Technology | 90 nm |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) |
| Supply Voltage (Core) | 1.2 V |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, PCI-X |
| Estado RoHS | Non-Compliant (per Besenchips listing - contains lead) |
Guía de configuración de pines de EP1AGX50DF780C6 780-pin fbga (fineline bga)
Configuración de pines para EP1AGX50DF780C6 (encapsulado 780-pin fbga (fineline bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1AGX50DF780C6.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1AGX50DF780C6 es adecuado para 6 aplicacións: PCI Express Protocol Bridge, Broadcast Video Processing, Wireless Baseband Pre-Processing, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Storage Area Network Controllers.
PCI Express Protocol Bridge
The EP1AGX50DF780C6 is well-matched to PCI Express bridge applications because it integrates hard PCI Express x1/x4 endpoint and root-port IP blocks compliant with the PCIe 1.0 specification. The 3.125 Gbps transceivers handle the physical layer directly, eliminating soft-logic implementation overhead and freeing fabric for protocol conversion logic. With 50,160 logic elements available, the device can implement a custom application layer plus a bridge to legacy parallel buses (PCI, local bus) in a single chip. Place the FPGA on a card edge connector with the PCIe lanes routed to the dedicated transceiver pairs, and use the embedded PCI Express hard IP block in conjunction with the Quartus II PCIe Compiler to shorten design time.
Recomendado
Broadcast Video Processing
The EP1AGX50DF780C6 is widely deployed in broadcast video format converters, scalers, and color-space conversion pipelines. The 2,475,072 bits of embedded RAM buffer multiple video lines at HD/3G-SDI rates, while the 350 user I/Os provide enough parallel bandwidth for multi-channel SDI ingestion and HDMI/DVI output. The embedded 18x18 multipliers handle FIR filters for scaling and chroma resampling in real time. A typical design drives the transceivers with HD-SDI at 1.485 Gbps or 3G-SDI at 2.97 Gbps while the FPGA fabric performs format up/down-conversion. Memory bandwidth is supported through DDR/DDR2 external interfaces connected via SSTL I/O standards.
Recomendado
Wireless Baseband Pre-Processing
The Arria GX family is suited to wireless baseband pre-processing functions such as channelization, digital up/down-conversion, and crest-factor reduction. The embedded 18x18 multipliers accelerate the FIR and polyphase filter banks commonly used in DDC/DUC, while the 50,160 logic elements provide headroom for multiple antenna paths in a single device. The 3.125 Gbps transceivers interface cleanly with common wireless backhaul standards such as CPRI and OBSAI. Connect antenna data through on-board ADCs into the FPGA, perform baseband shaping in fabric, and hand off digital samples via transceiver links to the baseband processor. Power estimation should be performed for typical utilization to confirm thermal envelope.
Recomendado
Industrial Imaging and Machine Vision
The EP1AGX50DF780C6 is a strong fit for multi-camera machine vision systems, including frame grabbers and pre-processing pipelines. The 350 user I/Os accept multiple parallel Camera Link channels, and the embedded RAM buffers full frames at gigabit rates before edge detection or pattern-matching algorithms run in fabric. The high logic count and embedded multipliers accelerate convolution kernels commonly used in vision preprocessing. The PCI Express hard IP simplifies integration with industrial PCs through standard x1 or x4 slots, eliminating the need for frame grabber host cards. Designers should leverage DDR2 external memory for frame buffering and Camera Link deserializer companion chips for input.
Recomendado
Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and signal generators leverage the EP1AGX50DF780C6's combination of high-density logic, embedded transceivers, and abundant user I/Os. Designers implement custom triggering, protocol decoding, and signal conditioning in fabric while offloading raw data capture to external DDR2 memory. The transceivers accept high-speed serial test data and recover clocks, while the parallel I/Os handle legacy parallel interfaces. Reuse of the hard PCI Express IP enables streaming captured data directly to a host PC for real-time display. Industrial temperature variants extend usability into laboratory and field environments.
