EP1S40F780C5 - Stratix 41,250-LUT FPGA, 780-FBGA | Intel / Altera
N.º de pieza: EP1S40F780C5 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $228.5 | $2.285,00 |
| 100 | $199 | $19.900,00 |
| 500 | $175 | $87.500,00 |
| 1.000 | $158 | $158.000,00 |
EP1S40F780C5 Descripción general
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O cells. Within the wider taxonomy, the EP1S40F780C5 sits at FPGA > programmable logic > programmable ASIC > logic IC > integrated circuit. Stratix-family FPGAs target high-performance DSP, communications, and ASIC-prototyping workloads where high logic density, embedded memory, and DSP throughput are needed without committing to a mask-programmed ASIC.
Key features include 41,250 logic elements, 3,423,744 embedded RAM bits (3.4 Mbit), 12 DSP blocks, up to 615 user I/O pins, and dedicated high-speed transceivers. The FBGA-780 package is a 29 x 29 mm FineLine BGA with 1.0 mm ball pitch, supporting dense board integration in multi-layer PCBs. Compared with later Stratix II/III/IV parts, the EP1S40 trades per-LUT performance and power efficiency for proven maturity, low unit cost on the secondary market, and a large installed base.
Architecturally, the Stratix family combines a four-input LUT-based logic fabric (each LUT feeding an adjacent LE register) with embedded TriMatrix memory (MLAB, M512, M4K, M-RAM blocks) and dedicated multiplier/accumulator DSP blocks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across multiple I/O banks, with on-chip PLLs for clock management and skew control. Configuration is typically loaded from an external EPC serial configuration device via the Active Serial interface or via JTAG for development.
Typical applications include high-throughput DSP pipelines (radar, software-defined radio, baseband), communications infrastructure (bridges, framer/mapper designs), ASIC prototyping and emulation, and test and measurement instruments. The EP1S40F780C5 is also commonly used in industrial imaging, video processing, and military/aerospace systems where extended-temperature FPGAs are required.
When designing with this device, plan for a configuration flash (such as EPC16 or EPC64) and decoupling per Stratix Hardware Reference Manual guidance; maintain continuous ground reference under the BGA fan-out, and confirm Quartus II version compatibility, since newer Quartus releases have dropped legacy device support. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para EP1S40F780C5 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1S40F780C5 (mismo factor de forma y huella) — difiere en Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1S40F780C6
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$125 / unidad
Ver hoja de datos →EP1S40F780C7N
✅ Sustitución directa✓ En stock
$99.5 / unidad
Ver hoja de datos →EP1S40F780C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP1S30F780C5
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP1S30F780C6
✅ Sustitución directa✓ En stock
$1125 / unidad
Ver hoja de datos →EP1S25F780C5
✅ Sustitución directa✓ En stock
$1249.5 / unidad
Ver hoja de datos →EP1S40F780C5 Valores máximos y características eléctricas
| Series | Stratix (EP1S40) |
| Family | Stratix |
| Logic Elements (LE) | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,697 |
| Embedded RAM Bits | 3,423,744 bits (3.4 Mbit) |
| Embedded Multiplier / DSP Blocks | 12 DSP blocks |
| Maximum User I/O | 615 |
| Process Technology | 130 nm CMOS |
| Encapsulado | 780-ball FBGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount |
| Temperature Grade | Commercial Extended |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG |
| Supply Voltage - Core | 1.5 V (typical) |
| Estado RoHS | Non-compliant per ICComponents listing |
Guía de configuración de pines de EP1S40F780C5 780-ball fbga (fbga-780), 29 x 29 mm, 1.0 mm pitch
Configuración de pines para EP1S40F780C5 (encapsulado 780-ball fbga (fbga-780), 29 x 29 mm, 1.0 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1S40F780C5.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1S40F780C5 es adecuado para 7 aplicacións: Telecommunications Baseband Processing, Software Defined Radio (SDR), ASIC Prototyping and Emulation, High-Performance DSP Pipelines, Industrial Imaging and Video Processing, Test and Measurement Instrumentation, Military and Aerospace Embedded Systems.
Telecommunications Baseband Processing
The EP1S40F780C5's 41,250 logic elements and 12 dedicated DSP blocks make it well suited for telecom baseband line cards where parallel channel processing must be done in real time. Its embedded TriMatrix memory (3.4 Mbit) and 615 user I/Os accommodate multi-channel framer/mapper designs, while the 130 nm CMOS process keeps per-unit cost low for volume line-card deployments. The FBGA-780 package supplies dense I/O for backplane interfacing. Designers can implement FEC, scrambling, and constellation mapping in DSP blocks, leaving the LE fabric for control-plane glue logic.
Recomendado
Software Defined Radio (SDR)
For SDR platforms targeting baseband downconversion, channelization, and demodulation, the EP1S40F780C5 provides ample logic and DSP blocks to handle multi-MHz bandwidth channels in parallel. Its 12 DSP blocks run 9 x 9-bit MAC operations per cycle, ideal for FIR filters and CORDIC rotator stages. The 3.4 Mbit of embedded RAM stages samples and coefficients without external memory stalls. With Quartus II IP libraries for FFTs and digital downconverters, designers can prototype SDR chains quickly.
Recomendado
ASIC Prototyping and Emulation
The high logic density (41,250 LEs) and abundant interconnect of the EP1S40F780C5 make it a strong candidate for ASIC prototyping where multiple FPGA boards are cascaded to emulate multi-million-gate ASICs. Its 615 user I/Os enable wide chip-to-chip partitioning buses, and the commercial-extended temperature grade suits lab and bench environments. Quartus II provides partitioning and incremental compilation flows that map ASIC RTL onto the EP1S40 fabric with good QoR. Per the Stratix Handbook, the TriMatrix memory helps replicate register-file and FIFO behavior for accurate ASIC timing emulation.
