Intel

EP1C20F324C8N - Cyclone FPGA 20,060 LE 324-FBGA | Intel

部品番号: EP1C20F324C8N ✗ 生産終了
在庫あり 1〜3営業日以内に発送
1.5 V Vdss 324-ball FBGA (FineLine BGA) Package C8 (commercial, -8) Speed
開始価格 $42.36 USD / 個
MOQ: 1 |
価格更新日: 2026-09-06
ボリューム価格
数量 単価 小計
1 $70.6 $70.60
10 $64.95 $649.50
100 $56.48 $5,648.00
500 $49.42 $24,710.00
1,000 $42.36 $42,360.00
ℹ️ すべての価格はUSDです

EP1C20F324C8N 概要

The Intel / Altera EP1C20F324C8N is a member of the original Cyclone family of Field-Programmable Gate Arrays (FPGAs) built on a 130 nm CMOS process and housed in a 324-ball FineLine BGA (FBGA-324) package. It integrates 20,060 logic elements across 2,006 logic array blocks (LABs), delivers up to 233 user I/O pins, and contains 294,912 bits of embedded RAM. The 'C8' speed grade corresponds to a -8 commercial speed rating with a maximum internal clock frequency near 275 MHz, while the 'N' suffix denotes lead-free / Pb-free termination.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that can be re-programmed by the designer after manufacture. FPGAs sit between fixed-function ASICs (application-specific ICs) and general-purpose processors in the silicon hierarchy: more flexible than ASICs, far more deterministic and parallel than microcontrollers. The Cyclone family was Altera's first low-cost FPGA line, optimized for volume applications in industrial, consumer, and communications segments.

Key features of the EP1C20F324C8N include 20,060 logic elements (LEs), 2,006 LABs, 294,912 bits of on-chip RAM (approximately 36 Kbits x 36 M4K blocks + 64 Kbits x 4 M512 blocks), embedded 18x18 multipliers for DSP, up to four PLLs for clock management, and 233 user I/O supporting multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS). The device operates from a 1.5 V core supply with separate VCCIO banks.

Typical applications for the EP1C20F324C8N include glue logic replacement, I/O expansion and bridging, video processing front-ends, industrial motor control, telecommunications line cards, and prototype ASIC emulation. Designers choose Cyclone when deterministic hardware parallelism is required at low unit cost.

When designing with this part, ensure the PCB layout uses proper BGA fan-out, four or more PCB layers, and controlled-impedance routing for LVDS/HSTL signals. The 1.5 V core and separate VCCIO rails require dedicated decoupling per the Cyclone device family handbook.

This page synthesizes distributor pricing, drop-in Cyclone and Cyclone II equivalents, and practical BGA-design notes that complement the official Altera Cyclone Device Handbook.

ドロップイン代替品: EP1C20F324C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP1C20F324C8N (同一形状・フットプリント) — 相違点: Package, Speed Grade, Operating Temperature, Process Technology, Total RAM Bits.

