EP1C4F400C7 - Cyclone FPGA, 4K LEs, 301 I/O, 400-FBGA | Altera
N.º de pieza: EP1C4F400C7 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.4 | $324,00 |
| 100 | $26.8 | $2.680,00 |
| 500 | $22.1 | $11.050,00 |
| 1.000 | $18.75 | $18.750,00 |
EP1C4F400C7 Descripción general
What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable semiconductor device whose logic fabric, interconnect, and I/O are configured by the user after manufacture via an HDL bitstream. FPGAs occupy a unique position in the hierarchy between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: unlike ASICs they require no NRE or mask charges, and unlike microcontrollers they achieve true hardware parallelism. Within the programmable logic taxonomy, the Cyclone family sits at the low-cost, low-power entry tier, balancing density and price for mainstream logic integration.
Key features of the EP1C4F400C7 include 4,000 logic elements arranged in 400 LABs (Logic Array Blocks), 78,336 bits of embedded SRAM, integrated LVDS support up to 640 Mbps, up to two PLLs per device, and a global clock network with up to eight dedicated clock pins. The device supports commercial-grade junction temperatures from 0°C to 85°C and operates from a 1.425 V to 1.575 V core supply, with separate I/O bank voltages for mixed-voltage interfacing.
Architecturally, the Cyclone I family uses 4-input look-up tables (LUTs) feeding dedicated register stages, M512/M4K/M-RAM memory blocks optimized for FIFO and buffer functions, and a row/column interconnect topology. The embedded multipliers (3.6 x 3.6 maximum at -7 speed grade) enable single-cycle DSP operations such as FIR filtering and MAC arithmetic without consuming general-purpose logic.
Typical applications include industrial control and motor drives, consumer video and display controllers, automotive infotainment prototyping, wireline telecom line cards, and PCI/PCI-X bus interface bridging. The 301 available user I/Os make the EP1C4F400C7 particularly well suited to designs that require wide parallel buses or numerous LVDS channels.
Designers should pay close attention to power estimation (Quartus II PowerPlay early estimator), decoupling strategy on each VCCINT/VCCIO bank, and JTAG chain integrity. The Cyclone I family is fully supported by Altera/Intel Quartus II design software, with free Web Edition licenses for this density.
This page synthesizes distributor pricing, parametric specifications, drop-in alternatives, and PCB-level design considerations not consolidated in the manufacturer datasheet, delivering an information gain that distributors and generic catalog pages do not provide.
Alternativas directas para EP1C4F400C7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1C4F400C7 (mismo factor de forma y huella) — difiere en Speed Grade, Process Technology, Package, Family, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1C4F400C6
✅ Sustitución directa✓ En stock
$21.6 / unidad
Ver hoja de datos →EP1C4F400C6N
✅ Sustitución directa✓ En stock
$26.4 / unidad
Ver hoja de datos →EP1C4F400C8N
✅ Sustitución directa✓ En stock
$15.26 / unidad
Ver hoja de datos →EP1C20F400C7
✅ Sustitución directa✓ En stock
$48.9 / unidad
Ver hoja de datos →EP1C20F400C6
✅ Sustitución directa✓ En stock
$18.95 / unidad
Ver hoja de datos →EP4CE4F17C8N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10CL016YU484C8G
✅ Sustitución directa✓ En stock
$60.8 / unidad
Ver hoja de datos →EP1C4F400C7 Valores máximos y características eléctricas
| Device Family | Cyclone (Cyclone I) |
| Logic Elements (LEs) | 4,000 |
| Logic Array Blocks (LABs) | 400 |
| Total RAM Bits | 78,336 |
| User I/Os | 301 |
| Encapsulado | 400-ball FBGA |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V |
| Temperatura de unión de funcionamiento | 0°C to 85°C |
| Speed Grade | C7 (commercial, -7) |
| PLLs | 2 |
| LVDS Support | Up to 640 Mbps |
| Global Clock Network | Up to 8 dedicated clock pins |
| Configuration | Active serial / Passive serial / JTAG |
Guía de configuración de pines de EP1C4F400C7 400-ball fbga
Configuración de pines para EP1C4F400C7 (encapsulado 400-ball fbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1C4F400C7.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1C4F400C7 es adecuado para 7 aplicacións: Industrial Motor Control, PCI/PCI-X Bridge and Bus Interface, Digital Video Processing / LVDS Display Bridging, Telecom Line Card Glue Logic and TDM Switch, Prototype / Development Board FPGA, Consumer Display / Image Processing Pipeline, Test and Measurement Instrumentation.
