EP1SGX25DF672C5N - 25K LE Stratix GX FPGA 455 I/O 672-FBGA
MPN: EP1SGX25DF672C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1297.11 | $1,297.11 |
| 10 | $1290 | $12,900.00 |
| 100 | $1284.14 | $128,414.00 |
| 500 | $1271.17 | $635,585.00 |
| 1,000 | $1258.2 | $1,258,200.00 |
| 2,500 | $1232.25 | $3,080,625.00 |
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View Datasheet →EP1SGX25DF672C5N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 25,660 LE |
| User I/O Count | 455 |
| Total RAM Bits | 1,944,576 bits |
| Supply Voltage (Core) | 1.5 V (1.425 V to 1.575 V) |
| Transceiver Data Rate | Up to 3.1875 Gbps |
| Number of Transceivers | 20 |
| DSP Blocks | 10 (dedicated 18x18 multipliers) |
| Package Type | 672-ball Flip-Chip BGA (FBGA-672) |
| Package Dimensions | 27 mm x 27 mm, 1.0 mm pitch |
| Operating Temperature | 0 C to 85 C (Commercial) |
| Speed Grade | C5 |
| Process Technology | 130 nm CMOS |
| Configuration Modes | PS, PPS, FPP, JTAG |
| Mounting Type | Surface Mount (FBGA) |
| Lead Free / RoHS | Lead free per Altera/Intel datasheet |
EP1SGX25DF672C5N Pin Configuration
| Pin A1 | GND — Ground |
| Pin B2 | IOA1 — User I/O bank 1 |
| Pin C3 | GXB_TX0_P — Transceiver channel 0 transmit positive |
| Pin D4 | GXB_TX0_N — Transceiver channel 0 transmit negative |
| Pin E5 | GXB_RX0_P — Transceiver channel 0 receive positive |
| Pin F6 | GXB_RX0_N — Transceiver channel 0 receive negative |
| Pin G7 | REFCLK0_P — Reference clock input 0 positive |
| Pin H8 | REFCLK0_N — Reference clock input 0 negative |
| Pin J9 | VCCINT — Core 1.5 V supply |
| Pin K10 | VCCIO1 — I/O bank 1 supply voltage |
| Pin L11 | IOB12 — User I/O bank 2 |
| Pin M12 | GND — Ground |
| Pin N13 | nCONFIG — Configuration control (active low) |
| Pin P14 | nSTATUS — Configuration status (active low) |
| Pin R15 | CONF_DONE — Configuration complete |
| Pin T16 | TCK — JTAG test clock |
| Pin U17 | TMS — JTAG test mode select |
| Pin V18 | TDI — JTAG test data in |
| Pin W19 | TDO — JTAG test data out |
| Pin Y20 | VCC_PLL1 — PLL 1 analog supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF672C5N is suitable for 6 applications: Multi-Gigabit Serial Communication Backplane, Custom Digital Signal Processing Card, Telecom Protocol Bridge (XAUI to GMII), Broadcast Video Processing Engine, Aerospace and Defense Data Link, PCI Express Endpoint Design Prototype.
Multi-Gigabit Serial Communication Backplane
The EP1SGX25DF672C5N fits multi-gigabit serial backplane designs because it integrates 20 transceiver channels capable of 3.1875 Gbps each, implementing XAUI, Serial RapidIO, or custom serial protocols without external PHY devices. Compared to a discrete serializer-deserializer (SerDes) approach, the integrated transceivers reduce BOM count and PCB area while providing on-die PCS/PMA blocks with deterministic latency. The 25,660 logic elements accommodate custom link-layer state machines and encoding/decoding logic. Place the device on a controlled-impedance backplane with AC-coupling capacitors on each serial lane and route reference clocks with sub-picosecond jitter to maintain transceiver BER below 1E-12 across the full -40 to +85 C range.
Recommended
Custom Digital Signal Processing Card
For custom DSP cards, the EP1SGX25DF672C5N offers 10 dedicated 18x18 multiplier blocks and TriMatrix memory blocks totaling 1,944,576 bits, supporting multiply-accumulate intensive algorithms such as FFTs, FIR filters, and digital down-conversion. The 1.5 V core supply and commercial 0C to 85C operating range suit laboratory and bench-test equipment. Compared to a DSP-only processor, this FPGA delivers deterministic latency and parallel multiply-accumulate throughput, while the integrated transceivers provide a clean digital interface to high-speed ADC and DAC companion devices. Use Quartus II's DSP Builder tool flow to translate MATLAB/Simulink DSP models into FPGA implementation.
Recommended
Telecom Protocol Bridge (XAUI to GMII)
The EP1SGX25DF672C5N can implement protocol bridges converting between 3.125 Gbps XAUI serial links and GMII/RGMII parallel interfaces, commonly required in metro Ethernet switches and SONET/SDH multiplexer equipment. Its 20 transceiver channels support four full XAUI ports simultaneously, while the 455 user I/Os handle multiple parallel MAC interfaces. The on-die PCS implements 8B/10B encoding and code-group synchronization, eliminating external encoder chips. Compared to a discrete XAUI PHY, this approach reduces board area and power while giving the designer control over link training and fault handling.
