EP1S20B672C7N - Stratix FPGA, 18,460 LEs, 672-BGA | Intel
N.º de pieza: EP1S20B672C7N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $501.6 | $501,60 |
| 10 | $481.5 | $4.815,00 |
| 100 | $425 | $42.500,00 |
| 500 | $372 | $186.000,00 |
| 1.000 | $320 | $320.000,00 |
EP1S20B672C7N Descripción general
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs sit in the programmable logic tier of the digital hierarchy, between fixed-function ASICs and software-driven processors, and are valued for parallel computation, deterministic latency, and in-field reconfigurability.
Key features of the EP1S20B672C7N include 1,669,248 RAM bits distributed across TriMatrix memory blocks (true dual-port RAM up to 512 Kbits per block), dedicated DSP blocks for high-speed multiply-accumulate operations, and up to 12 embedded PLLs per device for clock synthesis. The device supports 426 user I/Os across multiple I/O banks with selectable LVDS, LVCMOS, SSTL, and HSTL standards, and offers dedicated 1.5 V core supply operation.
Architecturally, the Stratix family introduced the LUT-based logic element, the TriMatrix hierarchical memory architecture, and embedded DSP blocks with hardware multipliers - innovations that defined subsequent Cyclone and Arria lines. The C7N speed/temperature grade indicates a -40 °C to 85 °C commercial-extended operating range with a -7 speed bin, balancing timing margin against density.
Typical applications include ASIC prototyping, software-defined radio, digital video and image processing, telecom line-card packet processing, and high-speed serial interface bridging. Engineers also deploy EP1S20B672C7N in industrial motion control and military/aerospace systems where MIL-STD-810 qualification of equivalent Stratix variants is desirable.
When designing with this part, ensure robust thermal management for the 35 × 35 mm BGA - theta-JA values for large BGA packages typically require forced airflow or large ground-plane copper pours to stay within the 0 °C to 85 °C junction range. Power sequencing of the 1.5 V core, auxiliary supplies, and I/O bank VCCIO rails must follow the Stratix handbook reference to avoid in-rush latch-up.
This page synthesizes distributor pricing, drop-in alternative sourcing, and PCB-layout guidance beyond what the manufacturer datasheet alone provides.
Alternativas directas para EP1S20B672C7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1S20B672C7N (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Speed Grade, Configuration Method, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1S25F672C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$535 / unidad
Ver hoja de datos →EP1S25B672C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$620.15 / unidad
Ver hoja de datos →EP1S20F672C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$109.2 / unidad
Ver hoja de datos →EP1S20B672C6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$425 / unidad
Ver hoja de datos →EP1S10B672C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$67.9 / unidad
Ver hoja de datos →EP1S20B672C7N Valores máximos y características eléctricas
| Series | Stratix |
| Family | Stratix (original) |
| Process Technology | 0.13 µm CMOS |
| Logic Elements (LEs) | 18,460 |
| LABs / CLBs | 1,846 |
| Embedded Memory Bits | 1,669,248 bits |
| Maximum User I/O | 426 |
| Number of Pins / Balls | 672 |
| Package Type | 672-BBGA (Fine-pitch BGA, 35 × 35 mm, 1.27 mm pitch) |
| Supply Voltage (Core, VCCINT) | 1.5 V |
| Temperatura de funcionamiento | 0 °C to 85 °C (Commercial Extended) |
| Speed Grade | -7 |
| Tipo de montaje | Surface Mount (BGA) |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
| Logic Family | CMOS |
Guía de configuración de pines de EP1S20B672C7N 672-bbga (fine-pitch bga, 35 × 35 mm, 1.27 mm pitch)
Configuración de pines para EP1S20B672C7N (encapsulado 672-bbga (fine-pitch bga, 35 × 35 mm, 1.27 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1S20B672C7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1S20B672C7N es adecuado para 6 aplicacións: ASIC Prototyping & Emulation, Software-Defined Radio Baseband, Telecom Line-Card Packet Processing, Digital Video & Image Processing, Industrial Motion Control & Robotics, High-Speed Serial Interface Bridging.
ASIC Prototyping & Emulation
The EP1S20B672C7N's 18,460 logic elements, 1,669,248 bits of TriMatrix block RAM, and 426 user I/O pins make it a capable platform for ASIC prototyping and pre-silicon validation. Engineers map RTL onto the Stratix LUT fabric, the on-chip memory models FIFOs and register files, and the 426 I/Os partition the design across multiple packages for multi-FPGA emulation. Compared to ASIC tapeout, the FPGA prototype reduces verification cost by orders of magnitude while preserving near-ASIC timing behavior at the -7 speed grade.
Recomendado
Software-Defined Radio Baseband
The EP1S20B672C7N integrates dedicated DSP blocks with hardware multipliers that accelerate the multiply-accumulate operations central to SDR baseband processing. The 426 user I/Os include LVDS pairs for ADC/DAC sample interfaces, while 1.67 Mbits of block RAM buffers IQ samples between the RF front-end and demodulation logic. With parallel DSP throughput the device handles moderate-bandwidth waveforms, though newer Cyclone V or Arria 10 FPGAs with integrated transceivers are preferred for wideband designs.