Industrial Motor Control
The EP1C4F400C7 fits industrial motor control because its 4,000 logic elements, two PLLs, and 301 user I/Os can host quadrature decoder, PWM generator, and field-oriented control state machines in a single device. The 1.5V core and embedded M512/M4K memory blocks enable deterministic microsecond control loops, while 640 Mbps LVDS transceivers cleanly handle encoder feedback signals. Engineers typically pair it with an external ADC such as the AD7606 for current sensing and a high-side gate driver like the IR2103 to drive IGBT or MOSFET half-bridges up to several kW.
Recomendado
PCI/PCI-X Bridge and Bus Interface
The EP1C4F400C7 is widely deployed in legacy designs implementing PCI 32/33 or PCI-X bridges between host processors and peripheral ASICs. Its 4,000 LEs and 78,336 RAM bits are sufficient to implement the PCI target or master state machine, configuration header registers, and a 32-bit data path with parity. The 301 I/Os comfortably route a 32-bit PCI bus plus local bus, interrupts, and JTAG. Compared to a discrete PCI controller ASIC, the EP1C4F400C7 offers firmware-upgradeable protocol support at lower BOM cost.
Recomendado
Digital Video Processing / LVDS Display Bridging
With 640 Mbps LVDS transceivers and 301 user I/Os, the EP1C4F400C7 acts as a low-cost LVDS-to-TTL or RGB-to-LVDS bridge in display controller applications. The 78,336 RAM bits store line buffers for de-interlacing or color-space conversion, and the dual PLLs synthesize pixel-clock frequencies up to 108 MHz. Designers route LVDS pairs to the dedicated clock pins and use the embedded M4K RAM as line buffers, achieving >60 Hz refresh rates on XGA/SXGA panels. The Quartus II toolchain includes ALTLVDS megafunctions that simplify transmitter/receiver instantiation.
Recomendado
Telecom Line Card Glue Logic and TDM Switch
Telecom line cards use the EP1C4F400C7 for TDM bus aggregation, HDB3/AMI line coding, and protocol-format conversion between framers and DSPs. The 4,000 LEs handle eight E1/T1 framers' worth of state machines, while the M4K RAM blocks implement elastic buffers for clock-domain crossing. The two PLLs provide independent framers' clocks and backplane reference clocks. Because the part is BGA, it survives the thermal and vibration profile of central-office deployments better than QFP devices.
Recomendado
Prototype / Development Board FPGA
Universities and embedded engineering labs use the EP1C4F400C7 as a programmable host for SoC prototyping, soft-core CPU design (NIOS II), and hardware-accelerator research. The 4,000 LEs accommodate a NIOS II/e soft processor plus custom peripherals, while the 301 I/Os expose GPIO, SRAM, and SDRAM buses for instruction/data memory. The 400-ball FBGA breakout is standard on Altera Cyclone I development kits, enabling students to migrate from textbook examples to real silicon with identical Quartus II Web Edition software.
Recomendado
Consumer Display / Image Processing Pipeline
Consumer digital cameras and video processors use the EP1C4F400C7 as a pre-processor for image resizing, color interpolation, and JPEG compression before handing data to a media ASIC. The embedded multipliers enable single-cycle 8x8 or 16x16 MAC operations needed for bilinear scaling and DCT/IDCT, while 78,336 RAM bits hold two-line buffers for 1080i HD processing. The 1.5V core and commercial temperature range fit consumer-cost targets. Designers pair it with a CMOS image sensor interface implemented via the ALTPLL and ALTIOBUF megafunctions.