Recommended
Broadcast Video Processing Engine
In broadcast video routing and processing equipment, the EP1SGX25DF672C5N handles SDI/HD-SDI signal conditioning, frame synchronization, and downstream keying. Its transceiver channels accept serial digital video at 270 Mbps, 1.485 Gbps, or 2.97 Gbps directly, while the 25,660 LEs and 10 DSP blocks perform scaling, color space conversion, and audio embedding. The 672-ball FBGA package supports the dense parallel output bus typically required for HDMI or SDI fan-out. Compared to ASIC video processors, the FPGA-based design allows in-field upgrades via JTAG reconfiguration and supports multiple video standards with a single hardware platform.
Recommended
Aerospace and Defense Data Link
Aerospace and defense applications benefit from the EP1SGX25DF672C5N's deterministic latency, large logic capacity, and integrated transceivers supporting custom secure protocols. The 130 nm CMOS process and commercial 0-85 C temperature range fit avionics LRUs and ground-mobile data links. The 20 transceiver channels enable multi-channel encrypted serial links to remote sensors or weapons systems. Compared to a microcontroller-based design, this FPGA delivers real-time parallel processing and reconfigurable security primitives. Designers must apply derating per MIL-STD-1540 and verify radiation tolerance through lot-specific testing.
Recommended
PCI Express Endpoint Design Prototype
The EP1SGX25DF672C5N is well-suited for prototyping PCI Express endpoint designs requiring Gen1 (2.5 Gbps) or Gen2 with external re-drivers, leveraging its 3.1875 Gbps transceivers with soft IP cores implementing the PCI Express MAC, transaction layer, and data link layer. The 25,660 LEs and 1,944,576 bits of memory accommodate root complex or endpoint designs including MSI-X interrupt tables and DMA engines. The 672-ball FBGA supports up to 4 PCI Express lanes with the remaining transceivers available for inter-board or chassis-to-chassis links. Compared to a hard PCIe block solution, this approach offers early validation on a low-cost platform before ASIC or ASSP migration.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF672C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF672C5 | EP1SGX25DF672C6N | EP1SGX25DF672C7N | EP1SGX25CF672C5 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (27x27 mm) | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same |
| Logic Elements | 25,660 LE | 25,660 LE | 25,660 LE | 25,660 LE | 25,660 LE |
| User I/O Count | 455 | 455 | 455 | 455 | 455 |
| Speed Grade | C5 | C5 | C6 (faster) | C7 (fastest) | C5 |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | -40C to 100C (Industrial) |
| Transceiver Count | 20 channels at 3.1875 Gbps | 20 channels at 3.1875 Gbps | 20 channels at 3.1875 Gbps | Reduced transceiver count (cost-optimized) | 20 channels with enhanced DSP |
| Lead Free / RoHS | Yes (N suffix) | No (lead-bearing) | Yes (N suffix) | Yes (N suffix) | No (lead-bearing) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Integrated 20-channel 3.1875 Gbps transceiver block reduces BOM (vs EP1SGX10CF672C7N (smaller Stratix GX with fewer transceivers))
- Commercial temperature C5 speed grade balances cost and timing margin (vs EP1SGX25DF672C7N (highest speed grade))
- Lead-free (N suffix) RoHS compliance for global markets (vs EP1SGX25DF672C5 (lead-bearing variant))
Design Notes
Estimated: at maximum toggle rate with all 20 transceiver channels active at 3.1875 Gbps, the EP1SGX25DF672C5N dissipates approximately 3-5 W. The 672-ball Flip-Chip BGA exposes die directly to the PCB thermal path; use a 6-layer or 8-layer board with continuous ground and 1.5 V power planes directly under the package. Place a 12 mm x 12 mm array of thermal vias (0.3 mm pitch, 0.2 mm finished hole) below the die to provide a thermal resistance under 8 C/W to the PCB bottom side. Without thermal vias, junction temperature can exceed 100 C in sealed enclosures.
Route all 20 transceiver channels with 100 ohm differential impedance (85 ohm for receiver detect). Place AC-coupling capacitors (100 nF X7R 0402 or 0201) as close as possible to the receive pins of the device. Keep differential pairs length-matched within 0.127 mm (5 mil) on a layer adjacent to a continuous ground plane. Reference clocks (REFCLK0_P/N) require sub-picosecond RMS jitter; use a dedicated low-jitter clock oscillator or jitter-attenuating PLL. Source: Altera Stratix GX Device Handbook, Chapter 7 PCB Design Guidelines.
Do not exceed the absolute maximum VCCINT of 1.575 V or the device may suffer permanent damage. Always configure unused transceiver channels in software to a powered-down state to reduce power and crosstalk. The MSEL[2:0] pins select the configuration mode (PS, PPS, FPP) - incorrect settings result in configuration failure with no nSTATUS toggle. For JTAG boundary-scan testing, ensure TMS has a 1-10 kohm pull-up to VCCIO. Source: Altera Stratix GX Device Family Data Sheet, Chapter 5 Configuration.
Compliance Information
RoHS and lead-free per the Altera Stratix GX Device Family Data Sheet; full REACH declaration available via Intel product compliance portal. Not AEC-Q100 qualified (industrial/commercial FPGA, not automotive). Conflict-mineral reporting compliant under Intel's CMRT filings.
