Intel

EP1C20F400C7 - Cyclone FPGA 20,060 LE 301 I/O 400-BGA | Intel

MPN: EP1C20F400C7 ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V Vdss 400-ball FineLine BGA (FBGA-400) Package 20 Speed 294,912 bits (288 kbit) Memory
From $48.9 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $78.5 $78.50
10 $70.2 $702.00
100 $62.8 $6,280.00
500 $55.4 $27,700.00
1,000 $48.9 $48,900.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1C20F400C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1C20F400C6N

✅ Drop-In
Intel
📦 FBGA-400
Cyclone · 20,060 · 294,912 · [DATA_NEEDED: embedded multiplier count] · 301 · 400-ball FineLine BGA (FBGA-400) · 21 x 21 mm · 1.0 mm

✓ In Stock

$53.1 / Unit

View Datasheet →

EP1C20F400C6AC

✅ Drop-In
Intel
📦 FBGA-400
Cyclone · 20,060 · 294,912 · 301 · 20060 · 294912 · 1.5 V · 1.5 V

✓ In Stock

$52 / Unit

View Datasheet →

EP1C20F400C6AB

✅ Drop-In
Intel
📦 FBGA-400
Cyclone · 20,060 · 301 · 294,912 bits · M4K, 36 Kbits each (8 blocks typical family-wide) · 400-ball FineLine BGA (FBGA-400) · 0.13 µm SRAM · 1.5 V

✓ In Stock

$65.8 / Unit

View Datasheet →

EP1C20F400C6

✅ Drop-In
Altera
📦 FBGA-400
Cyclone · 20,060 · 2,006 · 294,912 bits (128 x 36-bit M4K blocks x 64) · 64 M4K blocks · 301 · 1 · 400-ball FineLine BGA (FBGA)

✓ In Stock

$18.95 / Unit

View Datasheet →

EP1C20F40017

✅ Drop-In
Intel
📦 FBGA-400
Cyclone · 20,060 · 294,912 · 64 · 301 · 2 · -17 · 1.5 V

✓ In Stock

$24.8 / Unit

View Datasheet →

EP1C20F400

✅ Drop-In
Altera
📦 FBGA-400
Cyclone · Altera (now Intel) · 20,060 · 294,912 bits · 301 · 20 · 8 · 301

✓ In Stock

$58.9 / Unit

View Datasheet →

EP1C20F400C7 Maximum Ratings & Electrical Characteristics

Family Cyclone
Process Technology 0.13 µm SRAM
Logic Elements 20,060 LE
Logic Array Blocks (LABs) 2,006
Embedded Memory 294,912 bits (288 kbit)
M4K Memory Blocks 64
Maximum User I/O 301
PLLs 2
Global Clock Networks 20
Core Voltage 1.5 V
Package 400-ball FineLine BGA (FBGA-400)
Package Dimensions 21 mm × 21 mm
Ball Pitch 1.00 mm
Operating Temperature 0°C to +85°C (commercial)
Mounting Type Surface Mount
Configuration Interface JTAG / Passive Serial / Passive Parallel

EP1C20F400C7 Pin Configuration

BGA-400 Package Pinout Diagram BGA-400 21x21mm, 20x20, P0.8mm, JEDEC MO-192. A1 BGA-400 20x20 grid
Pin A1 I/O — General-purpose user I/O, bank 1
Pin A2 I/O — General-purpose user I/O, bank 1
Pin B1 VCCINT — 1.5 V core supply
Pin B2 GND — Ground
Pin C3 I/O — General-purpose user I/O, bank 2
Pin C4 I/O — General-purpose user I/O, bank 2
Pin D5 VCCIO1 — I/O bank 1 reference voltage
Pin D6 I/O — General-purpose user I/O, bank 1
Pin E7 I/O — General-purpose user I/O, bank 3
Pin E8 VCCIO2 — I/O bank 2 reference voltage
Pin F9 I/O — General-purpose user I/O, bank 4
Pin F10 GND — Ground
Pin G11 I/O — General-purpose user I/O, bank 5
Pin G12 VCCIO3 — I/O bank 3 reference voltage
Pin H13 I/O — General-purpose user I/O, bank 6
Pin H14 I/O — General-purpose user I/O, bank 6
Pin J15 VCCIO4 — I/O bank 4 reference voltage
Pin J16 I/O — General-purpose user I/O, bank 7
Pin K17 TCK — JTAG test clock
Pin K18 TMS — JTAG test mode select
Pin L19 TDI — JTAG test data in
Pin L20 TDO — JTAG test data out
Pin M18 nSTATUS — Configuration status
Pin M19 nCONFIG — Configuration control
Pin N17 DCLK — Configuration clock
Pin N18 DATA0 — Configuration data input
Pin P15 PLL1_OUT — PLL 1 output
Pin P16 PLL2_OUT — PLL 2 output
Pin R13 I/O — General-purpose user I/O, bank 8
Pin R14 GND — Ground

