EP1S25B672C6N - 25,660 LEs Stratix FPGA, 672-BGA | Intel
MPN: EP1S25B672C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198 | $198,000.00 |
Drop-in alternatives for EP1S25B672C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25B672C6
✅ Drop-In✓ In Stock
$990 / Unit
View Datasheet →EP1S25F672C6N
✅ Drop-In✓ In Stock
$192.75 / Unit
View Datasheet →EP1S25B672C7N
✅ Drop-In✓ In Stock
$620.15 / Unit
View Datasheet →EP1S25F672C7N
✅ Drop-In✓ In Stock
$535 / Unit
View Datasheet →EP1S25B672I7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S25B672C6N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix FPGA |
| Manufacturer | Intel (Altera) |
| Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O | 473 |
| Number of Pins/Terminals | 672 |
| Package Type | 672-BBGA (35 x 35 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Supply Voltage (Core) | 1.5 V |
| Operating Temperature | 0 C to +85 C (Commercial Extended) |
| Process Technology | 0.13 µm CMOS |
| Embedded Memory | TriMatrix (M512, M4K, M-RAM) |
| DSP Blocks | Yes (embedded multipliers) |
| Configuration Mode | Serial/Parallel EPC, JTAG, CPU passive |
| RoHS Status | Unknown (legacy Stratix; consult distributor for specific date code) |
| Temperature Grade | Commercial Extended |
EP1S25B672C6N 672-bbga (35 x 35 mm, 1.27 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S25B672C6N (672-bbga (35 x 35 mm, 1.27 mm pitch) package) with 672 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25B672C6N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25B672C6N is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line-Card Glue Logic, Digital Signal Processing (DSP) Hardware Acceleration, Test and Measurement Instrumentation, High-Speed Image Processing, Industrial Control and Automation.
ASIC Prototyping and Emulation
The EP1S25B672C6N's 25,660 logic elements and 1.94 Mbit embedded RAM make it well-suited for ASIC prototyping and emulation tasks. With 2,566 LABs and 473 user I/Os, the device can map mid-complexity ASIC RTL (typically 200K-500K gate equivalents) at slower clock rates for verification. The TriMatrix memory architecture supports large FIFO buffers needed for bus-functional models, and dedicated DSP blocks accelerate multiply-accumulate primitives. Designers using Quartus II can synthesize RTL into the Stratix fabric, then iterate on testbenches quickly. For larger ASIC targets, multiple EP1S25 devices can be paralleled via LVDS chip-to-chip links. The 672-BGA package provides the I/O count required for realistic peripheral modeling.
Recommended
Telecom Line-Card Glue Logic
Stratix FPGAs were widely deployed in telecom line cards for protocol bridging, packet classification, and backplane glue logic. The EP1S25B672C6N's 1.5 V core and 473 I/Os support multiple POS/PHY interfaces (SPI-4.2, SFI-4) and high-speed LVDS links typical of legacy SONET/SDH and Ethernet line cards. The TriMatrix memory subsystem accommodates large packet buffers and lookup tables, while DSP blocks accelerate Reed-Solomon and CRC operations. Operating from 0 to 85 C commercial-extended temperature, the device fits controlled-environment central-office deployments. Hardware parallelism gives deterministic latency that CPUs cannot match, which is critical for QoS queue management at line rate.
Recommended
Digital Signal Processing (DSP) Hardware Acceleration
The EP1S25B672C6N's embedded DSP blocks deliver hardware multiply-accumulate throughput far exceeding software DSP on general-purpose processors. Each DSP block contains dedicated multipliers, adders, and pipeline registers supporting FIR, IIR, FFT, and matrix-multiply operations at hundreds of MSPS. For radar, software-defined radio, and baseband signal processing, the parallel architecture runs multiple channels concurrently. With 1.94 Mbit of TriMatrix memory, designers can implement window buffers, coefficient ROMs, and overlap-save storage without external SRAM. Designers using Altera's DSP Builder or hand-coded VHDL/Verilog can target the DSP blocks directly to balance logic utilization and throughput.
Recommended
Test and Measurement Instrumentation
Test equipment manufacturers deployed Stratix FPGAs in arbitrary waveform generators, logic analyzers, and protocol analyzers. The EP1S25B672C6N's 473 I/Os support hundreds of probe channels in parallel logic-analyzer architectures, while embedded memory buffers deep acquisition records. Hardware reconfiguration lets the same hardware serve multiple instrument personalities - a key value proposition for ATE platforms. The 1.5 V core reduces power consumption in rack-mounted equipment, and 0-85 C operation covers climate-controlled lab environments. Designers can implement custom triggering, pattern generation, and protocol decode in RTL with deterministic timing that no DSP or microcontroller can match.
