EP1C20F324C8N - Cyclone FPGA 20,060 LE 324-FBGA | Intel
N.º de pieza: EP1C20F324C8N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $70.6 | $70,60 |
| 10 | $64.95 | $649,50 |
| 100 | $56.48 | $5.648,00 |
| 500 | $49.42 | $24.710,00 |
| 1.000 | $42.36 | $42.360,00 |
EP1C20F324C8N Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that can be re-programmed by the designer after manufacture. FPGAs sit between fixed-function ASICs (application-specific ICs) and general-purpose processors in the silicon hierarchy: more flexible than ASICs, far more deterministic and parallel than microcontrollers. The Cyclone family was Altera's first low-cost FPGA line, optimized for volume applications in industrial, consumer, and communications segments.
Key features of the EP1C20F324C8N include 20,060 logic elements (LEs), 2,006 LABs, 294,912 bits of on-chip RAM (approximately 36 Kbits x 36 M4K blocks + 64 Kbits x 4 M512 blocks), embedded 18x18 multipliers for DSP, up to four PLLs for clock management, and 233 user I/O supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS). The device operates from a 1.5 V core supply with separate VCCIO banks.
Typical applications for the EP1C20F324C8N include glue logic replacement, I/O expansion and bridging, video processing front-ends, industrial motor control, telecommunications line cards, and prototype ASIC emulation. Designers choose Cyclone when deterministic hardware parallelism is required at low unit cost.
When designing with this part, ensure the PCB layout uses proper BGA fan-out, four or more PCB layers, and controlled-impedance routing for LVDS/HSTL signals. The 1.5 V core and separate VCCIO rails require dedicated decoupling per the Cyclone device family handbook.
This page synthesizes distributor pricing, drop-in Cyclone and Cyclone II equivalents, and practical BGA-design notes that complement the official Altera Cyclone Device Handbook.
Alternativas directas para EP1C20F324C8N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1C20F324C8N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, Process Technology, Total RAM Bits.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1C20F324C8
✅ Sustitución directa✓ En stock
$32 / unidad
Ver hoja de datos →EP1C20F324C7N
✅ Sustitución directa✓ En stock
$56.04 / unidad
Ver hoja de datos →EP1C20F324C6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$21.75 / unidad
Ver hoja de datos →EP1C20F324C7
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$17.95 / unidad
Ver hoja de datos →EP1C12F324C8N
✅ Sustitución directa✓ En stock
$51.75 / unidad
Ver hoja de datos →EP1C6F324C8N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP1C20F324C8N Valores máximos y características eléctricas
| Series | Cyclone |
| Family | Cyclone I |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 130 nm CMOS |
| Logic Elements | 20,060 |
| Logic Array Blocks (LABs) | 2,006 |
| Total RAM Bits | 294,912 bits |
| User I/O Count | 233 |
| Encapsulado | 324-ball FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount |
| Core Voltage | 1.5 V |
| Speed Grade | C8 (commercial, -8) |
| Estado RoHS | Pb-free / RoHS compliant |
| Temperatura de funcionamiento | 0C to +85C (commercial) |
| PLL Count | 4 |
Guía de configuración de pines de EP1C20F324C8N 324-ball fbga (fineline bga)
Configuración de pines para EP1C20F324C8N (encapsulado 324-ball fbga (fineline bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1C20F324C8N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1C20F324C8N es adecuado para 6 aplicacións: Industrial Glue-Logic and I/O Expansion, Video Processing Front-End and Image Pipeline, Telecommunications Line Card Interface Logic, Motor Control and Industrial Drive Front-End, ASIC Emulation and Rapid Prototyping, Test & Measurement Instrumentation Front-End.
Industrial Glue-Logic and I/O Expansion
The EP1C20F324C8N replaces legacy CPLDs and discrete TTL/CMOS glue logic on industrial control boards. With 20,060 LEs and 233 user I/O, it consolidates counters, state machines, and bus-bridging logic into a single BGA that drops onto a 19x19 mm footprint. The 130 nm CMOS core draws low quiescent current at 1.5 V, and the commercial 0C to +85C range suits factory-floor enclosures. Unlike a microcontroller, the FPGA delivers deterministic parallel latency - critical when bridging a 16-bit parallel ADC bus to a SPI host at multi-MHz rates.
Recomendado
Video Processing Front-End and Image Pipeline
The EP1C20F324C8N's 20,060 LEs and embedded 18x18 multipliers handle video deinterlacing, color-space conversion, and scaling in entry-level broadcast or surveillance camera designs. The 4 PLLs generate the pixel clock, memory clock, and output clock from a single 27 MHz reference; 233 user I/O accept parallel ITU-R BT.656 or LVDS data streams. Designers pair the Cyclone I with an external SDRAM controller implemented in the LE fabric for line buffering. Compared to a software CPU approach, the FPGA processes one full HD frame at 60 fps within deterministic latency.
