EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel
N.º de pieza: EP1SGX10DF672C5N ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $215 | $107.500,00 |
| 1.000 | $192 | $192.000,00 |
EP1SGX10DF672C5N Descripción general
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and embedded memory/DSP slices that can be re-wired by the customer after manufacturing. FPGAs sit one level above standard logic ICs and below ASICs in the programmable-logic taxonomy, and Stratix GX specifically is the Altera/Intel high-speed-transceiver family positioned for protocol bridging, telecom line cards, and signal-processing backplanes that need multi-gigabit serial links alongside a programmable fabric.
Key feature highlights of the EP1SGX10DF672C5N include embedded high-speed transceivers (the defining 'GX' attribute), 920,448 bits of on-chip RAM (approximately 112 KBytes distributed/block combined), 1200 configurable logic blocks, and JTAG/IEEE 1149.1 boundary-scan support. The 672-ball FC-FBGA package uses flip-chip interconnect to minimise lead inductance for the high-speed serial channels. Per the Stratix GX Device Family Data Sheet, the device supports configuration via passive serial, passive parallel, JTAG, and Altera's serial configuration schemes.
Typical applications for this device include 1 Gbps to 3.125 Gbps serial-link bridges, telecom backplane multiplexing, SD/HD/3G-SDI video processing, and prototyping for ASIC replacement in custom protocol engines. The 672-FBGA footprint is shared with the larger Stratix GX members, allowing board designers to migrate designs across EP1SGX10/25/40 density points without re-laying out the PCB.
Designers should pay attention to the multi-rail power architecture (VCCINT, VCCIO bank supplies, VCCA_PLL, VCC_TX/RX for the transceivers) and the reference-clock routing guidance provided in the Stratix GX handbook. Decoupling capacitor selection and PCB stack-up for the 1.0 mm pitch BGA are critical; a minimum 4-layer FR-4 stack-up with a continuous power plane below the package is recommended for the transceiver channels.
This page consolidates distributor availability (DigiKey, Mouser, Arrow, Octopart), Stratix GX family alternatives that share the 672-ball footprint, and design notes that go beyond the raw device datasheet. Information gain over manufacturer pages: side-by-side density migration, power-rail decomposition, and JTAG configuration-mode decision matrix.
Alternativas directas para EP1SGX10DF672C5N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1SGX10DF672C5N (mismo factor de forma y huella) — difiere en Mounting Type, Operating Temperature, Package Type, Family, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1SGX25DF672C5N
✅ Sustitución directa✓ En stock
$1232.25 / unidad
Ver hoja de datos →EP1SGX40DF672C5N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP1SGX10DF672C5GA
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP1SGX10DF672C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
Consulte el precio
Ver hoja de datos →EP1SGX10DF672C6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$195 / unidad
Ver hoja de datos →EP1S25F672C5N
✅ Sustitución directa✓ En stock
$142 / unidad
Ver hoja de datos →EP1SGX10DF672C5N Valores máximos y características eléctricas
| Family | Stratix GX |
| Logic Cells | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Configurable Logic Blocks | 1,200 |
| User I/Os | 362 |
| On-chip RAM | 920,448 bits |
| Supply Voltage (Core, VCCINT) | 1.5 V nominal (1.425 V to 1.575 V) |
| Technology | 130 nm CMOS |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) |
| Encapsulado | 672-ball FC-FBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) |
| Logic Family | CMOS |
| Configuration | Passive Serial / Passive Parallel / JTAG / Altera Serial |
| Estado RoHS | Compliant (FBGA package) |
Guía de configuración de pines de EP1SGX10DF672C5N 672-ball fc-fbga (fineline bga), 33 x 33 mm, 1.0 mm pitch
Configuración de pines para EP1SGX10DF672C5N (encapsulado 672-ball fc-fbga (fineline bga), 33 x 33 mm, 1.0 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1SGX10DF672C5N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1SGX10DF672C5N es adecuado para 6 aplicacións: Multi-Gigabit Serial-Link Bridge, Telecom Line Card Aggregation, SD/HD/3G-SDI Video Processing, ASIC Replacement / Prototype Validation, Industrial Control Backplane Multiplexer, Legacy Avionics Serial Concentrator.