Altera
Package: 324-BGA (FineLine BGA), 19 mm x 19 mm, 1.0 mm pitch
Speed Grade: 8 (C8)
Operating Temperature: 0 °C to +85 °C (Commercial)
比較対象 EP1C20F324C8N →
Intel
Package: 324-BGA (FineLine BGA, 19 x 19 mm, 1.0 mm pitch)
Speed Grade: 8 (commercial)
Operating Temperature: -40C to +85C (industrial)
比較対象 EP1C20F324C8N →
Altera
Package: 324-FBGA (FineLine BGA), 19 × 19 mm, 1.0 mm pitch
Speed Grade: C6
Operating Temperature: 0 °C to +85 °C (commercial, "C" prefix)
比較対象 EP1C20F324C8N →
Intel
Package: FBGA-324 (324-BGA, 19 × 19 mm, 1.0 mm pitch)
Speed Grade: 7 (-7)
比較対象 EP1C20F324C8N →
Intel
Package: 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch)
Speed Grade: C7 (commercial)
Operating Temperature: Commercial (0C to +85C)
比較対象 EP1C20F324C8N →
Altera
Speed Grade: 8
Process Technology: 130 nm
Total RAM Bits: 294,912
比較対象 EP1C20F324C8N →
Altera
Package: 324-BGA (1.0 mm pitch, FineLine)
Speed Grade: 8 (commercial, ~320 MHz internal)
Process Technology: SRAM-based, 130 nm
比較対象 EP1C20F324C8N →
Intel
Package: 324-FBGA (19x19 mm)
Speed Grade: I7 (industrial)
Operating Temperature: -40C to +100C (TJ)
比較対象 EP1C20F324C8N →
Intel
Package: 324-pin FineLine BGA (FBGA-324), 19 × 19 mm, 1.0 mm pitch
Operating Temperature: -40 °C to +100 °C (industrial)
Process Technology: 0.13 µm CMOS
比較対象 EP1C20F324C8N →
Altera
Speed Grade: C8
Operating Temperature: 0 C to 85 C (Commercial)
比較対象 EP1C20F324C8N →
Altera
Package: 324-ball FBGA
Speed Grade: I7 (industrial)
Operating Temperature: -40C to +100C (industrial)
比較対象 EP1C20F324C8N →

クイック比較ツール — 並列比較する代替部品を選択:

EP1C20F324C8

✅ ドロップイン
Altera
📦 324-ball FBGA
EP1C20F324C8 · Cyclone I · 20,060 · 2,006 · 294,912 · 233 · 324-FBGA · 324

✓ 在庫あり

$32 / 個

データシートを見る →

EP1C20F324C7N

✅ ドロップイン
Intel
📦 324-ball FBGA
Cyclone · 20060 · 2006 · 294912 · 233 · 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch) · C7 (commercial)

✓ 在庫あり

$56.04 / 個

データシートを見る →

EP1C20F324C6N

✅ ドロップイン ⚠️ 仕様未検証
Altera
📦 324-ball FBGA
Cyclone® · Cyclone I · 20,060 · 2,006 · 294,912 (36 Kbit) · Yes (M4K + DSP blocks per datasheet) · 233 · 20,060 cells (20060 CLBs per datasheet)

✓ 在庫あり

$21.75 / 個

データシートを見る →

EP1C20F324C7

✅ ドロップイン ⚠️ 仕様未検証
Intel
📦 324-ball FBGA
Cyclone · Cyclone I (EP1C20) · 20,060 · 2,006 · 294,912 · 60 · 233 · 2

✓ 在庫あり

$17.95 / 個

データシートを見る →

EP1C12F324C8N

✅ ドロップイン
Altera
📦 324-ball FBGA
Cyclone I · 12,060 · 1,206 · 239,616 · 249 · 12 · 2

✓ 在庫あり

$51.75 / 個

データシートを見る →

EP1C6F324C8N

✅ ドロップイン
📦 324-ball FBGA
same 324-FBGA footprint; lowest density Cyclone I - 5,980 LEs vs 20,060 LEs (-70%); fits simple glue-logic only

📋 参考代替品(カタログ未掲載)

EP1C20F324C8N 最大定格&電気的特性

Series Cyclone
Family Cyclone I
Manufacturer Intel (formerly Altera)
Process Technology 130 nm CMOS
Logic Elements 20,060
Logic Array Blocks (LABs) 2,006
Total RAM Bits 294,912 bits
User I/O Count 233
パッケージ 324-ball FBGA (FineLine BGA)
実装タイプ Surface Mount
Core Voltage 1.5 V
Speed Grade C8 (commercial, -8)
RoHS ステータス Pb-free / RoHS compliant
動作温度 0C to +85C (commercial)
PLL Count 4

EP1C20F324C8N 324-ball fbga (fineline bga) ピン配置ガイド

EP1C20F324C8N (324-ball fbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP1C20F324C8N の 324-ball fbga (fineline bga) パッケージピン配置図

詳細なピン配置データはありません: EP1C20F324C8N.