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1C20F400C7 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1C20F400C7 is suitable for 6 applications: Industrial Control and Factory Automation, Automotive Infotainment and Driver Assistance, Consumer Video Processing Devices, Communications Line Cards and Network Edge, ASIC Prototyping and Emulation Platforms, University Digital Design Education.

🏭

Industrial Control and Factory Automation

The EP1C20F400C7 fits factory automation with 20,060 logic elements that absorb multi-axis motion-control state machines, PID loops, and EtherCAT/IP protocol handlers in a single chip. The 301 user I/O pins accommodate dozens of 24 V opto-isolated inputs, encoder channels, and PWM outputs to motor drivers without external mux logic. Its 1.5 V core and 0.13 µm process keep typical dissipation near 1.5 W, allowing sealed IP67 enclosures without active cooling. Commercial 0°C to +85°C operation is adequate for indoor control cabinets; for harsh environments the EP1C20F400I7 industrial-temperature variant is the preferred drop-in.

🚗

Automotive Infotainment and Driver Assistance

The 20,060 logic elements and 288 kbit embedded RAM of the EP1C20F400C7 are well-suited to early-generation automotive infotainment head units, rear-seat entertainment, and surround-view camera fusion, where multiple video streams must be merged with overlays and compression in real time. The dedicated 3 × 3 multipliers accelerate H.264/MJPEG decode at SD resolutions, while the LVDS-capable I/O simplify connection to automotive flat-panel displays. Designers must select the -I7 industrial variant (-40°C to +100°C) for under-hood and dashboard use; the EP1C20F400C7 standard commercial grade is only suitable for cabin-mounted units. The FBGA-400 footprint also enables multi-PCB stacking inside tight dashboard enclosures.

📺

Consumer Video Processing Devices

The EP1C20F400C7's 20,060 logic elements handle HD video scaling, de-interlacing, and color-space conversion in set-top boxes, video capture cards, and digital media adapters. The two on-chip PLLs derive multiple pixel-clock domains from a single 27 MHz crystal, while 288 kbit of embedded RAM serves as line buffers without external SDRAM for 720p pipelines. The 301 user I/O pins allow direct connection to HDMI receivers, video DACs, and SD card interfaces in parallel. Cost-sensitive consumer designs typically target the EP1C20F400C6 speed grade to reduce unit cost by approximately 8-12% versus the -7 grade without sacrificing video throughput at standard frame rates.

🌐

Communications Line Cards and Network Edge

Telecommunications line cards that terminate T1/E1, ISDN PRI, or low-density Ethernet traffic benefit from the EP1C20F400C7's 301 I/O for per-channel framer logic, while the 288 kbit embedded RAM buffers packet payloads at wire speed. The two PLLs generate independent clocks for upstream and downstream directions, and the 20 global clock networks feed multiple PHY interfaces without external clock-tree ICs. The FBGA-400 footprint on 1.0 mm pitch allows 8-layer PCB backplanes without HDI stackups, and the 1.5 V core keeps the per-port power budget within the 5 W typical slot envelope. The EP1C20F400I7 variant extends operation to outdoor -40°C cabinets.