Recomendado
High-Performance DSP Pipelines
The 12 DSP blocks of the EP1S40F780C5 deliver 9-bit signed multiplication with accumulation, supporting vector dot-products, FFT butterflies, and matrix transforms used in radar, imaging, and instrumentation pipelines. With 41,250 LEs available for control logic and FIFOs, the device can host both datapath and supervisory state machines on a single chip. The FBGA-780's 1.0 mm pitch balances routability and manufacturing yield. Designers targeting higher DSP throughput often migrate to Stratix II/III families, but the EP1S40 remains a cost-effective choice for many mid-bandwidth DSP tasks.
Recomendado
Industrial Imaging and Video Processing
The EP1S40F780C5's 41,250 LEs and 3.4 Mbit embedded RAM support real-time pixel pipelines for machine-vision cameras, frame grabbers, and video format converters. Its 615 user I/Os accommodate Camera Link, LVDS, and parallel RGB interfaces at typical pixel clock rates of 65-85 MHz, well within Stratix I performance. The commercial-extended temperature grade suits factory-floor enclosures. Quartus II IP for SDRAM controllers and color-space converters shortens time-to-prototype for imaging OEMs migrating from ASICs.
Recomendado
Test and Measurement Instrumentation
Test and measurement instruments benefit from the EP1S40F780C5's combination of logic density, embedded RAM, and flexible I/O. The 615 user I/Os handle multiple data-acquisition channels, while the DSP blocks accelerate FFT-based spectrum analysis and digital filtering. The FBGA-780 package supports dense multi-layer PCBs typical of oscilloscope and logic-analyzer mainboards. Designers can implement custom trigger logic, time-interleaved ADC interfaces, and protocol decoding in the LE fabric while offloading math-intensive kernels to DSP blocks for high real-time throughput.
Recomendado
Military and Aerospace Embedded Systems
Although the EP1S40F780C5 itself is rated commercial-extended, its FBGA-780 variant is widely used in military and aerospace subsystems that require high logic density in a compact footprint. Its 41,250 LEs and 3.4 Mbit embedded RAM support ruggedized DSP, encryption pre-processing, and navigation algorithms. The Stratix I silicon has a long in-service track record in defense electronics. Customers in this segment typically pair the FPGA with industrial-temperature grade configuration flashes and apply upscreen testing to meet program-specific reliability requirements.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1S40F780C5 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1S40F780C6 | EP1S40F780C7N | EP1S40F780C5N | EP1S30F780C5 | EP1S30F780C6 | EP1S25F780C5 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-780 | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 41,250 | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 33,880 | 33,880 | 25,660 |
| Speed Grade | C5 (standard) | C6 (slower) | C7 (slowest, lead-free) | C5 (standard, lead-free) | C5 | C6 | C5 |
| RoHS Status | Non-compliant (lead-bearing BGA) | Non-compliant (typical) | Likely lead-free (N suffix) | Lead-free (N suffix) | Non-compliant (typical) | Non-compliant (typical) | Non-compliant (typical) |
Diferenciadores clave
- Standard (fastest) C5 speed grade in Stratix I family (frente a EP1S40F780C6)
- Highest density in 780-FBGA Stratix I lineup (frente a EP1S30F780C5)
- Mature silicon with broad Quartus II IP library support (frente a Stratix II (EP2S series))
Notas de diseño
Estimated: at typical Stratix I operating conditions (VCCINT = 1.5 V, VCCIO = 3.3 V, 100 MHz logic activity), the EP1S40F780C5 draws approximately 1.5-2.5 W dynamic plus static. Apply at least four 100 uF bulk capacitors near the BGA, plus 0.1 uF / 0.01 uF decoupling per VCC pin pair. Stratix power calculator (Excel-based) should be run post place-and-route to confirm worst-case ICCINT and ICCIO before committing to a regulator budget.
The FBGA-780 with 1.0 mm pitch demands a 4+ layer PCB with continuous ground and power planes. Per the Stratix Hardware Reference Manual, fan-out the BGA on the top layer with microvias to inner signal layers, and stitch the ground plane with a via grid under the package to suppress return-path inductance. Maintain a minimum 0.4 mm drill-to-copper clearance and use ENIG or OSP surface finish for reliable BGA solder joints.
Stratix I is no longer supported in current Quartus Prime releases - Quartus II 13.0sp1 or 13.1 is the latest verified toolchain. Confirm your synthesis, place-and-route, and simulation flows are pinned to a compatible version. When migrating from C5 to C6/C7 speed grades, re-validate timing closure, since Fmax decreases and several pipelined paths may need adjustment.
Estimated: at 2 W dissipation in still air, the FBGA-780 with theta_JA around 12-15 C/W (typical JEDEC test board) yields a junction temperature rise of 24-30 C above ambient. For closed enclosures without forced airflow, attach a heatsink or thermal pad to the package top, or specify a 6-layer board with copper pours under the BGA. Industrial-grade variants (EP1S40F780I6) extend the operating range to -40 C to +100 C junction.
Información de cumplimiento
Per ICComponents distributor listing, EP1S40F780C5 is RoHS non-compliant (lead-bearing BGA balls typical of early-2000s Altera parts). The N-suffix variants (e.g., EP1S40F780C5N, EP1S40F780C7N) are typically lead-free. REACH, halogen-free, and conflict-minerals compliance were not stated in the verified data; confirm with distributor documentation before procurement.
