EP1S25B672C7 - Stratix 25,660 LC FPGA, 420 MHz, 672-BGA | Intel
N.º de pieza: EP1S25B672C7 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $220.5 | $2.205,00 |
| 100 | $198 | $19.800,00 |
| 250 | $185 | $46.250,00 |
| 500 | $175 | $87.500,00 |
EP1S25B672C7 Descripción general
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) within the broader integrated-circuit family, sitting hierarchically under: logic IC -> programmable logic -> FPGA -> SRAM-based FPGA -> Stratix series. Unlike fixed-function ASICs, FPGAs use configurable logic blocks (LBs/LEs), programmable interconnect, and embedded memory/DSP blocks that engineers can re-program in-circuit to implement custom digital logic, signal-processing pipelines, or glue-logic interfaces. The Stratix generation in particular targets high-performance DSP, communications, and high-speed I/O bridge designs.
Key features for the EP1S25B672C7 include 25,660 logic cells organized as 2,566 LABs, embedded RAM of approximately 1.94 Mbit, 473 maximum user I/O pins, four phase-locked loops (PLLs) for clock management, and Stratix-family high-speed I/O support including LVDS and differential signaling. The C7 speed grade denotes the commercial temperature range (0 C to 85 C) and the seventh (slowest) timing bin, making this part a cost-optimized choice where maximum Fmax is not required.
Architecturally, the EP1S25B672C7 builds on Altera's Stratix platform, which adds dedicated DSP blocks (for multiplier/accumulator functions), TriMatrix embedded memory (MLAB, M4K, M-RAM blocks), and the high-performance routing fabric needed for parallel data-path designs. Designers use the Quartus II design toolchain for synthesis, place-and-route, and timing closure.
Typical applications include telecom line-card data-path processing, high-speed image/video buffering, industrial control and machine vision front-ends, ASIC prototyping, and high-bandwidth DSP co-processing. The 672-BGA's 35 x 35 mm body and 1.27 mm pitch make it suitable for high-density multi-layer boards requiring a large user-I/O count.
When designing with this part, note that the 1.5 V core requires a stable regulator and decoupling strategy; the C7 speed grade trades raw Fmax for cost - select C6 or C5 for tighter timing. The 672-BGA footprint demands controlled-impedance PCB stack-up and reflow profiling compatible with large-array BGAs.
This page synthesizes distributor pricing (as of 2026-09-07), drop-in alternatives from the Stratix family, and practical design notes that complement the official Stratix Device Family Data Sheet.
Alternativas directas para EP1S25B672C7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1S25B672C7 (mismo factor de forma y huella) — difiere en Operating Temperature, Configuration Method, Speed Grade, Package, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1S25B672C6
✅ Sustitución directa✓ En stock
$990 / unidad
Ver hoja de datos →EP1S25B672C6N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP1S20B672C7N
✅ Sustitución directa✓ En stock
$320 / unidad
Ver hoja de datos →EP1S20B672C7N
✅ Sustitución directa✓ En stock
$320 / unidad
Ver hoja de datos →EP1S20B672C6N
✅ Sustitución directa✓ En stock
$425 / unidad
Ver hoja de datos →EP1S20B672C6
✅ Sustitución directa✓ En stock
$489.5 / unidad
Ver hoja de datos →EP1S25B672C7 Valores máximos y características eléctricas
| Family | Stratix |
| Logic Cells | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (bits) | 1,944,576 |
| Maximum User I/O | 473 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Maximum Internal Frequency | 420.17 MHz |
| Encapsulado | 672-BGA, 35 x 35 mm, 1.27 mm pitch |
| Recuento de pines | 672 |
| Speed Grade | C7 (commercial, slowest bin) |
| Temperatura de funcionamiento | 0 C to 85 C |
| Tipo de montaje | Surface Mount |
| Configuration Method | SRAM-based (volatile, requires config device) |
| Logic Family | CMOS |
Guía de configuración de pines de EP1S25B672C7 672-bga, 35 x 35 mm, 1.27 mm pitch
Configuración de pines para EP1S25B672C7 (encapsulado 672-bga, 35 x 35 mm, 1.27 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1S25B672C7.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1S25B672C7 es adecuado para 6 aplicacións: Telecom Line-Card Data Path Processing, ASIC Prototyping and Emulation, Industrial Machine Vision Front-End, High-Bandwidth DSP Co-Processing, Legacy Communication Backplane Bridging, Test & Measurement Instrumentation.
