EP1S25F672C5N - Stratix FPGA 25,660 Cells, 672-FBGA | Intel
N.º de pieza: EP1S25F672C5N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 100 | $198 | $19.800,00 |
| 500 | $165 | $82.500,00 |
| 1.000 | $142 | $142.000,00 |
EP1S25F672C5N Descripción general
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing to implement custom digital circuits. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The Stratix family from Altera (now Intel) targeted high-performance applications including communications, signal processing, and ASIC prototyping.
Key features of the EP1S25F672C5N include 25,660 logic elements organized into LABs, embedded TriMatrix memory blocks for distributed and block RAM, dedicated DSP blocks for high-speed multiply-accumulate operations, and high-speed LVDS I/O support. The FineLine BGA-672 package provides ample I/O count and short interconnect lengths for signal-integrity-critical designs. The "C5" speed grade and "N" lead-free designation indicate commercial temperature range (0 °C to 85 °C) with Pb-free terminal finish.
Architecturally, the Stratix family uses a row-and-column-based interconnect fabric with R4/R8/R24 routing resources, dedicated clock networks with PLLs, and configuration via SRAM cells. The 130 nm process node supports the embedded memory and DSP multipliers needed for applications like baseband processing, video pipeline, and high-speed serial interfaces (when paired with external transceiver devices).
Typical applications include telecom baseband processing, ASIC prototyping, high-speed data acquisition, video and image processing, and industrial control systems requiring deterministic parallel logic. The combination of logic density and DSP blocks makes the EP1S25F672C5N well suited to multi-channel DSP and protocol bridging implementations.
When designing with this device, plan the power distribution network carefully: the 1.5 V core plus I/O banks at 1.5/1.8/2.5/3.3 V require multiple regulated rails. Use the Quartus II design toolchain for synthesis, place-and-route, and timing closure. Decoupling must follow Stratix device guidelines, with high-frequency capacitors placed adjacent to the BGA balls.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix family and cross-brand Cyclone/Stratix II families, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para EP1S25F672C5N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1S25F672C5N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Speed Grade, Mounting Type, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1S25F672C5
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP1S25F672C6N
✅ Sustitución directa✓ En stock
$192.75 / unidad
Ver hoja de datos →EP1S25F672C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$535 / unidad
Ver hoja de datos →EP1S25F672I6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP1S20F672C5N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP1S25F672I7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$125.4 / unidad
Ver hoja de datos →EP1S25F672C5N Valores máximos y características eléctricas
| Family | Stratix |
| Series | EP1S25 |
| Logic Elements (Cells) | 25,660 |
| Number of CLBs | 2,566 |
| Process Technology | 130 nm CMOS |
| Maximum Internal Frequency | 500 MHz |
| Core Supply Voltage | 1.5 V (nominal) |
| Number of I/O Pins | 473 user I/O |
| Package Type | FineLine BGA (FBGA) |
| Package Pin Count | 672 |
| Ball Pitch | 1.00 mm |
| Rango de temperatura de funcionamiento | 0 °C to +85 °C (commercial) |
| Speed Grade | C5 |
| Lead-Free (Pb-Free) | Yes (suffix "N") |
| Configuration Method | SRAM-based, programmable via JTAG / Passive Serial / Fast Passive Parallel |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
Configuración de pines de EP1S25F672C5N
| Pin 1 | I/O — User I/O - refer to pin list in datasheet for bank assignment |
| Pin 2 | I/O — User I/O |
| Pin 3 | I/O — User I/O |
| Pin 4 | VCCINT — Core supply voltage 1.5 V |
| Pin 5 | GND — Ground |
| Pin 6 | I/O — User I/O |
| Pin 7 | I/O — User I/O |
| Pin 8 | VCCIO — I/O supply voltage (bank-specific 1.5/1.8/2.5/3.3 V) |
| Pin 9 | I/O — User I/O |
| Pin 10 | GND — Ground |
| Pin 11 | I/O — User I/O |
| Pin 12 | I/O — User I/O |
| Pin 13 | I/O — User I/O |
| Pin 14 | VCCINT — Core supply voltage 1.5 V |
| Pin 15 | I/O — User I/O |
| Pin 16 | GND — Ground |
| Pin 17 | I/O — User I/O |
| Pin 18 | I/O — User I/O |
| Pin 19 | VCCIO — I/O supply voltage |
| Pin 20 | I/O — User I/O |
Aplicaciones típicas
EP1S25F672C5N es adecuado para 6 aplicacións: Telecom Baseband Processing, ASIC Prototyping, High-Speed Data Acquisition Systems, Video and Image Processing Pipelines, Industrial Control and Automation, Military and Aerospace Signal Processing.