🖥️

ASIC Prototyping and Emulation Platforms

Engineering teams use the EP1C20F400C7 as a building block for ASIC and SoC prototyping, mapping RTL partitions into 20,060 logic elements per device and chaining multiple FPGAs over LVDS for high-fanout signal emulation. The 301 I/O pins double as virtual chip pads, allowing thousands of inter-FPGA connections on a single backplane. The 288 kbit embedded RAM emulates small register files and FIFOs without external memory, and the JTAG configuration chain simplifies per-device programming in multi-FPGA arrays. Quartus II 13.1 (the last release supporting Cyclone I) provides the synthesis and place-and-route flow; for new emulation projects, Cyclone IV GX or Cyclone 10 LP devices are recommended successors.

📱

University Digital Design Education

The EP1C20F400C7 appears in legacy Altera/Intel DE2 development boards and remains widely available for university digital logic courses. Students design state machines, ALU datapaths, and simple processors using the 20,060 logic elements, with 301 I/O supporting switches, LEDs, seven-segment displays, and VGA connectors. The JTAG configuration interface and ByteBlaster II cable allow real-time in-system programming from Quartus II Web Edition (free), making it ideal for teaching hardware description languages (VHDL/Verilog) and synchronous design. The Cyclone I device family is mature enough that textbooks, lab manuals, and reference designs are abundant, which lowers the barrier to course adoption. Many institutions continue using Cyclone I boards while gradually migrating curricula to Cyclone IV E or Cyclone 10 LP platforms.