Telecom Line-Card Data Path Processing
The EP1S25B672C7's 25,660 logic cells and 473 user I/Os make it well-suited for telecom line-card data-path processing, where it can implement custom framing, cell/packet delineation, and channelized serialization at line rates up to its 420 MHz internal Fmax. The 1.5 V core and Stratix family's high-speed LVDS I/O support OC-48 / STM-16 (2.5 Gbps) class interfaces. Its 1,944,576 embedded RAM bits accommodate multi-frame elastic buffers without external SRAM. Compared with newer Stratix II/III parts, the EP1S25B672C7 trades raw performance for proven legacy-tool compatibility - ideal when migrating older line-card designs into stable production.
Recomendado
ASIC Prototyping and Emulation
With 25,660 logic cells and abundant interconnect, the EP1S25B672C7 remains a popular choice for ASIC prototyping and in-circuit emulation where engineers map RTL designs to the FPGA to validate ASIC logic pre-fabrication. The C7 commercial speed grade provides adequate timing closure at moderate clock rates, while the SRAM-based configuration allows unlimited design iterations during bring-up. The Quartus II toolchain supports industry-standard HDL entry (VHDL/Verilog) and incremental compilation. Compared with newer Cyclone or Arria devices, the EP1S25B672C7 retains value in legacy emulation racks already configured with this part.
Recomendado
Industrial Machine Vision Front-End
The EP1S25B672C7 fits industrial machine-vision front-ends where it performs Bayer-pattern demosaicing, color-space conversion, and pre-DSP filtering on high-resolution image streams before passing to a host processor. Its 473 user I/Os accommodate Camera Link or LVDS-based image sensors, while the dedicated DSP blocks (Stratix family feature) accelerate 2D filter convolution in real time. The 1.5 V core simplifies thermal design in factory-floor enclosures. Compared with a soft-core CPU approach, the EP1S25B672C7 delivers deterministic latency required by vision pipelines operating at 60+ fps.
Recomendado
High-Bandwidth DSP Co-Processing
The EP1S25B672C7's dedicated DSP blocks and 1,944,576 embedded RAM bits make it suitable for high-bandwidth DSP co-processing offloading FFT, FIR, and matrix-multiply workloads from a host CPU. Per the Stratix family datasheet, the EP1S25 generation supports multiply-accumulate operations with up to 36 x 36 bit precision, ideal for radar, sonar, and software-defined-radio baseband processing. The 420 MHz internal Fmax enables 10+ GMACS sustained throughput. Compared with pure-software DSP, the EP1S25B672C7 reduces host CPU load by 90%+ on convolution-heavy workloads.
Recomendado
Legacy Communication Backplane Bridging
In legacy communication backplanes, the EP1S25B672C7 serves as a protocol-bridging device - translating between proprietary backplane buses, RapidIO, or custom LVDS links and modern Ethernet or PCIe fabrics. Its 672-BGA package provides the routing density needed for hundreds of high-speed differential pairs, while the 25,660 logic cells implement stateful translation logic. The C7 speed grade is sufficient for backplane rates up to 1 Gbps per lane. Compared with newer FPGAs requiring newer toolchains, the EP1S25B672C7 allows maintenance of legacy backplanes without re-certifying firmware.
