EP1S40F780C5 - Stratix 41,250-LUT FPGA, 780-FBGA | Intel / Altera
부품 번호: EP1S40F780C5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $228.5 | $2,285.00 |
| 100 | $199 | $19,900.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $158 | $158,000.00 |
EP1S40F780C5 개요
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O cells. Within the wider taxonomy, the EP1S40F780C5 sits at FPGA > programmable logic > programmable ASIC > logic IC > integrated circuit. Stratix-family FPGAs target high-performance DSP, communications, and ASIC-prototyping workloads where high logic density, embedded memory, and DSP throughput are needed without committing to a mask-programmed ASIC.
Key features include 41,250 logic elements, 3,423,744 embedded RAM bits (3.4 Mbit), 12 DSP blocks, up to 615 user I/O pins, and dedicated high-speed transceivers. The FBGA-780 package is a 29 x 29 mm FineLine BGA with 1.0 mm ball pitch, supporting dense board integration in multi-layer PCBs. Compared with later Stratix II/III/IV parts, the EP1S40 trades per-LUT performance and power efficiency for proven maturity, low unit cost on the secondary market, and a large installed base.
Architecturally, the Stratix family combines a four-input LUT-based logic fabric (each LUT feeding an adjacent LE register) with embedded TriMatrix memory (MLAB, M512, M4K, M-RAM blocks) and dedicated multiplier/accumulator DSP blocks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across multiple I/O banks, with on-chip PLLs for clock management and skew control. Configuration is typically loaded from an external EPC serial configuration device via the Active Serial interface or via JTAG for development.
Typical applications include high-throughput DSP pipelines (radar, software-defined radio, baseband), communications infrastructure (bridges, framer/mapper designs), ASIC prototyping and emulation, and test and measurement instruments. The EP1S40F780C5 is also commonly used in industrial imaging, video processing, and military/aerospace systems where extended-temperature FPGAs are required.
When designing with this device, plan for a configuration flash (such as EPC16 or EPC64) and decoupling per Stratix Hardware Reference Manual guidance; maintain continuous ground reference under the BGA fan-out, and confirm Quartus II version compatibility, since newer Quartus releases have dropped legacy device support. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: EP1S40F780C5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S40F780C5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S40F780C6
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$125 / 개
데이터시트 보기 →EP1S40F780C7N
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →EP1S40F780C5N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP1S30F780C5
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1S30F780C6
✅ 드롭인✓ 재고 있음
$1125 / 개
데이터시트 보기 →EP1S25F780C5
✅ 드롭인✓ 재고 있음
$1249.5 / 개
데이터시트 보기 →EP1S40F780C5 최대 정격 & 전기적 특성
| Series | Stratix (EP1S40) |
| Family | Stratix |
| Logic Elements (LE) | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,697 |
| Embedded RAM Bits | 3,423,744 bits (3.4 Mbit) |
| Embedded Multiplier / DSP Blocks | 12 DSP blocks |
| Maximum User I/O | 615 |
| Process Technology | 130 nm CMOS |
| 패키지 | 780-ball FBGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount |
| Temperature Grade | Commercial Extended |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG |
| Supply Voltage - Core | 1.5 V (typical) |
| RoHS 상태 | Non-compliant per ICComponents listing |
EP1S40F780C5 780-ball fbga (fbga-780), 29 x 29 mm, 1.0 mm pitch 핀 구성 가이드
EP1S40F780C5(780-ball fbga (fbga-780), 29 x 29 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S40F780C5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S40F780C5 적합 용도: 7 애플리케이션s: Telecommunications Baseband Processing, Software Defined Radio (SDR), ASIC Prototyping and Emulation, High-Performance DSP Pipelines, Industrial Imaging and Video Processing, Test and Measurement Instrumentation, Military and Aerospace Embedded Systems.
Telecommunications Baseband Processing
The EP1S40F780C5's 41,250 logic elements and 12 dedicated DSP blocks make it well suited for telecom baseband line cards where parallel channel processing must be done in real time. Its embedded TriMatrix memory (3.4 Mbit) and 615 user I/Os accommodate multi-channel framer/mapper designs, while the 130 nm CMOS process keeps per-unit cost low for volume line-card deployments. The FBGA-780 package supplies dense I/O for backplane interfacing. Designers can implement FEC, scrambling, and constellation mapping in DSP blocks, leaving the LE fabric for control-plane glue logic.
추천
Software Defined Radio (SDR)
For SDR platforms targeting baseband downconversion, channelization, and demodulation, the EP1S40F780C5 provides ample logic and DSP blocks to handle multi-MHz bandwidth channels in parallel. Its 12 DSP blocks run 9 x 9-bit MAC operations per cycle, ideal for FIR filters and CORDIC rotator stages. The 3.4 Mbit of embedded RAM stages samples and coefficients without external memory stalls. With Quartus II IP libraries for FFTs and digital downconverters, designers can prototype SDR chains quickly.
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ASIC Prototyping and Emulation
The high logic density (41,250 LEs) and abundant interconnect of the EP1S40F780C5 make it a strong candidate for ASIC prototyping where multiple FPGA boards are cascaded to emulate multi-million-gate ASICs. Its 615 user I/Os enable wide chip-to-chip partitioning buses, and the commercial-extended temperature grade suits lab and bench environments. Quartus II provides partitioning and incremental compilation flows that map ASIC RTL onto the EP1S40 fabric with good QoR. Per the Stratix Handbook, the TriMatrix memory helps replicate register-file and FIFO behavior for accurate ASIC timing emulation.