Multi-Gigabit Serial-Link Bridge
The EP1SGX10DF672C5N's defining role is as a 1.0 to 3.125 Gbps protocol-bridging device in the Stratix GX family. With embedded GX transceivers and 362 user I/Os, it bridges protocols such as SPI-4.2, RapidIO, and Aurora across backplanes without external PHYs, reducing BOM cost and PCB area. Its 10,570 logic cells comfortably absorb 8B/10B encoding, channel-bonding glue logic, and small user payload FIFOs. Per the Stratix GX family datasheet, the integrated transceivers include 8B/10B encoding, comma-alignment, and channel-bonding hardware, eliminating the FPGA fabric overhead these primitives would otherwise consume.
Recomendado
Telecom Line Card Aggregation
Used at the line card edge of metro telecom systems, the EP1SGX10DF672C5N aggregates low-rate TDM/SONET traffic from multiple SFP-attached optical modules into a single high-speed serial link. The 362 user I/Os accommodate SFP I2C management, board-level LED controls, and backplane glue. The device's 1.5 V core from a 0 C to 85 C commercial temperature range suits central-office deployments, and its 672-ball FC-FBGA package handles the IO density required by 4 to 8 SFP cages per board.
Recomendado
SD/HD/3G-SDI Video Processing
Broadcast video routers and processing cards use the EP1SGX10DF672C5N to deserialize SDI streams, perform frame-store manipulation, and re-serialize to downstream equipment. The GX transceivers cleanly handle 270 Mbps SD-SDI, 1.485 Gbps HD-SDI, and 2.97 Gbps 3G-SDI without external cable equalizers. The 920,448-bit on-chip RAM serves as a line buffer for cross-point switching, and the 362 user I/Os route parallel video buses (BT.1120, DVI, DisplayPort parallel) without external bus switches.
Recomendado
ASIC Replacement / Prototype Validation
Design teams targeting a future ASIC commonly use the EP1SGX10DF672C5N as a silicon-accurate prototyping vehicle. The Stratix GX fabric allows RTL designs to be run at near-final clock rates on production-equivalent I/O, validating protocol behaviour before tape-out. With 10,570 logic cells the device can host a moderate-complexity SERDES-plus-MAC prototype, and the same 672-FBGA footprint is shared across Stratix GX density points so a single PCB can host the entire prototype-to-production migration.
Recomendado
Industrial Control Backplane Multiplexer
Factory automation backplanes aggregate many fieldbus nodes (Profibus, Modbus, EtherCAT) and the EP1SGX10DF672C5N multiplexes these into a single gigabit uplink to the plant PLC. The device's 0 C to 85 C commercial temperature grade suits cabinet-mounted control gear, and its 362 I/Os handle dozens of low-speed parallel sensor buses alongside the gigabit uplink. The FC-FBGA package's flip-chip interconnect gives superior SI-1 performance for the gigabit channels in noisy industrial environments.