詳細は データシート をご参照ください。

主な用途

EP1C20F324C8N の用途: 6 件s: Industrial Glue-Logic and I/O Expansion, Video Processing Front-End and Image Pipeline, Telecommunications Line Card Interface Logic, Motor Control and Industrial Drive Front-End, ASIC Emulation and Rapid Prototyping, Test & Measurement Instrumentation Front-End.

🏭

Industrial Glue-Logic and I/O Expansion

The EP1C20F324C8N replaces legacy CPLDs and discrete TTL/CMOS glue logic on industrial control boards. With 20,060 LEs and 233 user I/O, it consolidates counters, state machines, and bus-bridging logic into a single BGA that drops onto a 19x19 mm footprint. The 130 nm CMOS core draws low quiescent current at 1.5 V, and the commercial 0C to +85C range suits factory-floor enclosures. Unlike a microcontroller, the FPGA delivers deterministic parallel latency - critical when bridging a 16-bit parallel ADC bus to a SPI host at multi-MHz rates.

🎥

Video Processing Front-End and Image Pipeline

The EP1C20F324C8N's 20,060 LEs and embedded 18x18 multipliers handle video deinterlacing, color-space conversion, and scaling in entry-level broadcast or surveillance camera designs. The 4 PLLs generate the pixel clock, memory clock, and output clock from a single 27 MHz reference; 233 user I/O accept parallel ITU-R BT.656 or LVDS data streams. Designers pair the Cyclone I with an external SDRAM controller implemented in the LE fabric for line buffering. Compared to a software CPU approach, the FPGA processes one full HD frame at 60 fps within deterministic latency.

🌐

Telecommunications Line Card Interface Logic

In TDM/E1 or basic-rate telecom line cards, the EP1C20F324C8N serves as a programmable framer/HDB3 coder with up to 233 LVTTL/LVCMOS I/O for parallel bus aggregation. Its 294,912 bits of RAM store per-channel state and elastic buffers; the 4 PLLs synthesize E1 (2.048 MHz), T1 (1.544 MHz), and system backplane clocks. The 130 nm process gives the device ample noise margin at 3.3 V LVCMOS, important when interfacing to legacy telecom backplanes with long PCB traces.

🏭

Motor Control and Industrial Drive Front-End

The EP1C20F324C8N implements PWM generators, encoder decoders, and field-oriented control (FOC) preprocessing in mid-power AC induction and BLDC drives. Its 18x18 hardware multipliers compute Clarke/Park transforms and PI loops in fewer clock cycles than a microcontroller, while the 4 PLLs synthesize the PWM carrier and quadrature-encoder sampling clocks from a common 50 MHz reference. The 233 user I/O accept 3-phase gate-driver enables, hall sensors, and resolver feedback signals simultaneously, with LVDS support for high-noise immunity on long motor cables.

🖥️

ASIC Emulation and Rapid Prototyping

Designers prototyping ASIC logic choose the EP1C20F324C8N because 20,060 LEs emulate roughly 30-40 K ASIC gates and the 294,912 bits of RAM model small register files and FIFOs. The 324-ball FBGA exposes JTAG configuration pins for in-system programming during bring-up, and the C8 speed grade supports internal fMAX around 275 MHz per the device handbook. Compared to a simulation environment, the FPGA runs real-time at full clock speed, exposing timing and interface bugs before tape-out.

🖥️

Test & Measurement Instrumentation Front-End

Bench-top logic analyzers, protocol exercisers, and reconfigurable stimulus generators leverage the EP1C20F324C8N's 233 user I/O to drive or capture up to 200+ parallel channels at rates set by the 4 PLLs. The 294,912 bits of embedded RAM provide sample buffering, and the 18x18 multipliers implement real-time CRC and pattern-matching math. The Cyclone I's 130 nm process is robust to the wide temperature range of laboratory and field environments, and the FBGA-324 footprint keeps the design compact in modular PXI/cPCI cards.

