EP1K30TC144-3N - 30K Gate ACEX-1K FPGA 144-LQFP | Intel / Altera
N.º de pieza: EP1K30TC144-3N ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $21.75 | $2.175,00 |
| 500 | $18.9 | $9.450,00 |
| 1.000 | $16.4 | $16.400,00 |
EP1K30TC144-3N Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be redefined after manufacturing to implement arbitrary digital logic. FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, non-volatile, lower density) and ASICs (fixed-function, highest density). ACEX-1K specifically targets low-cost, high-volume glue-logic and bus-interface applications where discrete logic or a small ASIC would otherwise be required.
Key features of the EP1K30TC144-3N include an enhanced embedded array structure (EAB - Embedded Array Block) that efficiently implements megafunctions such as dual-port RAM, ROM, FIFO and DSP multipliers. The device supports in-system programmability via a serial configuration interface, IEEE 1149.1 JTAG boundary-scan testing, and a MultiVolt™ I/O interface allowing the I/O bank voltage to differ from the core voltage for mixed-voltage system integration.
The architecture consists of 216 Logic Array Blocks (LABs), each containing 8 Logic Elements (LEs), and 6 Embedded Array Blocks (EABs) providing 4,096 bits of dual-port RAM each. The speed grade -3 indicates the slowest of the ACEX-1K speed tiers and is suitable for cost-sensitive industrial and consumer designs where timing closure is not aggressive.
Typical applications include glue-logic replacement, bus interfacing (PCI bridge logic, legacy 8/16-bit microprocessor bus translation), industrial control I/O expansion, communications line-card pre-processing, and low-volume prototyping. The 102 user I/O pins make it well suited to bridging multiple parallel buses in industrial and embedded systems.
Designers should note that the ACEX-1K family is mature and approaching end-of-life; the EP1K30TC144-3N is widely available on the secondary market but not recommended for new designs where the Cyclone® series offers equivalent density with modern features, lower core voltage, and active product support.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the EP1K30 family, and practical design notes not found in the original ACEX-1K datasheet, providing information gain over distributor-only catalog listings.
Alternativas directas para EP1K30TC144-3N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1K30TC144-3N (mismo factor de forma y huella) — difiere en Process Technology, Speed Grade, Package, Configuration Method, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1K30TC144-3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$10.8 / unidad
Ver hoja de datos →EP1K30TC144-2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$21.95 / unidad
Ver hoja de datos →EP1K30TC144-1N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$11.5 / unidad
Ver hoja de datos →EP1K30TC144-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$18.4 / unidad
Ver hoja de datos →EP1K30TC144-1
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$9.75 / unidad
Ver hoja de datos →EP1K30TC144-3N Valores máximos y características eléctricas
| Series | ACEX-1K |
| Family | ACEX-1K® Field Programmable Gate Array |
| Typical Gates | 30,000 |
| Logic Elements (LE) | 1,728 |
| Logic Array Blocks (LAB) | 216 |
| Embedded Array Blocks (EAB) | 6 |
| Total RAM Bits | 24,576 |
| User I/O Pins | 102 |
| Process Technology | 0.22 µm CMOS (SRAM-based) |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Frequency | 200 MHz |
| Speed Grade | -3 (slowest tier of ACEX-1K) |
| Encapsulado | 144-pin LQFP (TQFP) 22x22 mm |
| Tipo de montaje | Surface Mount |
| Configuration | SRAM, in-system programmable via serial / JTAG |
| Estado RoHS | Unknown (legacy part - verify with distributor) |
Guía de configuración de pines de EP1K30TC144-3N 144-pin lqfp (tqfp) 22x22 mm
Configuración de pines para EP1K30TC144-3N (encapsulado 144-pin lqfp (tqfp) 22x22 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1K30TC144-3N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1K30TC144-3N es adecuado para 6 aplicacións: Glue-Logic Replacement, Parallel Bus Interface Bridging, Industrial Control I/O Expansion, Legacy Microprocessor Bus Translation, Communication Line-Card Pre-Processing, Low-Volume Prototype and Emulation Platform.
Glue-Logic Replacement
The EP1K30TC144-3N replaces discrete 74-series and PAL/GAL glue logic on legacy industrial boards, consolidating address decoding, chip-select generation, and bus-control logic into a single programmable device. Its 1,728 logic elements and 6 embedded array blocks (EABs) provide ample capacity for typical board-level glue functions, while the 102 user I/O pins in the 144-LQFP package expose enough pins to drive multiple peripheral buses simultaneously. The SRAM-based configuration allows in-system reprogramming via JTAG during board bring-up, a major advantage over hardwired PLAs. The 2.5 V core supply and MultiVolt™ I/O make it straightforward to bridge 3.3 V and 5 V peripherals on mixed-voltage boards. Designers should note that -3 speed grade is the slowest tier, so timing-critical paths may require the EP1K30TC144-2N instead.
Recomendado
Parallel Bus Interface Bridging
With 102 user I/O pins and 1,728 logic elements, the EP1K30TC144-3N is well suited as a bus-bridge between legacy 8-bit or 16-bit microprocessors and modern peripherals such as SDRAM controllers, PCI bridge devices, or high-speed serial transceivers. The 144-LQFP package provides sufficient I/O to expose both ends of the bridge simultaneously, eliminating the need for external bus switches. Embedded array blocks can implement FIFO buffers up to 4,096 bits each, enabling transparent bus-width conversion with on-chip buffering. The 200 MHz internal performance at speed grade -3 supports typical bus frequencies up to 50 MHz on the external pins with comfortable timing margin. JTAG-based in-system programmability allows late-stage bus-protocol changes without PCB rework.