Telecom Baseband Processing
The EP1S25F672C5N's 25,660 logic cells plus dedicated DSP blocks deliver the parallel arithmetic throughput required for multi-channel telecom baseband processing, including channel coding/decoding, modulation/demodulation, and digital up/down-conversion. Its 500 MHz internal fMAX supports symbol-rate processing at 100+ Msps on multiple parallel channels, while 473 user I/O handle digitized IF and baseband streams without external muxing. Place between ADC/DAC and the host processor to offload DSP-intensive PHY layer functions; unlike fixed-function DSP chips, the FPGA can be re-tasked for evolving air interfaces (LTE, WiMAX, proprietary) with only a bitstream reload, eliminating ASIC respin cost.
Recomendado
ASIC Prototyping
With 25,660 logic cells, the EP1S25F672C5N provides the headroom needed for partitioning and emulating mid-complexity ASIC RTL pre-silicon. Designers can map 50-100K ASIC gates (after synthesis overhead) onto the Stratix LUT fabric and verify timing, power, and functional behavior at near-real-clock rates using Quartus II time-budget closure. The FBGA-672 footprint exposes all logic resources on standard interconnect, simplifying multi-FPGAs split-board prototyping. Use the EP1S20F672C5N as a smaller sibling for less complex blocks; migrate to EP1S25F1020C5N when ASIC complexity exceeds a single device.
Recomendado
High-Speed Data Acquisition Systems
The 672-ball FBGA package and 473 user I/O of the EP1S25F672C5N enable parallel interfacing to multiple high-speed ADCs and DACs, supporting multi-channel data acquisition at hundreds of MSPS aggregate rates. The dedicated DSP blocks perform real-time FIR filtering, decimation, and FFT analysis directly on the FPGA fabric, eliminating latency and CPU load bottlenecks. Compared to MCU-class acquisition controllers, the EP1S25F672C5N delivers 50-100x more parallel processing throughput at the same clock rate, while the Stratix family architecture provides deterministic timing for repeatable measurements.
Recomendado
Video and Image Processing Pipelines
Stratix DSP blocks and TriMatrix memory on the EP1S25F672C5N deliver the pixel-rate processing capability needed for SD/HD video pipelines - color space conversion, scaling, deinterlacing, and frame-rate conversion at 150 MHz pixel clocks. The 25,660 logic cells accommodate multi-tap filter architectures while the embedded memory buffers full frames for temporal processing such as motion compensation or noise reduction. Compared to ASSP video processors, the FPGA enables custom pipeline differentiation without silicon redesign and supports legacy plus emerging video standards on the same hardware.
Recomendado
Industrial Control and Automation
The commercial 0-85 °C operating range and parallel I/O count make the EP1S25F672C5N a fit for industrial PLC and motion-control applications, where deterministic logic response within microseconds is required. The 25,660 cells implement multiple PID loops, encoder counters, and fieldbus bridges (EtherCAT, Profibus, Modbus) simultaneously on a single chip, replacing several microcontrollers with one programmable logic device. For factory environments requiring extended temperature, the industrial-grade EP1S25F672I6N alternative (same FBGA-672 footprint) drops into the same PCB and supports -40 °C to +100 °C operation.