What is the EP1C20F400C7?
The EP1C20F400C7 is a member of Intel's (formerly Altera's) Cyclone family of low-cost FPGAs. It provides 20,060 logic elements, 294,912 bits of embedded SRAM, 301 user I/O pins, and two PLLs in a 400-ball FineLine BGA package. The part operates from a 1.5 V core supply and is intended for high-volume cost-sensitive applications. Source: Cyclone Device Family datasheet (Altera, 2003).
How many logic elements does the EP1C20F400C7 have?
The EP1C20F400C7 contains 20,060 logic elements organized into 2,006 logic array blocks (LABs). Each LAB includes 10 logic elements (LEs), and each LE is built from a 4-input look-up table (LUT) plus a programmable register. Source: Cyclone Device Family datasheet, Chapter 1, Features.
What package does the EP1C20F400C7 use?
The EP1C20F400C7 is housed in a 400-ball FineLine BGA (FBGA-400) package measuring 21 mm × 21 mm with a 1.00 mm ball pitch. This is the largest package option in the Cyclone EP1C20 density family, maximizing user I/O count to 301 pins. The package is suitable for 4- to 6-layer PCB designs with 0.2 mm via capture rules.
What is the difference between EP1C20F400C7 and EP1C20F400C8?
The EP1C20F400C7 (commercial, -7 speed grade) and EP1C20F400C8 (commercial, -8 speed grade) differ only in timing performance. The -8 speed grade is approximately 15% slower than the -7. Both share identical package (FBGA-400), 301 I/O count, 20,060 logic elements, and 1.5 V core voltage, making them drop-in compatible from a board-layout perspective. Source: Xecor EP1C20F400C8 vs EP1C20F400C7 comparison page.
What is the difference between EP1C20F400C7 and EP1C20F324C6N?
The EP1C20F400C7 uses the 400-ball BGA package with 301 I/O and operates at commercial temperature (0°C to +85°C). The EP1C20F324C6N uses the smaller 324-ball BGA package with fewer I/O and a -6 speed grade. Pin-to-pin compatibility between 400- and 324-ball packages is NOT supported because ball maps differ; migrating requires PCB redesign.
Where can I buy EP1C20F400C7 today?
The EP1C20F400C7 is listed as obsolete on Intel's product page, but authorized distributors including DigiKey (P/N 703754), Mouser, Avnet, and several franchised brokers still report limited stock as of 2026-09-06. Lead times on new factory stock are typically 8–12 weeks; pricing for qty-1 ranges approximately $70–$85 per the Verified Web Data.
How much does the EP1C20F400C7 cost in volume?
As of 2026-09-06, distributor pricing for the EP1C20F400C7 (Cyclone FPGA, 400-BGA, -7 speed grade) is approximately $78.50 at qty-1, $70.20 at qty-10, $62.80 at qty-100, $55.40 at qty-500, and $48.90 at qty-1000, based on current DigiKey and Xecor listings. Pricing reflects supply scarcity following the part's transition to obsolete status.
What is a drop-in replacement for EP1C20F400C7?
Drop-in replacements that share the 400-ball FBGA footprint and identical LE/MEMORY/I/O resources are EP1C20F400C6N, EP1C20F400C6AC, EP1C20F400C6AB, EP1C20F400C6, and EP1C20F40017 (all Intel, FBGA-400). The most common engineering replacement is EP1C20F400C6 (lower speed grade, otherwise identical silicon) for cost reduction, or EP1C20F400I7 for industrial-temperature migration.
Where can I download the EP1C20F400C7 datasheet PDF?
The original Altera Cyclone Device Family datasheet (94 pages, Chapter 1 covers EP1C20 features) is hosted at https://www.alldatasheet.com/datasheet-pdf/pdf/131469/ALTERA/EP1C20F400C7.html. A vendor PDF copy is also available at https://www.alterasemi.com/datasheet/alterasemi/EP1C20F400C7.pdf. The document covers electrical characteristics, pin-out, configuration modes, and JTAG programming.
Is the EP1C20F400C7 RoHS compliant?
RoHS compliance status for EP1C20F400C7 is marked [DATA_NEEDED: RoHS compliance status] because the Verified Web Data does not contain an explicit RoHS certificate for this specific MPN suffix. The Cyclone family datasheet references lead-free and leaded package options; please request the latest material declaration from Intel or an authorized distributor for production qualification.
Is the EP1C20F400C7 still in production?
The EP1C20F400C7 is classified as obsolete in the Intel/Altera product lifecycle, meaning no new factory production is scheduled. Existing inventory is available through authorized distributors and the open market as of 2026-09-06. For new designs, Intel recommends migrating to Cyclone IV E (EP4CE series) or Cyclone 10 LP (10CL series) families.
Hey Google, what can replace EP1C20F400C7?
The EP1C20F400C7 can be replaced by the same-density variants EP1C20F400C6 (lower speed grade, identical silicon), EP1C20F400I7 (industrial temperature, -7 speed grade), and EP1C20F40017 (full commercial). All four parts share the 400-ball FBGA-400 footprint and 20,060 logic elements. For modern designs, the Intel EP4CE22F17C8N (Cyclone IV E, FBGA-256) or Lattice ECP2M-20 (FBGA-400) provide functional equivalents with more recent toolchain support.
What is the best cross-brand equivalent for EP1C20F400C7?
The closest cross-brand (non-Intel) drop-in alternatives to the EP1C20F400C7 are Xilinx Spartan-3 XC3S200-4FGG456C (similar LE count, but FBGA-456, not pin-compatible) and Lattice ECP2/M-20T (FBGA-484). True cross-brand pin-to-pin drop-ins for the FBGA-400 footprint are NOT commercially available because each FPGA vendor uses a unique ball map. PCB redesign is required when migrating to a different vendor.
When should I choose EP1C20F400C7 over EP1C12Q240C6?
Choose EP1C20F400C7 when you need higher logic density (20,060 LE vs 12,060 LE) and more user I/O (301 vs 240). Choose EP1C12Q240C6 when your design fits within 12,060 logic elements and you prefer the smaller 240-pin PQFP or 240-pin QFP for lower-cost PCB fabrication. Both share Cyclone family IP, the same Quartus II toolchain, and identical configuration interface.
What are the key specifications of EP1C20F400C7 that engineers should know?
The EP1C20F400C7 is a Cyclone FPGA with 20,060 logic elements, 294,912 bits of embedded RAM, 301 user I/O pins, two PLLs, and 20 global clock networks, packaged in a 400-ball FineLine BGA measuring 21 mm × 21 mm with 1.00 mm ball pitch. It operates from a 1.5 V core supply with commercial 0°C to +85°C temperature range and supports LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards.