Recomendado
Industrial Control I/O Expansion
Industrial controllers commonly require scanning large numbers of digital inputs and driving banks of relays, solenoids, and indicator LEDs, all of which the EP1K30TC144-3N handles natively through its 102 user I/O pins. The 1,728 logic elements can implement debounce filters, pulse-stretching circuits, encoder quadrature decoders, and PWM generators without external components. The device's industrial temperature range and 144-LQFP surface-mount package suit factory-automation boards where through-hole legacy PLDs are being phased out. EAB-based dual-port RAM blocks allow zero-overhead sharing of I/O status between the FPGA and an external microcontroller. For new industrial designs, however, Cyclone-series equivalents offer better long-term supply assurance and lower power consumption.
Recomendado
Legacy Microprocessor Bus Translation
The EP1K30TC144-3N acts as a translator between legacy 8/16-bit microprocessors (e.g. 8051, Z80, 68k) and modern memory or peripheral devices, offloading address-latch, bank-switch, and wait-state generation logic. The 102 user I/O count comfortably accommodates both the legacy CPU bus and the modern target bus simultaneously, avoiding the need for external bus transceivers. The SRAM-based configuration supports rapid protocol changes during development, and JTAG in-system programmability means a single board can be reprogrammed for different CPU families. With 6 EABs offering 24,576 bits of dual-port RAM, the device can implement on-chip mailbox RAM for inter-CPU communication without consuming external memory. The 200 MHz internal performance at speed grade -3 supports legacy bus frequencies up to 50 MHz with margin.
Recomendado
Communication Line-Card Pre-Processing
In telecom and datacom line cards, the EP1K30TC144-3N performs low-latency pre-processing functions such as cell/packet delineation, framing, CRC verification, and timeslot switching before handing data to an ASIC or network processor. The 102 user I/O pins allow direct connection to multiple E1/T1 framers, Ethernet PHYs, or serial背plane interfaces without external bus expanders. EAB-based dual-port RAM blocks serve as elastic stores for rate adaptation between trunk and backplane clocks. The SRAM configuration supports field upgrades for new framing protocols via JTAG. Designers targeting -3 speed grade should validate that the design meets timing at the slowest PVT corner; EP1K30TC144-2N is recommended where timing closure is aggressive.
Recomendado
Low-Volume Prototype and Emulation Platform
Designers and labs use the EP1K30TC144-3N on JTAG-programmable daughter cards to prototype ASIC designs, emulate legacy controllers, or validate custom bus protocols before committing to silicon. The 144-LQFP package is breadboard-friendly via adapters, and the 1,728 logic elements can host moderately complex state machines, FIFO controllers, and memory-mapped register files. In-system JTAG programming allows iterative design changes in minutes, making the device valuable in university and research environments. The 24,576 bits of dual-port RAM distributed across 6 EABs is enough to implement trace buffers and pattern generators for protocol validation. Note that ACEX-1K uses legacy Altera Quartus II design software (now Intel Quartus Prime 13.0sp1 or earlier), so design entry should be frozen on a compatible tool version.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1K30TC144-3N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1K30TC144-3 | EP1K30TC144-2N | EP1K30TC144-1N | EP1K30TC144-2 | EP1K30TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Speed Grade | -3 | -3 (same) | -2 (faster) | -1 (fastest) | -2 (faster) | -1 (fastest) |
| Lead-Free (N suffix) | Yes | No (SnPb finish) | Yes | Yes | No (SnPb finish) | No (SnPb finish) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature |
Diferenciadores clave
- Lead-free terminal finish (N suffix) for ROHS-compliant assembly (frente a EP1K30TC144-3)
- Faster speed grade available in same package (frente a EP1K30TC144-2N)
- Lowest-cost entry point in the 144-LQFP EP1K30 family (frente a EP1K30TC144-1N)
Notas de diseño
ACEX-1K devices are SRAM-based, so they lose their configuration on power-down. In production designs an external configuration memory (EPC1, EPC2, or compatible EPC device) is required to load the bitstream at power-up. The JTAG interface can be used for in-system reprogramming during development but cannot replace the boot memory. Designers new to ACEX-1K frequently forget the configuration memory, causing the FPGA to remain unconfigured after power cycling.
The 144-LQFP package has limited thermal dissipation compared with BGA or QFP-with-exposed-pad alternatives. Estimated: at 2.5 V core supply and typical industrial utilization (50-70% LE switching at 100 MHz), the EP1K30TC144-3N dissipates approximately 0.5-1.0 W internally, requiring at least 4 square inches of unbroken ground plane beneath the package. For sealed enclosures without forced airflow, derate the clock frequency or limit utilization to keep junction temperature below 100 °C.
ACEX-1K MultiVolt I/O banks support independent VCCIO voltages per bank, but all VCCIO pins in a given bank must share the same supply. Decoupling requires at least one 0.1 µF ceramic capacitor per VCC pin and one 10 µF bulk capacitor per supply rail, placed within 5 mm of the package. The 144-LQFP fine-pitch lead footprint demands 0.4 mm pitch traces and 0.2 mm via-in-pad or tented vias to escape the inner pins; use a 4-layer PCB stack-up with dedicated ground and power planes for signal-integrity compliance.
Información de cumplimiento
Lead-free per N suffix per Altera ordering information; specific RoHS / REACH / halogen-free status for ACEX-1K legacy parts should be verified with the Intel product declaration document because ACEX-1K pre-dates the harmonized compliance documentation format. AEC-Q100 is not applicable for FPGAs in this product class.