Recomendado
Test & Measurement Instrumentation
The EP1S25B672C7 is well suited for test & measurement instrumentation such as logic analyzers, protocol analyzers, and arbitrary waveform generators, where it implements custom trigger logic, pattern generation, and real-time protocol decoding. Its 473 user I/Os and high-speed LVDS capability allow direct probing of multi-channel buses, while the 1.94 Mbit embedded RAM stores capture buffers. The C7 commercial speed grade (0 C to 85 C) suits benchtop environments. Compared with DSP-only or microcontroller-based test gear, the EP1S25B672C7 enables fully custom protocols not supported by off-the-shelf ASICs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1S25B672C7 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1S25B672C6 | EP1S25B672C6N | EP1S20B672C7 | EP1S20B672C7N | EP1S20B672C6N | EP1S20B672C6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BGA (35 x 35 mm) | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same | 672-BGA - same |
| Logic Cells | 25,660 | 25,660 | 25,660 | 20,460 (-20%) | 20,460 (-20%) | 20,460 (-20%) | 20,460 (-20%) |
| LABs | 2,566 | 2,566 | 2,566 | 2,046 | 2,046 | 2,046 | 2,046 |
| Speed Grade | C7 (commercial, slowest) | C6 (faster) | C6 (faster) | C7 - same | C7 - same | C6 (faster) | C6 (faster) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Pb-free / RoHS | No (leaded finish) | No (leaded) | Yes (Pb-free) | No (leaded) | Yes (Pb-free) | Yes (Pb-free) | No (leaded) |
Diferenciadores clave
- Mid-range logic density optimized for legacy Stratix designs (frente a EP1S20B672C7)
- Complete Stratix family pin-compatibility (frente a EP1K50FC484-1 (ACEX family))
- Wide selection of speed grades and Pb-free variants (frente a EP1S25F672C7 (flip-chip variant))
Notas de diseño
Estimated: The EP1S25B672C7 requires a stable 1.5 V core supply with peak current up to several amps depending on toggle rate and logic utilization. Per the Stratix family datasheet, design margin should target a regulator rated for at least 2x the worst-case calculated Icc. Use a multi-phase buck controller with low-ESR ceramic output caps, and place at least ten 0.1 uF + four 10 uF decoupling capacitors within 5 mm of the BGA. Add a 1 uF bulk cap near each quadrant of the package to handle simultaneous switching noise (SSN) generated by the 672-ball array during high-speed I/O transitions.
The 672-BGA package (35 x 35 mm body) has a relatively large PCB footprint for heat spreading, but its thermal resistance (theta_JB) per the Stratix family datasheet is typically in the 1-2 C/W range with adequate thermal vias. Design with at least a 4x4 thermal-via array under the package center connected to internal ground planes. For designs operating above 70 C ambient or with sustained high toggle rates, attach a heatsink or use forced-air cooling. The C7 speed grade dissipates slightly less power than C5/C6 because it targets lower Fmax operation.
PCB layout for a 672-BGA at 1.27 mm ball pitch demands 0.5 mm-0.6 mm via-in-pad micro-vias, 4+2 stack-up (4 signal layers + 2 ground/power planes minimum), and impedance-controlled traces for LVDS/differential pairs. Escape routing from the inner rows must use dog-bone fanout or micro-via-in-pad. Reference the Altera Stratix Hardware Reference Manual for recommended stack-up and via geometry. Plan for a ground flood on the layer immediately below the BGA to control return paths and minimize SSN.
Common pitfalls with the EP1S25B672C7: (1) Do NOT use Quartus Prime - the original Stratix family is supported only by Quartus II (legacy) toolchain versions 4.x-13.0sp1. (2) The configuration scheme uses an EPCS serial flash or JTAG; ensure the correct configuration mode pins (MSEL) are pulled per the datasheet. (3) Do not assume 5 V tolerance on any I/O - all LVTTL/LVCMOS I/Os are 3.3 V tolerant at most per the Stratix I/O specification. (4) Avoid routing high-speed signals across the BGA center - use peripheral ball rows for high-speed differential pairs.
Información de cumplimiento
RoHS compliance: The plain EP1S25B672C7 is the leaded finish (non-RoHS). Pb-free drop-in variants EP1S25B672C6N / EP1S25B672C7N are RoHS compliant. AEC-Q100 not applicable (this is an FPGA, not an automotive-qualified IC). REACH and conflict-mineral status not confirmed in the provided verified data.