おすすめ製品の概要

EP1C12F324C8N Altera 使用用途: Industrial Glue-Logic and I/O Expansion, Motor Control and Industrial Drive Front-End EPCQ32A Altera/Intel 32 Mbit serial configuration device for Cyclone bitstream storage 使用用途: Industrial Glue-Logic and I/O Expansion MAX811 Voltage supervisor for VCCINT 1.5 V power rail monitoring and POR reset 使用用途: Industrial Glue-Logic and I/O Expansion MT48LC16M16A2 Micron SDRAM for line-buffer frame memory 使用用途: Video Processing Front-End and Image Pipeline ADV7180 Analog Devices multi-format video decoder with ITU-R BT.656 output 使用用途: Video Processing Front-End and Image Pipeline DS2155 Dallas/Maxim single-chip T1/E1 framer for backplane serial interface 使用用途: Telecommunications Line Card Interface Logic EP2C20F324C8N Cyclone II upgrade for higher-density telecom designs (same FBGA-324 footprint) 使用用途: Telecommunications Line Card Interface Logic IRAMS10UP60A International Rectifier IPM module accepting 3.3 V logic from FPGA PWM outputs 使用用途: Motor Control and Industrial Drive Front-End EPCQ4A Altera/Intel 4 Mbit serial configuration PROM for bitstream storage 使用用途: ASIC Emulation and Rapid Prototyping MAX232 RS-232 level translator for UART-based bitstream loading during prototyping 使用用途: ASIC Emulation and Rapid Prototyping 74LVC244A Octal buffer for FPGA 3.3 V outputs driving 5 V test fixtures 使用用途: Test & Measurement Instrumentation Front-End EP1AGX20CF484C6N Intel 使用用途: Test & Measurement Instrumentation Front-End
What is the EP1C20F324C8N?
The EP1C20F324C8N is a member of the original Altera (now Intel) Cyclone family of low-cost FPGAs. According to the Cyclone device datasheet, it integrates 20,060 logic elements in a 324-ball FBGA package and is fabricated on a 130 nm CMOS process. The part is used for glue-logic, I/O expansion, and DSP-style datapath applications.
How many logic elements does EP1C20F324C8N have?
The EP1C20F324C8N contains 20,060 logic elements (LEs) organized into 2,006 Logic Array Blocks (LABs). This places it in the upper-mid density tier of the Cyclone I family, above the EP1C12 (12,060 LEs) and EP1C6 (5,980 LEs) variants, and below the larger Cyclone II devices.
What package does EP1C20F324C8N use?
The EP1C20F324C8N is housed in a 324-ball FineLine BGA (FBGA-324) package. The 'F324' segment of the MPN explicitly encodes the package code, and it provides up to 233 usable user I/O pins distributed across the BGA array.
Is EP1C20F324C8N still in production?
No. According to the latest distributor listings, EP1C20F324C8N is in Not Recommended for New Designs (NRND) status. Intel continues limited supply for legacy designs, but new projects should consider Cyclone II or Cyclone IV as modern, lower-cost replacements. As of 2026-09-06, stock remains available from independent distributors.
What is the price of EP1C20F324C8N?
The EP1C20F324C8N is priced at approximately USD 70.60 per unit at qty-1, declining to about USD 42.36 at qty-1,000, as of 2026-09-06 per Heisener and Octopart listings. Pricing reflects limited authorized distribution and NRND status; request quotes for higher volumes.
Where can I buy EP1C20F324C8N?
EP1C20F324C8N is currently available from independent distributors including Heisener and through broker channels. Per Octopart, authorized franchise inventory is limited; engineers should request authorized distributor quotes first, then qualify independent distributors for NRND supply as of 2026-09-06.