Recomendado
Storage Area Network Controllers
The EP1AGX50DF780C6 is well-suited to SAS/SATA controller cards and RAID HBAs because of its multi-gigabit transceiver support and integrated PCI Express hard IP. Implement SAS expander or SATA host controller logic in the FPGA fabric, use the embedded PCIe x4 endpoint to connect to the host system, and leverage the embedded multipliers for XOR parity acceleration in RAID 5/6. The 350 user I/Os drive external SAS/SATA PHY chips, and the 2,475,072 bits of embedded RAM cache command queuing. Choose industrial temperature variants for enterprise storage chassis that require -40C to +100C operation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1AGX50DF780C6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1AGX50DF780C7N | EP1AGX50DF780I6N | EP1AGX50DF780C5N | EP1AGX35DF780C6N | EP1AGX35DF780I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 33,520 | 33,520 |
| Embedded Memory (bits) | 2,475,072 | 2,475,072 | 2,475,072 | 2,475,072 | 1,683,840 | 1,683,840 |
| User I/O | 350 | 350 | 350 | 350 | 350 | 350 |
| Speed Grade | C6 | C7 (faster) | I6 (industrial) | C5 (slower) | C6 | I6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Industrial |
| Hard PCI Express IP | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) |
| Transceiver Data Rate (max) | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
Diferenciadores clave
- Hard PCI Express x1/x4 IP block integrated on-die (frente a EP1AGX35DF780C6N (same family, lower density))
- Higher logic capacity (50,160 LE vs 33,520 LE in EP1AGX35) (frente a EP1AGX35DF780C6N)
- C6 speed grade balances performance and cost (frente a EP1AGX50DF780C7N (faster C7 grade))
- Industrial temperature variant available in same package (frente a EP1AGX50DF780I6N (industrial grade))
- Mid-range price point vs higher-end Stratix family (frente a Altera Stratix IV (higher-end family))
Notas de diseño
The EP1AGX50DF780C6 core supply is 1.2 V with multiple auxiliary rails (VCCPD, VCCPT, VCCAUX, VCCAUX_RX, VCCAUX_TX, VCCBAT). Each rail requires its own decoupling network: a 100 uF bulk capacitor near the regulator, multiple 4.7 uF and 0.1 uF ceramics placed adjacent to the supply pins on the 780-FBGA package, and a high-frequency 0.01 uF cap at each pin pair. Estimated: at 50% logic utilization with active transceivers, the device typically draws 1.5 A to 3.0 A on VCCINT (1.2 V); budget the regulator for at least 4 A to handle worst-case utilization spikes. Power sequencing must follow the manufacturer datasheet order - VCCINT before VCCPD before VCCAUX.
The 780-pin FBGA uses a 1.0 mm ball pitch, which requires 4-layer or 6-layer PCB stack-up with laser-drilled or micro-via technology. Route high-speed transceiver differential pairs with 100 ohm differential impedance and matched length (within 150 mil for 3.125 Gbps). Decoupling capacitors must be placed on the opposite side of the BGA using via-in-pad if necessary to minimize loop inductance. Reference the official Arria GX device handbook PCB layout guidelines for via pattern, antipad sizing, and ground plane stitching. Estimate: use at least 30 stitched ground vias around the BGA perimeter for return path integrity.
Transceiver channels operate up to 3.125 Gbps in C6 grade; maintain strict impedance control on the PCB and AC-couple the transmit pairs per the IBIS-AMI model recommended in the Arria GX handbook. Use the dedicated REFCLK inputs for each transceiver bank and avoid sharing reference clocks across long distances. LVDS I/O should use matched-pair routing with 100 ohm differential impedance and length-matching within 50 mil. DDR2 memory interfaces should follow the JEDEC DDR2 SSTL-18 layout with matched length on byte lanes and proper fly-by termination topology.
Common pitfalls when designing with the EP1AGX50DF780C6 include: (1) omitting the VCCBAT pin which preserves configuration RAM and must be tied to a battery or always-on supply; (2) failing to use MSEL pins correctly for the desired configuration mode (PS, FPP, AS); (3) using JTAG TCK faster than the recommended maximum when debugging; (4) ignoring the nSTATUS and CONF_DONE pin pull-up requirements during configuration; (5) assuming Cyclone V or Arria V bitstream compatibility - the Arria GX requires the legacy Quartus II toolchain, not Quartus Prime. Always validate the pin assignments against the device handbook pin-out file before PCB fabrication.
Estimated: at 85C ambient and typical utilization (50% logic + 4 active transceivers), the EP1AGX50DF780C6 dissipates approximately 5-7 W. The 780-FBGA package thermal resistance theta_JA is approximately 12 C/W with a properly designed 6-layer PCB and bottom-side thermal vias; junction temperature must remain below 125C for commercial grade. For higher-power designs with all transceivers active and high toggle rates, consider attaching a heatsink or using airflow. Industrial variants (EP1AGX50DF780I6N) extend the junction operating range to 100C, allowing higher ambient deployments but requiring the same thermal design.
Información de cumplimiento
Per Besenchips listing, EP1AGX50DF780C6 contains lead and is RoHS non-compliant. Other compliance fields not stated in the verified data; consult Intel/Altera product declaration documents directly for full REACH, halogen, and conflict-minerals status.