Engineering reference data for EP1C20F400C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1C20F400C7 when you need the highest logic density (20,060 LE) and maximum I/O count (301) available in the original Cyclone I family, particularly for designs already validated on Quartus II 6.0–13.1 and intended for production on existing 1.5 V power rails. Choose the -6 speed grade variants (EP1C20F400C6, EP1C20F400C6N) for cost reduction in designs where 15% Fmax headroom is unnecessary - they share identical silicon and pinout. Choose the EP1C20F400I7 industrial-temperature variant for outdoor or under-hood applications. For new designs without legacy constraints, consider Cyclone IV E (EP4CE22) or Cyclone 10 LP devices for modern toolchain support, AEC-Q100 qualification, and longer product lifecycles.

Comparison with Alternatives

Parameter This Product EP1C20F400C6N EP1C20F400C6AC EP1C20F400C6AB EP1C20F400C6 EP1C20F40017 EP1C20F400
Brand Intel Intel Intel Intel Intel Intel Intel
Package FBGA-400 FBGA-400 - same FBGA-400 - same FBGA-400 - same FBGA-400 - same FBGA-400 - same FBGA-400 - same
Logic Elements 20,060 LE 20,060 LE 20,060 LE 20,060 LE 20,060 LE 20,060 LE 20,060 LE
Embedded Memory 288 kbit 288 kbit 288 kbit 288 kbit 288 kbit 288 kbit 288 kbit
User I/O Count 301 301 301 301 301 301 301
Speed Grade -7 -6 (slower) -6 (slower) -6 (slower) -6 (slower) -7 (equivalent) Per suffix
Temperature Range 0°C to +85°C (commercial) 0°C to +85°C 0°C to +85°C 0°C to +85°C 0°C to +85°C Full commercial Per suffix
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Per suffix

Key Differentiators

  • Highest-density Cyclone I device in 400-ball BGA (vs EP1C12Q240C8N)
  • Cyclone I family has identical toolchain support from Quartus II 6.0 through 13.1 (vs Cyclone IV E EP4CE22F17C8N)
  • Speed grade -7 is the fastest Cyclone I option (vs EP1C20F400C6)

Design Notes

Estimated: at typical utilization (60% LE, 50% memory, 100 MHz system clock) the EP1C20F400C7 dissipates approximately 1.5 W from the 1.5 V core supply. Provide at least three 0.1 µF X7R ceramic decoupling capacitors placed within 5 mm of the VCCINT pins, plus a single 47 µF X5R bulk capacitor near the package. Use a dedicated LDO regulator (e.g., TI TPS7A4701) rather than a switching converter when designing for noise-sensitive analog I/O, as VCCINT ripple below 30 mV is required for reliable PLL operation.

The 400-ball FineLine BGA has 1.00 mm pitch and can be routed on a standard 4-layer PCB with 0.2 mm via capture. Use 0.10 mm trace width with 0.10 mm spacing between balls, fan-out to 0.20 mm via pads, and route signals on the top layer. Place a continuous GND plane on layer 2 directly under the BGA, and a VCCINT power island on layer 3. Avoid routing signal traces under the package perimeter to minimize crosstalk to JTAG and clock pins.

Configuration mode is set by MSEL[2:0] pins; tying them incorrectly prevents the FPGA from entering user mode after power-up. Use 4.7 kΩ pull-up or pull-down resistors on MSEL per the Cyclone Device Family datasheet, never leave them floating. Also ensure nCONFIG is held low during VCCINT ramp-up, then released after VCCINT reaches 1.45 V to trigger a clean configuration sequence. Failure to sequence properly results in nSTATUS staying low and the device never entering user mode.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS, REACH, lead-free, halogen-free, and conflict-minerals status are not explicitly stated in the Verified Web Data for EP1C20F400C7; the Cyclone family datasheet references both leaded and lead-free package options. For automotive applications, the -Q suffix or EP4CE22F17C8N (Cyclone IV E with AEC-Q100 support) is recommended. Industrial-temperature variant EP1C20F400I7 should be selected for -40°C to +100°C operation.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP1C20F400C7 Cyclone FPGA Field Programmable Gate Array FBGA-400 FineLine BGA logic element logic array block M4K memory block embedded SRAM PLL JTAG Quartus II LVDS LVTTL PCI RoHS AEC-Q100 SRAM process 1.5V core voltage industrial temperature consumer video ASIC prototyping
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