Recommended
High-Speed Image Processing
Image processing pipelines for medical imaging, machine vision, and broadcast video benefit from the parallel architecture of the EP1S25B672C6N. The 473 I/Os support multiple camera-link or LVDS video inputs, while DSP blocks accelerate convolution, color-space conversion, and edge-detection kernels in real time. TriMatrix memory provides line buffers and frame-stores without external SRAM for many imaging pipelines. Designers targeting video rates (720p, 1080i) can sustain pixel rates well beyond software implementations on CPUs. The 672-BGA package also enables dense PCB layout for compact camera modules. Reconfigurability allows post-deployment algorithm updates.
Recommended
Industrial Control and Automation
Stratix FPGAs served in industrial controllers, motion-control systems, and CNC machines where deterministic timing and parallel I/O matter. The EP1S25B672C6N provides 473 I/Os for encoder inputs, PWM outputs, and fieldbus interfaces (Profibus, DeviceNet). Hardware PID loops run in DSP blocks with deterministic latency, while TriMatrix memory stores trajectory tables and lookup data. The commercial-extended temperature grade (0 to 85 C) covers most factory-floor enclosures. For designers maintaining legacy systems, the Stratix family offers proven long-term reliability and toolchain maturity through Altera Quartus II versions that remain available from Intel archives.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25B672C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25B672C6 | EP1S25F672C6N | EP1S25B672C7N | EP1S25F672C7N | EP1S25B672I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Number of LABs | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Number of I/O | 473 | 473 | 473 | 473 | 473 | 473 |
| Speed Grade | C6 (mid-speed) | C6 | C6, faster fabric | C7, slower fabric | C7, faster fabric | C7, industrial temp |
| Temperature Grade | Commercial Extended (0 to 85 C) | Commercial | Commercial Extended | Commercial Extended | Commercial Extended | Industrial (-40 to 100 C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Mid-range Stratix silicon with mature Quartus II toolchain support (vs Cyclone IV EP4CE75F29)
- Identical silicon across all speed-grade variants (vs EP1S25F672C6N)
- Industrial temperature option in same footprint (vs EP1S25B672I7N)
Design Notes
The EP1S25B672C6N requires multiple supply rails: 1.5 V core (VCCINT), 3.3 V or 2.5 V I/O (VCCIO), and separate PLL analog supply (VCCA_PLL) typically at 2.5 V or 1.5 V. Decoupling must include bulk capacitors (47-220 uF) per supply plus 0.1 uF and 0.01 uF high-frequency ceramics at every VCC pin. Power sequencing should bring VCCINT up before or simultaneously with VCCIO to avoid latch-up. Reference the Stratix Family Data Sheet section on PowerPin Connections and Decoupling for layout guidance.
Estimated thermal dissipation for the EP1S25B672C6N depends heavily on toggle rate, utilization, and I/O switching. With 60% utilization at 200 MHz clock and 50% I/O toggle, a typical junction-to-ambient thermal resistance (theta_JA) for a 672-BGA with sufficient PCB thermal vias (12+ vias under the BGA thermal pad region) is around 8-12 C/W. With 10 W internal dissipation, junction temperature rise above ambient is approximately 100 C, requiring airflow or heatsink. Designers should monitor junction temperature via the on-die temperature-sensing diode (Tsd) for safety.
The 672-BGA package requires fanout on at least a 6-layer PCB with 1.27 mm pitch. Use microvia (laser-drilled) stacks for inner-row escape to maintain signal integrity on high-speed LVDS pairs. Matched-length routing within ±50 mil is recommended for differential pairs, and the entire BGA footprint requires a continuous ground plane beneath for return-path integrity. Reference the Altera Stratix Hardware Design Guidelines for board stackup and routing recommendations. Maintain keepout zones around PLL analog supplies to avoid noise injection.
Common pitfalls include: (1) failing to assign clock constraints in Quartus II, leading to poor timing closure; (2) exceeding maximum I/O current per bank (refer to datasheet for bank power limits); (3) configuring dual-purpose pins (e.g., data/byte-enable) without setting them correctly in the configuration scheme; (4) leaving JTAG pins floating - tie TMS high with 10 kohm and provide TCK pull-down per IEEE 1149.1; (5) ignoring MSL (Moisture Sensitivity Level) floor-life requirements for BGA packages - bake before reflow if humidity indicator card is out of spec.
Place configuration device (EPC16 or compatible) within 6 inches of the Stratix DATA pins to avoid signal-integrity issues during configuration. Provide proper JTAG chain access for board-level testability. Keep high-speed LVDS traces on inner layers with continuous reference planes, and route clock signals first with controlled impedance (typically 50 ohm single-ended, 100 ohm differential). Avoid routing signals across split power planes or under noisy clock sources.
Compliance Information
Original Stratix devices predate widespread RoHS documentation; specific date codes must be verified with the supplier. AEC-Q100 is not applicable as this is an industrial/commercial FPGA, not automotive-grade.