What is the lead time for EP1C20F324C8N?
Lead time for EP1C20F324C8N is approximately 3-5 business days for in-stock units from independent distributors such as Heisener, as of 2026-09-06. Authorized-distributor lead times for larger volumes may extend to several weeks because of NRND supply constraints. Bulk orders typically ship within 2-3 weeks.
What is the difference between EP1C20F324C8N and EP1C20F324C8?
The EP1C20F324C8N is the Pb-free / RoHS-compliant version of the original EP1C20F324C8. Both share the same Cyclone I die, 324-ball FBGA package, 20,060 LEs, and 233 I/O pins; only the termination finish differs. They are pin-to-pin compatible drop-in replacements for legacy designs.
What is the difference between EP1C20F324C8N and EP1C20F324C7N?
The EP1C20F324C8N uses the -8 commercial speed grade, while the EP1C20F324C7N uses the -7 (faster) speed grade. Both share the same Cyclone I die and 324-ball FBGA package; the C7 variant achieves a higher internal fMAX but the C8 variant is generally more available in NRND supply.
EP1C20F324C8N vs EP1C20F400C8N - which one should I use?
The EP1C20F324C8N provides 233 I/O in a 324-ball FBGA, while the EP1C20F400C8N provides 301 I/O in a larger 400-ball FBGA. Choose EP1C20F324C8N when 233 I/O is sufficient and the 19x19 mm FBGA-324 footprint is already on your PCB; choose EP1C20F400C8N when you need additional I/O and can accommodate the larger 21x21 mm FBGA-400.
What is the best drop-in replacement for EP1C20F324C8N?
The best drop-in replacement for EP1C20F324C8N is EP1C20F324C8 (same Cyclone I die, non-Pb-free version, 100% pin-compatible). For modern designs, EP2C20F324C8N from the Cyclone II family is a recommended upgrade with similar 18,752 LE density in the same FBGA-324 footprint, but with different internal architecture.
What is a Cyclone II equivalent for EP1C20F324C8N?
The EP2C20F324C8N from the Cyclone II family is the closest modern replacement for EP1C20F324C8N. It shares the FBGA-324 footprint and offers 18,752 logic elements, 239 user I/O, and 90 nm process technology. The Cyclone II uses a different bitstream and Quartus II device programming, so firmware must be re-synthesized.
How do I download the EP1C20F324C8N datasheet PDF?
The official Cyclone device datasheet for EP1C20F324C8N is published as the Cyclone Device Family datasheet and the Cyclone Device Handbook, available from the Altera/Intel website (literature number CYCLONE-DS). A consolidated 94-page PDF mirror is also available at alldatasheet.com under the EP1C20F324C8N entry.
Where can I find the EP1C20F324C8N pinout?
The EP1C20F324C8N pinout is defined in the Cyclone Device Handbook Pin Information section and the FBGA-324 mechanical drawing. The pinout distinguishes 4 PLL clock pins, JTAG configuration pins, configuration bank pins (MSEL), and 233 user I/O distributed across I/O banks 1-8.
What are the key specifications of EP1C20F324C8N that engineers should know?
Key specifications for the EP1C20F324C8N are: 20,060 logic elements (LEs) across 2,006 LABs, 294,912 bits of on-chip RAM, 233 user I/O, 4 PLLs, 130 nm process, 1.5 V core supply, FBGA-324 package, C8 commercial speed grade (fMAX approximately 275 MHz), and 0C to +85C operating range. The part is NRND as of 2026-09-06.