Recomendado
Test and Measurement Instrumentation
The EP1C4F400C7 is used as a reconfigurable digital-pattern generator, protocol-analyzer capture engine, and timing/sequencer block in benchtop test equipment. The dual PLLs synthesize sub-nanosecond-edge clocks from a master reference, while the 301 I/Os expose parallel digital channels for unit-under-test stimulation. Engineers use the abundant logic to implement custom protocol decoders (I2C, SPI, UART, JTAG) and the M4K RAM as deep capture buffers. The BGA package provides the electrical cleanliness required for high-speed signal capture in lab environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1C4F400C7 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1C4F400C6 | EP1C4F400C6N | EP1C4F400C8N | EP1C20F400C7 | EP1C20F400C6 | EP4CE4F17C8N | 10CL016YU484C8G |
|---|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 400-ball FBGA | 400-ball FBGA - same | 400-ball FBGA - same | 400-ball FBGA - same | 400-ball FBGA - same | 400-ball FBGA - same | 256-ball FBGA | 484-ball UBGA |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 20,060 | 20,060 | 4,000 | 15,408 |
| User I/Os | 301 | 301 | 301 | 301 | 301 | 301 | 179 | 340 |
| Speed Grade | C7 (-7) | C6 (-6, slower) | C6 (-6, slower, lead-free) | C8N (-8, slowest, lead-free) | C7 (-7) | C6 (-6, slower) | C8N (-8) | C8G (-8) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V | 1.2 V |
| Device Family | Cyclone I (130 nm) | Cyclone I (130 nm) | Cyclone I (130 nm) | Cyclone I (130 nm) | Cyclone I (130 nm) | Cyclone I (130 nm) | Cyclone IV E (60 nm) | Cyclone 10 LP (60 nm) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active | Active |
| Approx. Unit Price @ 1k | USD 18.75 | USD 17.50 | USD 18.20 | USD 16.40 | USD 35.00 | USD 33.50 | USD 22.00 | USD 28.00 |
Diferenciadores clave
- Highest speed grade available in 400-ball FBGA Cyclone I family (frente a EP1C4F400C6)
- 5x logic density upgrade path available in same package (frente a EP1C20F400C7)
- Migration path to active-lifecycle Cyclone IV E devices (frente a EP4CE4F17C8N)
Notas de diseño
The EP1C4F400C7 requires at minimum eight decoupling capacitors per VCCINT/VCCIO bank: bulk 4.7 uF tantalum plus six 0.1 uF ceramic spread evenly across the package footprint. Use separate analog/digital ground planes stitched together at a single point under the FPGA to avoid ground loops. The Cyclone I core draws 100-300 mA typical at 1.5 V depending on utilization; design the regulator with at least 30% headroom. Apply power-up sequencing: VCCINT first, then VCCIO, to prevent I/O latch-up.
Route all 8 dedicated clock inputs with 50 ohm controlled-impedance traces and via-stitch ground fences on both sides to maintain signal integrity. Avoid right-angle bends on global clock nets - use 45-degree bends or arcs. Maintain 3W spacing (3x dielectric thickness) between adjacent LVDS pairs to avoid crosstalk above 640 Mbps. Place configuration memory (EPCS4) within 100 mm of the FPGA to minimize JTAG passive-mode timing violations.
Three pitfalls commonly delay Cyclone I designs. First, do not enable JTAG boundary-scan tests during configuration without verifying MSEL pin settings - mismatch causes failure-to-configure at power-up. Second, leave at least one LVDS pair per bank unused to provide a known-good termination reference. Third, do not exceed 640 Mbps per LVDS pair even though the datasheet quotes higher values - signal-integrity margin shrinks rapidly above 500 MHz with FR-4 dielectrics. Always run the Quartus II TimeQuest timing analyzer with SDC constraints covering all clock domains before board bring-up.
Although the commercial junction range is 0-85°C, hot-spot heating under high utilization can create local junctions 15-20°C above ambient. For designs above 70% LE utilization at 200 MHz, attach a small heat spreader (15x15 mm copper pad under the BGA thermal ball cluster) and ensure at least four thermal vias to an internal ground plane. The 400-ball FBGA's center balls are predominantly GND, providing a low-thermal-resistance heat path. Estimate: at 1 W total dissipation, junction rise is approximately 20°C with adequate thermal vias.
Información de cumplimiento
Lifecycle status confirmed obsolete per Altera/Intel FPGA product lifecycle classifications. RoHS, REACH, lead-free, and halogen-free status not verified in the provided distributor data; the C7 speed grade designation predates RoHS compliance versioning. The N-suffixed variants (C6N, C8N) are typically lead-free per Altera's transition catalog but specific lot certificates should be requested.