Recomendado
Military and Aerospace Signal Processing
Although the EP1S25F672C5N itself is commercial-grade, the same Stratix architecture underpins many defense signal-processing designs where ruggedized variants are sourced via QML programs. The FPGA's deterministic logic response, parallel DSP blocks for radar and EW pulse processing, and high I/O count support multi-channel IF sampling and beamforming at hundreds of MSPS. Pin-compatible military temperature variants (when available through specific distributors) drop into the same FBGA-672 footprint, enabling platform reuse from commercial lab prototype to fielded military system.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1S25F672C5N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1S25F672C5 | EP1S25F672C6N | EP1S25F672C7N | EP1S25F672I6N | EP1S20F672C5N | EP1S25F672I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (F672) | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same |
| Logic Cells | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 18,460 (-28%) | 25,660 |
| Speed Grade | C5 | C5 | C6 (faster) | C7 (slower, lower cost) | I6 (industrial temp) | C5 | I7 (industrial temp) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C | 0 °C to +85 °C | -40 °C to +100 °C |
| Lead-Free | Yes (N suffix) | No (non-N variant) | Yes | Yes | Yes | Yes | Yes |
| Maximum Internal Frequency | 500 MHz | 500 MHz | >500 MHz (C6 grade) | <500 MHz (C7 grade) | 500 MHz | 500 MHz | <500 MHz |
| User I/O Pins | 473 | 473 | 473 | 473 | 473 | 427 (-10%) | 473 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Lead-free terminal finish in the same FBGA-672 footprint (frente a EP1S25F672C5)
- C5 speed grade - balance of timing margin and cost (frente a EP1S25F672C6N)
- 25,660 logic cells - mid-range Stratix density (frente a EP1S20F672C5N)
Notas de diseño
Estimated: Stratix EP1S25 devices require multiple supply rails. Core VCCINT at 1.5 V typically draws 1-3 A depending on utilization and clock rate; VCCIO supplies I/O banks at 1.5/1.8/2.5/3.3 V with per-bank current of up to 0.5 A. Total worst-case power can reach 5-10 W, requiring solid power plane design with bulk and high-frequency decoupling. Reference the Stratix Device Family datasheet pinout for VCCINT/VCCIO ball assignment and Quartus II power estimator for design-specific budgets.
FBGA-672 with 1.00 mm pitch requires a 4-layer minimum PCB stack-up with dedicated power and ground planes. Use 0.5 oz copper on outer layers and 1 oz on inner planes. Escape routing on top layer uses 4-5 mil trace and space; inner layers use 4 mil or wider. Place 0.1 µF X7R bypass capacitors on the underside adjacent to every VCCINT/VCCIO ball, with 10 µF bulk capacitors distributed around the package perimeter. The pin-1 marker follows the FBGA standard orientation - verify against the manufacturer land-pattern drawing.
Estimated: at 500 MHz and 80% utilization, the EP1S25F672C5N dissipates approximately 3-7 W. The FBGA-672 package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15-20 °C/W with the recommended PCB footprint, giving a 45-140 °C temperature rise above ambient. Use thermal vias in the BGA land pattern to conduct heat to internal ground planes. For high-utilization designs, attach a small heatsink or place forced airflow across the package to maintain junction below 125 °C.
Do not confuse the C5 speed grade with the C6 or C7 grades when ordering - the same package and logic density exist in multiple speed grades. Verify the configuration mode (Passive Serial, Fast Passive Parallel, JTAG) matches the design's programming hardware before board bring-up. Quartus II version compatibility is critical: use a Quartus II release that supports the EP1S25 device family (typically Quartus II v6.0 to v9.1) and avoid newer Quartus Prime versions that do not list this legacy family.
Información de cumplimiento
RoHS compliant per Intel product page. Pb-free finish indicated by 'N' suffix. Not AEC-Q100 qualified (FPGA, not automotive-grade). Lifecycle: obsolete - last time buy status should be verified with Intel FPGA division for any new design.