Recomendado
Telecommunications Line Card Interface Logic
In TDM/E1 or basic-rate telecom line cards, the EP1C20F324C8N serves as a programmable framer/HDB3 coder with up to 233 LVTTL/LVCMOS I/O for parallel bus aggregation. Its 294,912 bits of RAM store per-channel state and elastic buffers; the 4 PLLs synthesize E1 (2.048 MHz), T1 (1.544 MHz), and system backplane clocks. The 130 nm process gives the device ample noise margin at 3.3 V LVCMOS, important when interfacing to legacy telecom backplanes with long PCB traces.
Recomendado
Motor Control and Industrial Drive Front-End
The EP1C20F324C8N implements PWM generators, encoder decoders, and field-oriented control (FOC) preprocessing in mid-power AC induction and BLDC drives. Its 18x18 hardware multipliers compute Clarke/Park transforms and PI loops in fewer clock cycles than a microcontroller, while the 4 PLLs synthesize the PWM carrier and quadrature-encoder sampling clocks from a common 50 MHz reference. The 233 user I/O accept 3-phase gate-driver enables, hall sensors, and resolver feedback signals simultaneously, with LVDS support for high-noise immunity on long motor cables.
Recomendado
ASIC Emulation and Rapid Prototyping
Designers prototyping ASIC logic choose the EP1C20F324C8N because 20,060 LEs emulate roughly 30-40 K ASIC gates and the 294,912 bits of RAM model small register files and FIFOs. The 324-ball FBGA exposes JTAG configuration pins for in-system programming during bring-up, and the C8 speed grade supports internal fMAX around 275 MHz per the device handbook. Compared to a simulation environment, the FPGA runs real-time at full clock speed, exposing timing and interface bugs before tape-out.
Recomendado
Test & Measurement Instrumentation Front-End
Bench-top logic analyzers, protocol exercisers, and reconfigurable stimulus generators leverage the EP1C20F324C8N's 233 user I/O to drive or capture up to 200+ parallel channels at rates set by the 4 PLLs. The 294,912 bits of embedded RAM provide sample buffering, and the 18x18 multipliers implement real-time CRC and pattern-matching math. The Cyclone I's 130 nm process is robust to the wide temperature range of laboratory and field environments, and the FBGA-324 footprint keeps the design compact in modular PXI/cPCI cards.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1C20F324C8N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1C20F324C8 | EP1C20F324C7N | EP1C20F324C6N | EP1C20F324C7 | EP1C12F324C8N | EP1C6F324C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 324-ball FBGA | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 | 12,060 (-40%) | 5,980 (-70%) |
| Speed Grade | C8 | C8 | C7 (faster) | C6 (fastest) | C7 (faster) | C8 | C8 |
| Pb-free (RoHS) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (N suffix) |
| User I/O Count | 233 | 233 | 233 | 233 | 233 | 233 | 233 |
| Embedded RAM Bits | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 | 239,616 (-19%) | 92,160 (-69%) |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
Diferenciadores clave
- Highest LE density in Cyclone I FBGA-324 family (frente a EP1C12F324C8N)
- Pb-free RoHS-compliant version available in -8 speed grade (frente a EP1C20F324C8)
- Compatible -7 and -6 speed grades available for higher fMAX (frente a EP1C20F324C7N)
Notas de diseño
The EP1C20F324C8N's 324-ball FBGA (1.0 mm pitch) requires at least 4 PCB layers with solid power and ground planes directly beneath the device. Use microvia or via-in-pad technology for inner-row balls; if standard dog-bone fan-out is used, route 4 mil traces on a 0.5 mm pitch to escape the outer row, which demands 0.8 mm-pitch BGA breakout. The 19x19 mm package body keeps total board area reasonable for industrial designs.
The Cyclone I core runs from VCCINT = 1.5 V and each I/O bank from VCCIO between 1.5 V and 3.3 V. Estimate: at 50% LE utilization, expect approximately 1.5 W to 2.5 W core dissipation. Place 100 nF X7R decoupling caps on every VCCINT ball, plus four 10 uF bulk caps distributed around the package. Use a separate LDO (e.g., LT1761-1.5) to isolate VCCINT from switching-regulator noise.
The Cyclone I family is in NRND status - new designs should consider Cyclone II (90 nm) or Cyclone IV (60 nm) as modern replacements with longer lifecycle support. When migrating to EP2C20F324C8N, be aware that the bitstream format is incompatible and the Quartus II fitter settings must be regenerated. Verify JTAG chain order and TMS/TCK pull-ups before assuming a Cyclone I configuration design works on a Cyclone II board.
LVDS I/O on the EP1C20F324C8N requires 100 ohm differential termination at the receiver; the device does not include on-chip LVDS termination. For DDR-style external memory interfaces, route clock and DQS traces with matched length within +/-50 mil of the longest strobe, and use 4 mil / 8 mil microstrip on the top layer over a solid ground plane.
Información de cumplimiento
EP1C20F324C8N carries the 'N' suffix indicating Pb-free finish / RoHS compliance per Altera/Intel ordering code conventions. Commercial grade only (0C to +85C); for industrial temperature grade, look at EP1C20F324I7N. AEC-Q100 automotive qualification is not available on Cyclone I; automotive applications should consider MAX II CPLDs or Cyclone IV GX.