Recomendado
Telecom Line-Card Packet Processing
The EP1S20B672C7N was widely deployed in telecom line cards for packet classification, queuing, and forwarding at wire speed. Its 1.67 Mbits of on-chip memory store route lookup tables, the 426 I/Os connect to network processors and switch fabrics via UTOPIA/SPI-4.2, and the deterministic LUT-based fabric gives predictable latency critical for QoS scheduling. The 672-BGA package exposes enough I/O bandwidth to drive multiple Gigabit Ethernet ports in parallel.
Recomendado
Digital Video & Image Processing
The EP1S20B672C7N's parallel LUT fabric and embedded DSP blocks accelerate real-time video processing pipelines such as motion estimation, deinterlacing, and color-space conversion. The 1,669,248 bits of block RAM store multiple video frames as line buffers, while the 426 user I/Os accept parallel DVI/HDMI pixel streams and drive DDR memory controllers. Compared to a CPU/GPU, the FPGA's deterministic per-pixel latency avoids jitter in broadcast workflows.
Recomendado
Industrial Motion Control & Robotics
The EP1S20B672C7N executes multi-axis PID control loops, trajectory generation, and EtherCAT / SERCOS interface logic on a single chip. Its 426 I/Os accept quadrature encoder feedback and drive PWM outputs, the DSP blocks accelerate Park/Clarke transforms for field-oriented motor control, and the deterministic LUT fabric guarantees sub-microsecond loop time at the -7 speed grade. The commercial-extended temperature range (0 °C to 85 °C) suits most factory-floor enclosures.
Recomendado
High-Speed Serial Interface Bridging
The EP1S20B672C7N bridges between legacy parallel buses (PCI, UTOPIA, SPI-4.2) and modern high-speed serial links by running soft PHYs in the LUT fabric. The 1.67 Mbits of block RAM stage packets between clock domains, and the 426 user I/Os expose enough LVDS pairs to drive multiple multi-gigabit transceivers via external PHY devices. Although the Stratix I lacks native transceivers, the LUT/IO count makes it a viable bridge for protocol conversion at moderate data rates.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1S20B672C7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1S25F672C7N | EP1S25B672C7N | EP1S20F672C7N | EP1S20B672C6N | EP1S10B672C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (35 × 35 mm, 1.27 mm pitch) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) |
| Logic Elements | 18,460 | 25,660 (+39 %) | 25,660 (+39 %) | 18,460 (same die) | 18,460 (same) | 10,570 (-43 %) |
| Embedded Memory (bits) | 1,669,248 | 1,944,576 (+16 %) | 1,944,576 (+16 %) | 1,669,248 (same) | 1,669,248 (same) | 920,448 (-45 %) |
| Maximum User I/O | 426 | 426 (same) | 426 (same) | 426 (same) | 426 (same) | 346 (-19 %) |
| Speed Grade | -7 | -7 (same) | -7 (same) | -7 (same) | -6 (slower) | -7 (same) |
| Operating Temperature | 0 °C to 85 °C (commercial extended) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Higher logic density at same package (frente a EP1S10B672C7N)
- Drop-in density upgrade available (frente a EP1S25F672C7N)
- Lead-free variant exists in same package (frente a EP1S20F672C7N)
Notas de diseño
The 672-BGA package measures 35 × 35 mm and typically exhibits theta-JA around 15-20 °C/W with forced airflow. Estimated: at 1.5 V core and 1.2 A core current (≈1.8 W core power) plus I/O bank dissipation, total device power can reach 4-7 W for typical designs. Add a heatsink or thermal pad for sustained high ambient temperatures.
Route 1.5 V core (VCCINT), PLL analog (VCCA_PLL), and I/O bank VCCIO supplies in separate power planes with star-ground returns. Use a 4-layer PCB at minimum with continuous power/ground planes directly beneath the BGA escape region. The 1.27 mm ball pitch requires laser-drilled or 4-mil mechanical micro-vias for inner-row escape to internal layers.
Stratix I requires a specific power-on sequence (VCCINT first, then VCCA_PLL, then VCCIO) - failure to follow this can trigger in-rush latch-up. Configure unused I/O pins as tri-stated inputs with weak pull-up in the Quartus II fitter settings. Configuration via passive serial (PS) mode requires a valid configuration clock on DCLK before CONF_DONE goes high.
The 672-BGA escape pattern uses dog-bone fanout to BGA pads on the top layer with micro-via transition to internal routing layers. Match-length tuning is required for LVDS pairs, SSTL memories, and clock-distribution nets to meet Stratix I timing closure at the -7 speed grade. Use the Quartus II TimeQuest timing analyzer with Synopsys Design Constraints (.sdc) files.
Información de cumplimiento
RoHS and lead-free status not explicitly stated in verified web data; the B (SnPb ball) suffix suggests a non-RoHS component, while F variants are lead-free. AEC-Q100 is not applicable for FPGAs. Always request manufacturer documentation for compliance verification on obsolete parts.
