EP1K30TC144-1 - ACEX-1K 30K Gates FPGA, 144-LQFP | Altera
MPN: EP1K30TC144-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $9.75 | $9,750.00 |
Drop-in alternatives for EP1K30TC144-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30TC144-2
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EP1K30TC144-3
✅ Drop-In✓ In Stock
$10.8 / Unit
View Datasheet →EP1K30TC144-1N
✅ Drop-In✓ In Stock
$11.5 / Unit
View Datasheet →EP1K30TI144-2
✅ Drop-In✓ In Stock
$13.85 / Unit
View Datasheet →EP1K10TC144-1
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EP1K30TC144-1 Maximum Ratings & Electrical Characteristics
| Series | ACEX-1K |
| Family | ACEX 1K |
| Equivalent Gates | 30,000 |
| Number of Logic Elements / Cells | 1,728 |
| Number of LABs / CLBs | 216 |
| Total RAM Bits | 24,576 |
| Number of I/O | 102 |
| Package | 144-LQFP (TQFP) |
| Mounting Type | Surface Mount |
| Core Supply Voltage | 2.5 V |
| Technology | CMOS, SRAM-based |
| Speed Grade | -1 (slowest in ACEX-1K family) |
| Operating Temperature | 0C to +70C (commercial) |
| Configuration Method | SRAM, in-system programmable |
EP1K30TC144-1 144-lqfp (tqfp) Pin Configuration Guide
Complete pinout information for EP1K30TC144-1 (144-lqfp (tqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K30TC144-1.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30TC144-1 is suitable for 6 applications: ASIC Prototyping and Logic Emulation, Industrial Control and Glue Logic Replacement, Communication Bridge and Protocol Conversion, Embedded Display and Video Processing Front-End, Educational and FPGA Learning Platforms, Legacy System Maintenance and Drop-In Board Replacement.
ASIC Prototyping and Logic Emulation
The EP1K30TC144-1's 30,000 equivalent gates and 1,728 logic elements provide a low-cost platform for prototyping custom ASICs before committing to mask costs. Designers map RTL onto the LUT-based fabric, validate timing with the -1 speed grade's conservative Fmax, and use the 24,576 bits of embedded RAM for scratch buffers and FIFOs. The 144-LQFP package enables hand-solderable prototypes and fast design iterations, while JTAG configuration allows rapid bitstream reloads during verification cycles.
Recommended
Industrial Control and Glue Logic Replacement
With 102 user I/Os and 2.5 V core supply, the EP1K30TC144-1 consolidates multiple 74-series glue-logic chips, counters, and state machines into a single programmable device for industrial controllers. The 216 LABs deliver ample logic density for motor-control sequencing, sensor conditioning, and parallel bus arbitration, while the 144-LQFP package tolerates factory-floor thermal environments when industrial-grade parts are specified. The -1 speed grade is acceptable for control loops running below 50 MHz.
Recommended
Communication Bridge and Protocol Conversion
The EP1K30TC144-1 supports UART, SPI, I2C, and custom parallel-protocol bridges that glue together mixed-vintage subsystems in telecom and networking equipment. Its 102 I/Os accommodate wide data buses, and the EAB-based dual-port RAM (24,576 bits) provides FIFO buffering between asynchronous clock domains. ACEX-1K fabric at -1 speed grade easily meets typical 25-50 MHz bridge timing, and JTAG-based field reconfiguration enables post-deployment firmware updates.
Recommended
Embedded Display and Video Processing Front-End
The EP1K30TC144-1 handles timing-controller duties for small TFT/LCD panels, generating HSYNC/VSYNC, pixel clocks, and color-space conversions from digital video sources. Its 1,728 logic elements are sufficient for medium-resolution pixel pipelines, and the 24,576 bits of embedded RAM double as line buffers. The 144-LQFP footprint is widely accepted in industrial-display reference designs, and the -1 speed grade supports typical 25 MHz pixel clocks without timing closure issues.
