EP1C20F324C8N - Cyclone FPGA 20,060 LE 324-FBGA | Intel
Teilenummer: EP1C20F324C8N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $70.6 | $70,60 |
| 10 | $64.95 | $649,50 |
| 100 | $56.48 | $5.648,00 |
| 500 | $49.42 | $24.710,00 |
| 1.000 | $42.36 | $42.360,00 |
EP1C20F324C8N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that can be re-programmed by the designer after manufacture. FPGAs sit between fixed-function ASICs (application-specific ICs) and general-purpose processors in the silicon hierarchy: more flexible than ASICs, far more deterministic and parallel than microcontrollers. The Cyclone family was Altera's first low-cost FPGA line, optimized for volume applications in industrial, consumer, and communications segments.
Key features of the EP1C20F324C8N include 20,060 logic elements (LEs), 2,006 LABs, 294,912 bits of on-chip RAM (approximately 36 Kbits x 36 M4K blocks + 64 Kbits x 4 M512 blocks), embedded 18x18 multipliers for DSP, up to four PLLs for clock management, and 233 user I/O supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS). The device operates from a 1.5 V core supply with separate VCCIO banks.
Typical applications for the EP1C20F324C8N include glue logic replacement, I/O expansion and bridging, video processing front-ends, industrial motor control, telecommunications line cards, and prototype ASIC emulation. Designers choose Cyclone when deterministic hardware parallelism is required at low unit cost.
When designing with this part, ensure the PCB layout uses proper BGA fan-out, four or more PCB layers, and controlled-impedance routing for LVDS/HSTL signals. The 1.5 V core and separate VCCIO rails require dedicated decoupling per the Cyclone device family handbook.
This page synthesizes distributor pricing, drop-in Cyclone and Cyclone II equivalents, and practical BGA-design notes that complement the official Altera Cyclone Device Handbook.
Drop-in-Alternativen für EP1C20F324C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1C20F324C8N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Process Technology, Total RAM Bits.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1C20F324C8
✅ Drop-In✓ Auf Lager
$32 / Stück
Datenblatt ansehen →EP1C20F324C7N
✅ Drop-In✓ Auf Lager
$56.04 / Stück
Datenblatt ansehen →EP1C20F324C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$21.75 / Stück
Datenblatt ansehen →EP1C20F324C7
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →EP1C12F324C8N
✅ Drop-In✓ Auf Lager
$51.75 / Stück
Datenblatt ansehen →EP1C6F324C8N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1C20F324C8N Grenzwerte & elektrische Eigenschaften
| Series | Cyclone |
| Family | Cyclone I |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 130 nm CMOS |
| Logic Elements | 20,060 |
| Logic Array Blocks (LABs) | 2,006 |
| Total RAM Bits | 294,912 bits |
| User I/O Count | 233 |
| Gehäuse | 324-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount |
| Core Voltage | 1.5 V |
| Speed Grade | C8 (commercial, -8) |
| RoHS-Status | Pb-free / RoHS compliant |
| Betriebstemperatur | 0C to +85C (commercial) |
| PLL Count | 4 |
EP1C20F324C8N 324-ball fbga (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EP1C20F324C8N (324-ball fbga (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1C20F324C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1C20F324C8N ist geeignet für 6 Anwendungs: Industrial Glue-Logic and I/O Expansion, Video Processing Front-End and Image Pipeline, Telecommunications Line Card Interface Logic, Motor Control and Industrial Drive Front-End, ASIC Emulation and Rapid Prototyping, Test & Measurement Instrumentation Front-End.
Industrial Glue-Logic and I/O Expansion
The EP1C20F324C8N replaces legacy CPLDs and discrete TTL/CMOS glue logic on industrial control boards. With 20,060 LEs and 233 user I/O, it consolidates counters, state machines, and bus-bridging logic into a single BGA that drops onto a 19x19 mm footprint. The 130 nm CMOS core draws low quiescent current at 1.5 V, and the commercial 0C to +85C range suits factory-floor enclosures. Unlike a microcontroller, the FPGA delivers deterministic parallel latency - critical when bridging a 16-bit parallel ADC bus to a SPI host at multi-MHz rates.
Empfohlen
Video Processing Front-End and Image Pipeline
The EP1C20F324C8N's 20,060 LEs and embedded 18x18 multipliers handle video deinterlacing, color-space conversion, and scaling in entry-level broadcast or surveillance camera designs. The 4 PLLs generate the pixel clock, memory clock, and output clock from a single 27 MHz reference; 233 user I/O accept parallel ITU-R BT.656 or LVDS data streams. Designers pair the Cyclone I with an external SDRAM controller implemented in the LE fabric for line buffering. Compared to a software CPU approach, the FPGA processes one full HD frame at 60 fps within deterministic latency.
Empfohlen
Telecommunications Line Card Interface Logic
In TDM/E1 or basic-rate telecom line cards, the EP1C20F324C8N serves as a programmable framer/HDB3 coder with up to 233 LVTTL/LVCMOS I/O for parallel bus aggregation. Its 294,912 bits of RAM store per-channel state and elastic buffers; the 4 PLLs synthesize E1 (2.048 MHz), T1 (1.544 MHz), and system backplane clocks. The 130 nm process gives the device ample noise margin at 3.3 V LVCMOS, important when interfacing to legacy telecom backplanes with long PCB traces.