추천
High-Performance DSP Pipelines
The 12 DSP blocks of the EP1S40F780C5 deliver 9-bit signed multiplication with accumulation, supporting vector dot-products, FFT butterflies, and matrix transforms used in radar, imaging, and instrumentation pipelines. With 41,250 LEs available for control logic and FIFOs, the device can host both datapath and supervisory state machines on a single chip. The FBGA-780's 1.0 mm pitch balances routability and manufacturing yield. Designers targeting higher DSP throughput often migrate to Stratix II/III families, but the EP1S40 remains a cost-effective choice for many mid-bandwidth DSP tasks.
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Industrial Imaging and Video Processing
The EP1S40F780C5's 41,250 LEs and 3.4 Mbit embedded RAM support real-time pixel pipelines for machine-vision cameras, frame grabbers, and video format converters. Its 615 user I/Os accommodate Camera Link, LVDS, and parallel RGB interfaces at typical pixel clock rates of 65-85 MHz, well within Stratix I performance. The commercial-extended temperature grade suits factory-floor enclosures. Quartus II IP for SDRAM controllers and color-space converters shortens time-to-prototype for imaging OEMs migrating from ASICs.
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Test and Measurement Instrumentation
Test and measurement instruments benefit from the EP1S40F780C5's combination of logic density, embedded RAM, and flexible I/O. The 615 user I/Os handle multiple data-acquisition channels, while the DSP blocks accelerate FFT-based spectrum analysis and digital filtering. The FBGA-780 package supports dense multi-layer PCBs typical of oscilloscope and logic-analyzer mainboards. Designers can implement custom trigger logic, time-interleaved ADC interfaces, and protocol decoding in the LE fabric while offloading math-intensive kernels to DSP blocks for high real-time throughput.
추천
Military and Aerospace Embedded Systems
Although the EP1S40F780C5 itself is rated commercial-extended, its FBGA-780 variant is widely used in military and aerospace subsystems that require high logic density in a compact footprint. Its 41,250 LEs and 3.4 Mbit embedded RAM support ruggedized DSP, encryption pre-processing, and navigation algorithms. The Stratix I silicon has a long in-service track record in defense electronics. Customers in this segment typically pair the FPGA with industrial-temperature grade configuration flashes and apply upscreen testing to meet program-specific reliability requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S40F780C5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S40F780C6 | EP1S40F780C7N | EP1S40F780C5N | EP1S30F780C5 | EP1S30F780C6 | EP1S25F780C5 |
|---|---|---|---|---|---|---|---|
| Package | FBGA-780 | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 41,250 | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 33,880 | 33,880 | 25,660 |
| Speed Grade | C5 (standard) | C6 (slower) | C7 (slowest, lead-free) | C5 (standard, lead-free) | C5 | C6 | C5 |
| RoHS Status | Non-compliant (lead-bearing BGA) | Non-compliant (typical) | Likely lead-free (N suffix) | Lead-free (N suffix) | Non-compliant (typical) | Non-compliant (typical) | Non-compliant (typical) |
주요 차별점
- Standard (fastest) C5 speed grade in Stratix I family (vs EP1S40F780C6)
- Highest density in 780-FBGA Stratix I lineup (vs EP1S30F780C5)
- Mature silicon with broad Quartus II IP library support (vs Stratix II (EP2S series))
설계 노트
Estimated: at typical Stratix I operating conditions (VCCINT = 1.5 V, VCCIO = 3.3 V, 100 MHz logic activity), the EP1S40F780C5 draws approximately 1.5-2.5 W dynamic plus static. Apply at least four 100 uF bulk capacitors near the BGA, plus 0.1 uF / 0.01 uF decoupling per VCC pin pair. Stratix power calculator (Excel-based) should be run post place-and-route to confirm worst-case ICCINT and ICCIO before committing to a regulator budget.
The FBGA-780 with 1.0 mm pitch demands a 4+ layer PCB with continuous ground and power planes. Per the Stratix Hardware Reference Manual, fan-out the BGA on the top layer with microvias to inner signal layers, and stitch the ground plane with a via grid under the package to suppress return-path inductance. Maintain a minimum 0.4 mm drill-to-copper clearance and use ENIG or OSP surface finish for reliable BGA solder joints.
Stratix I is no longer supported in current Quartus Prime releases - Quartus II 13.0sp1 or 13.1 is the latest verified toolchain. Confirm your synthesis, place-and-route, and simulation flows are pinned to a compatible version. When migrating from C5 to C6/C7 speed grades, re-validate timing closure, since Fmax decreases and several pipelined paths may need adjustment.
Estimated: at 2 W dissipation in still air, the FBGA-780 with theta_JA around 12-15 C/W (typical JEDEC test board) yields a junction temperature rise of 24-30 C above ambient. For closed enclosures without forced airflow, attach a heatsink or thermal pad to the package top, or specify a 6-layer board with copper pours under the BGA. Industrial-grade variants (EP1S40F780I6) extend the operating range to -40 C to +100 C junction.
규정 준수 정보
Per ICComponents distributor listing, EP1S40F780C5 is RoHS non-compliant (lead-bearing BGA balls typical of early-2000s Altera parts). The N-suffix variants (e.g., EP1S40F780C5N, EP1S40F780C7N) are typically lead-free. REACH, halogen-free, and conflict-minerals compliance were not stated in the verified data; confirm with distributor documentation before procurement.