Recommended
Educational and FPGA Learning Platforms
The EP1K30TC144-1 is a popular teaching device in university digital-design labs because it offers meaningful logic capacity (30K gates, 1,728 LEs) without overwhelming beginners. The 144-LQFP package is forgiving for student soldering and accepts standard 0.5 mm-pitch QFP breakout boards, while the Altera Quartus toolchain supports industry-standard HDL design flows. The -1 speed grade's relaxed timing makes first-time bring-up easier, reducing lab debug cycles for student projects.
Recommended
Legacy System Maintenance and Drop-In Board Replacement
For long-lifecycle industrial, medical, and aerospace systems where the EP1K30TC144-1 was originally designed in, the part remains a critical spare for board-level repair. Stocking distributors such as Heisener and Micro-Semiconductor list thousands of pieces as of September 2026, ensuring field-replacement availability even after NRND announcement. The 144-LQFP footprint, established ACEX-1K bitstream format, and identical pinout across speed grades (-1, -2, -3) allow straightforward swap-in repair without PCB rework.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30TC144-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30TC144-2 | EP1K30TC144-3 | EP1K30TC144-1N | EP1K30TI144-2 | EP1K10TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Equivalent Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 10,000 (-67%) |
| Logic Elements / Cells | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 576 (-67%) |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 12,288 (-50%) |
| Number of LABs / CLBs | 216 | 216 | 216 | 216 | 216 | 72 (-67%) |
| Number of User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -1 (slowest) | -2 (~20-30% faster Fmax) | -3 (fastest, +40-60% vs -1) | -1 (industrial temp) | -2 (industrial temp) | -1 (slowest) |
| Operating Temperature | 0C to +70C (commercial) | 0C to +70C | 0C to +70C | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C |
| Approx. Unit Price (qty 100) | $13.85 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Same package as -2 and -3 speed grades with full pin compatibility (vs EP1K30TC144-2)
- Industrial temperature grade option in same footprint (vs EP1K30TC144-1N)
- Halved logic and memory when stepping down to lower density (vs EP1K10TC144-1)
Design Notes
The EP1K30TC144-1 requires a regulated 2.5 V VCCINT supply with adequate decoupling. Place 0.1 uF ceramic capacitors within 5 mm of every VCCINT/GND pair, and add a 10 uF bulk capacitor near the supply pin. According to the ACEX-1K datasheet, VCCINT ripple above 5% can cause configuration memory corruption, so use a low-noise LDO rather than a switching regulator for the core rail when possible. I/O banks may operate at 2.5 V or 3.3 V depending on bank voltage selection.
Estimated: At full activity on all 102 I/Os toggling at 50 MHz, the EP1K30TC144-1 dissipates approximately 0.5-1.0 W. The 144-LQFP package has a higher theta_JA than the BGA 256-ball variant (typically 25-35 C/W without airflow). For designs sustained at maximum junction temperature (125 C for commercial), confirm thermal headroom using the package thermal metrics in the ACEX-1K datasheet and consider a small heatsink or airflow for continuous high-utilization workloads.
The 144-LQFP package uses 0.5 mm lead pitch, which is hand-solderable with a fine-tip iron but requires careful PCB layout. Use a 4-layer PCB with continuous power and ground planes under the device to provide low-impedance VCCINT distribution and signal return paths. Route all clock inputs (CLK0, CLK1) on inner layers with controlled impedance, and keep JTAG signals (TDI, TDO, TMS, TCK) short to avoid configuration failures.
Do not assume the EP1K30TC144-1 retains its bitstream through power cycling. As an SRAM-based FPGA, it must be reconfigured at every power-up via a configuration ROM (Altera EPC2 family) or external microcontroller. Plan PCB footprint to accommodate a configuration memory device. Also note that the -1 speed grade is the slowest ACEX-1K bin; designs targeting above 100 MHz Fmax should select -2 or -3 instead.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not present in verified distributor or datasheet snippets; the part is classified as NRND by Altera/Intel as of September 2026. Verify compliance directly with the manufacturer for production use.