Empfohlen
Motor Control and Industrial Drive Front-End
The EP1C20F324C8N implements PWM generators, encoder decoders, and field-oriented control (FOC) preprocessing in mid-power AC induction and BLDC drives. Its 18x18 hardware multipliers compute Clarke/Park transforms and PI loops in fewer clock cycles than a microcontroller, while the 4 PLLs synthesize the PWM carrier and quadrature-encoder sampling clocks from a common 50 MHz reference. The 233 user I/O accept 3-phase gate-driver enables, hall sensors, and resolver feedback signals simultaneously, with LVDS support for high-noise immunity on long motor cables.
Empfohlen
ASIC Emulation and Rapid Prototyping
Designers prototyping ASIC logic choose the EP1C20F324C8N because 20,060 LEs emulate roughly 30-40 K ASIC gates and the 294,912 bits of RAM model small register files and FIFOs. The 324-ball FBGA exposes JTAG configuration pins for in-system programming during bring-up, and the C8 speed grade supports internal fMAX around 275 MHz per the device handbook. Compared to a simulation environment, the FPGA runs real-time at full clock speed, exposing timing and interface bugs before tape-out.
Empfohlen
Test & Measurement Instrumentation Front-End
Bench-top logic analyzers, protocol exercisers, and reconfigurable stimulus generators leverage the EP1C20F324C8N's 233 user I/O to drive or capture up to 200+ parallel channels at rates set by the 4 PLLs. The 294,912 bits of embedded RAM provide sample buffering, and the 18x18 multipliers implement real-time CRC and pattern-matching math. The Cyclone I's 130 nm process is robust to the wide temperature range of laboratory and field environments, and the FBGA-324 footprint keeps the design compact in modular PXI/cPCI cards.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1C20F324C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1C20F324C8 | EP1C20F324C7N | EP1C20F324C6N | EP1C20F324C7 | EP1C12F324C8N | EP1C6F324C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 324-ball FBGA | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 | 12,060 (-40%) | 5,980 (-70%) |
| Speed Grade | C8 | C8 | C7 (faster) | C6 (fastest) | C7 (faster) | C8 | C8 |
| Pb-free (RoHS) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (N suffix) | No (SnPb) | Yes (N suffix) | Yes (N suffix) |
| User I/O Count | 233 | 233 | 233 | 233 | 233 | 233 | 233 |
| Embedded RAM Bits | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 | 239,616 (-19%) | 92,160 (-69%) |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
Wichtigste Unterscheidungsmerkmale
- Highest LE density in Cyclone I FBGA-324 family (vs. EP1C12F324C8N)
- Pb-free RoHS-compliant version available in -8 speed grade (vs. EP1C20F324C8)
- Compatible -7 and -6 speed grades available for higher fMAX (vs. EP1C20F324C7N)
Designhinweise
The EP1C20F324C8N's 324-ball FBGA (1.0 mm pitch) requires at least 4 PCB layers with solid power and ground planes directly beneath the device. Use microvia or via-in-pad technology for inner-row balls; if standard dog-bone fan-out is used, route 4 mil traces on a 0.5 mm pitch to escape the outer row, which demands 0.8 mm-pitch BGA breakout. The 19x19 mm package body keeps total board area reasonable for industrial designs.
The Cyclone I core runs from VCCINT = 1.5 V and each I/O bank from VCCIO between 1.5 V and 3.3 V. Estimate: at 50% LE utilization, expect approximately 1.5 W to 2.5 W core dissipation. Place 100 nF X7R decoupling caps on every VCCINT ball, plus four 10 uF bulk caps distributed around the package. Use a separate LDO (e.g., LT1761-1.5) to isolate VCCINT from switching-regulator noise.
The Cyclone I family is in NRND status - new designs should consider Cyclone II (90 nm) or Cyclone IV (60 nm) as modern replacements with longer lifecycle support. When migrating to EP2C20F324C8N, be aware that the bitstream format is incompatible and the Quartus II fitter settings must be regenerated. Verify JTAG chain order and TMS/TCK pull-ups before assuming a Cyclone I configuration design works on a Cyclone II board.
LVDS I/O on the EP1C20F324C8N requires 100 ohm differential termination at the receiver; the device does not include on-chip LVDS termination. For DDR-style external memory interfaces, route clock and DQS traces with matched length within +/-50 mil of the longest strobe, and use 4 mil / 8 mil microstrip on the top layer over a solid ground plane.
Compliance-Informationen
EP1C20F324C8N carries the 'N' suffix indicating Pb-free finish / RoHS compliance per Altera/Intel ordering code conventions. Commercial grade only (0C to +85C); for industrial temperature grade, look at EP1C20F324I7N. AEC-Q100 automotive qualification is not available on Cyclone I; automotive applications should consider MAX II CPLDs or Cyclone IV GX.