エンジニアリング参考データ: EP1C20F324C8N — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose EP1C20F324C8N when you need the highest density (20,060 LEs) in the Cyclone I family and the design is bound to the 324-ball FBGA footprint with Pb-free / RoHS-compliant termination. Choose EP1C20F324C8 if you have legacy SnPb manufacturing requirements; the die and pinout are identical. Choose EP1C20F324C7N when timing margin is critical and you can accept the -7 speed grade cost premium. For new designs, prefer EP2C20F324C8N (Cyclone II, 90 nm, longer lifecycle) over any Cyclone I variant, accepting that the bitstream must be re-synthesized. Avoid cross-package substitutes (e.g. EP1C20F400C8N) because the 400-ball FBGA footprint requires PCB rework.

代替品との比較

パラメータ この製品 EP1C20F324C8 EP1C20F324C7N EP1C20F324C6N EP1C20F324C7 EP1C12F324C8N EP1C6F324C8N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 324-ball FBGA 324-ball FBGA - same 324-ball FBGA - same 324-ball FBGA - same 324-ball FBGA - same 324-ball FBGA - same 324-ball FBGA - same
Logic Elements 20,060 20,060 20,060 20,060 20,060 12,060 (-40%) 5,980 (-70%)
Speed Grade C8 C8 C7 (faster) C6 (fastest) C7 (faster) C8 C8
Pb-free (RoHS) Yes (N suffix) No (SnPb) Yes (N suffix) Yes (N suffix) No (SnPb) Yes (N suffix) Yes (N suffix)
User I/O Count 233 233 233 233 233 233 233
Embedded RAM Bits 294,912 294,912 294,912 294,912 294,912 239,616 (-19%) 92,160 (-69%)
Process Technology 130 nm 130 nm 130 nm 130 nm 130 nm 130 nm 130 nm

主な差別化要因

  • Highest LE density in Cyclone I FBGA-324 family (vs EP1C12F324C8N)
  • Pb-free RoHS-compliant version available in -8 speed grade (vs EP1C20F324C8)
  • Compatible -7 and -6 speed grades available for higher fMAX (vs EP1C20F324C7N)

設計ノート

The EP1C20F324C8N's 324-ball FBGA (1.0 mm pitch) requires at least 4 PCB layers with solid power and ground planes directly beneath the device. Use microvia or via-in-pad technology for inner-row balls; if standard dog-bone fan-out is used, route 4 mil traces on a 0.5 mm pitch to escape the outer row, which demands 0.8 mm-pitch BGA breakout. The 19x19 mm package body keeps total board area reasonable for industrial designs.

The Cyclone I core runs from VCCINT = 1.5 V and each I/O bank from VCCIO between 1.5 V and 3.3 V. Estimate: at 50% LE utilization, expect approximately 1.5 W to 2.5 W core dissipation. Place 100 nF X7R decoupling caps on every VCCINT ball, plus four 10 uF bulk caps distributed around the package. Use a separate LDO (e.g., LT1761-1.5) to isolate VCCINT from switching-regulator noise.

The Cyclone I family is in NRND status - new designs should consider Cyclone II (90 nm) or Cyclone IV (60 nm) as modern replacements with longer lifecycle support. When migrating to EP2C20F324C8N, be aware that the bitstream format is incompatible and the Quartus II fitter settings must be regenerated. Verify JTAG chain order and TMS/TCK pull-ups before assuming a Cyclone I configuration design works on a Cyclone II board.

LVDS I/O on the EP1C20F324C8N requires 100 ohm differential termination at the receiver; the device does not include on-chip LVDS termination. For DDR-style external memory interfaces, route clock and DQS traces with matched length within +/-50 mil of the longest strobe, and use 4 mil / 8 mil microstrip on the top layer over a solid ground plane.

コンプライアンス情報

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Unknown

EP1C20F324C8N carries the 'N' suffix indicating Pb-free finish / RoHS compliance per Altera/Intel ordering code conventions. Commercial grade only (0C to +85C); for industrial temperature grade, look at EP1C20F324I7N. AEC-Q100 automotive qualification is not available on Cyclone I; automotive applications should consider MAX II CPLDs or Cyclone IV GX.

データ検証日: 2026-09-06 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

EP1C20F324C8N EP1C20F324C8N datasheet Cyclone I FPGA 20060 logic elements Altera Cyclone FBGA-324 233 I/O Intel Cyclone I NRND replacement EP1C20F324C8N vs EP2C20F324C8N EP1C20F324C8N buy price stock what is the logic element count of EP1C20F324C8N EP1C20F324C8N pinout FBGA-324 Altera Cyclone FPGA glue logic industrial EP1C20F324C8N lead time NRND Cyclone I drop-in replacement FBGA-324

関連部品&用語

Intel Altera EP1C20F324C8N Cyclone I Cyclone II FPGA Field-Programmable Gate Array logic element logic array block LAB BGA FineLine BGA 324-ball FBGA 130 nm 1.5 V LVTTL LVCMOS LVDS PLL Quartus II bitstream RoHS Pb-free AEC-Q100 JTAG NRND
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