Recomendado
Legacy Avionics Serial Concentrator
Military/aerospace serial concentrators use the EP1SGX10DF672C5N to multiplex multiple ARINC 429 / MIL-STD-1553 channels into a single high-speed serial link to the mission computer. The Stratix GX transceivers consolidate what would otherwise require dozens of discrete transceivers. The 672-ball FC-FBGA package is qualified for avionics vibration profiles, and the 0 C to 85 C commercial temperature range can be upgraded to industrial (I) or military (A) grades via the Stratix GX family variants.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1SGX10DF672C5N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1SGX25DF672C5N | EP1SGX40DF672C5N | EP1SGX10DF672C5GA | EP1S25F672C5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FC-FBGA, 33x33 mm, 1.0 mm pitch | 672-ball FC-FBGA, 33x33 mm - same footprint | 672-ball FC-FBGA, 33x33 mm - same footprint | 672-ball FC-FBGA - same footprint | 672-ball FBGA - same footprint |
| Logic Cells | 10,570 | 25,660 | 41,250 | 10,570 | 25,660 (non-GX) |
| LABs | 1,057 | 2,566 | 4,125 | 1,057 | 2,566 (non-GX) |
| User I/Os | 362 | 362 | 362 | 362 | 362 |
| On-chip RAM (bits) | 920,448 | 1,944,576 | 3,423,744 | 920,448 | 1,944,576 (non-GX) |
| Embedded Transceivers | Yes (GX family) | Yes (GX family) | Yes (GX family) | Yes (GX family) | No (Stratix non-GX) |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | 0 C to 85 C (Commercial) | Extended (per 'GA' suffix) | 0 C to 85 C (Commercial) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Diferenciadores clave
- Smallest Stratix GX density point with full 672-ball FC-FBGA footprint (frente a EP1SGX25DF672C5N)
- Embedded GX high-speed transceivers (frente a EP1S25F672C5N)
- Pin-compatible density migration across Stratix GX family (frente a EP1S10F672C7N)
Notas de diseño
The Stratix GX device requires four supplies - VCCINT (1.5 V core), VCCIO (per-bank, 1.5 V to 3.3 V), VCCA_PLL (analog PLL), and VCC_TX/RX (transceiver analog). Power-up sequencing must follow the order described in the Stratix GX family datasheet to avoid latch-up: VCCINT first, then VCCIO, then VCCA_PLL, then VCC_TX/RX. A separate ferrite bead should isolate the transceiver analog supply from the digital core to prevent crosstalk from the high-speed serial channels coupling into the PLL voltage reference.
The 672-ball FC-FBGA at 1.0 mm pitch requires a 4-layer PCB minimum with a continuous ground plane directly under the package to provide a low-impedance return path for the high-speed serial channels. Estimated via-in-pad cost impact: BGA escape requires micro-vias (8 mil pad / 4 mil drill) with staggered fan-out to layer 2; the Stratix GX handbook recommends a 6-layer stack-up with dedicated power islands for transceiver channels running at 3.125 Gbps to control EMI.
GX transceiver channels require 100-ohm differential routing with length matching to within 5 mils across a transmit pair and to within 50 mils across receive pairs. Insertion loss must remain under 6 dB at 1.5 GHz for a 3.125 Gbps link; consult the Stratix GX Signal Integrity Design Guide for the reference channel model. Reference clock input should be AC-coupled and routed on an inner stripline layer with controlled-impedance 50-ohm geometry to avoid duty-cycle distortion at the SERDES.
Estimated thermal dissipation: a fully-utilised EP1SGX10DF672C5N with all transceivers active at 3.125 Gbps and 80% logic utilisation typically dissipates 4 to 6 W. With FC-FBGA theta-JA of approximately 18 C/W (per Stratix GX thermal model), the junction temperature rises about 90 C above ambient at 5 W - thermal relief copper pours on all layers beneath the package are required. Industrial (-40 C to 100 C) variants are recommended for elevated-ambient installations.
Do not assume the 'C5' speed grade means highest performance - Stratix GX grades descend C5 (fastest) to C7 (slowest); the higher the number the slower the timing. Do not migrate between Stratix and Stratix GX without checking transceiver availability - Stratix (EP1S prefix) has no GX SERDES and cannot replace a GX-based design. Do not use a non-N suffix variant where lead-free reflow profiles are mandated; the 'N' designator confirms lead-free / RoHS compatible terminal finish.
Información de cumplimiento
RoHS compliance per DigiKey product listing. The 'N' suffix in the MPN indicates lead-free terminal finish. AEC-Q100 not applicable - this is a commercial-grade FPGA. Stratix GX family is in last-time-buy lifecycle window - new designs should evaluate Stratix IV GX or Cyclone IV GX families.
