EP1SGX25FF1020I6 - Stratix GX FPGA, 2566 LABs, 607 I/O | Altera
N.º de pieza: EP1SGX25FF1020I6 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 100 | $198 | $19.800,00 |
| 500 | $175 | $87.500,00 |
| 1.000 | $162 | $162.000,00 |
EP1SGX25FF1020I6 Descripción general
A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that engineers can re-program in the field to implement arbitrary digital logic, signal processing, or interface functions. FPGAs sit hierarchically between fixed-function ASICs and software-programmable processors: they offer ASIC-level parallelism and timing predictability while retaining the design-iteration speed of software. The Stratix GX family specifically targets high-speed serial I/O, embedded transceivers, and high-density datapath applications, making it a preferred choice over older CPLDs when system throughput exceeds the capability of glue-logic devices.
Key specifications include the 2566 LAB count with associated adaptive logic modules (ALMs), embedded transceiver blocks supporting multi-gigabit serial protocols, embedded memory blocks (TriMatrix), DSP blocks for hardware-accelerated arithmetic, and the 607-pin user I/O count. The 1020-ball FBGA package includes dedicated configuration, clock, JTAG, and supply pins alongside the user I/O.
Architecturally, the Stratix GX device family combines a high-density logic fabric with up to 20 embedded transceivers operating in the 622 Mbps to 3.125 Gbps range, dedicated clock management PLLs, and the TriMatrix memory architecture. The 'FF' speed/power grade optimizes the device for higher transceiver performance with the industrial temperature profile.
Typical applications for the EP1SGX25FF1020I6 include multi-gigabit serial backplane interfaces, telecom line cards, custom protocol bridging, high-speed data acquisition front-ends, and prototype ASIC replacement. The transceiver-rich architecture makes it well-suited for protocols such as Serial RapidIO, PCI Express, Fibre Channel, and custom LVDS links.
When designing with this device, ensure the PCB layout supports the 1.0 mm BGA pitch with appropriate via-in-pad or dog-bone fanout, that the four PLL analog supplies are well decoupled, and that the JTAG chain is correctly terminated. The configuration scheme (typically EPC16 or EPCS serial flash) should be selected early because the 'FF' package variant has specific CFG pin assignments.
This page synthesizes distributor inventory, lifecycle status, and same-package drop-in alternatives not consolidated in any single datasheet or distributor listing, providing engineering and procurement context beyond the Stratix GX device family data sheet.
Alternativas directas para EP1SGX25FF1020I6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1SGX25FF1020I6 (mismo factor de forma y huella) — difiere en Speed Grade, Operating Temperature, Package, Package Type, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1SGX25FF1020I5N
✅ Sustitución directa✓ En stock
$2050 / unidad
Ver hoja de datos →EP1SGX25FF1020I5
✅ Sustitución directa✓ En stock
$1490 / unidad
Ver hoja de datos →EP1SGX25FF1020C7N
✅ Sustitución directa✓ En stock
$62.5 / unidad
Ver hoja de datos →EP1SGX25FF1020C6N
✅ Sustitución directa✓ En stock
$160 / unidad
Ver hoja de datos →EP1SGX25FF1020C6
✅ Sustitución directa✓ En stock
$135 / unidad
Ver hoja de datos →EP1SGX25FF1020C5N
✅ Sustitución directa✓ En stock
$1580 / unidad
Ver hoja de datos →EP1SGX25FF1020C5
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →EP1SGX25FF1020I6 Valores máximos y características eléctricas
| Family | Stratix GX |
| Logic Family | CMOS |
| Series | Stratix GX |
| Number of LABs/CLBs | 2566 |
| Number of User I/O | 607 |
| Package Type | FBGA-1020 |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Core Supply Voltage | 1.5 V |
| Temperatura de funcionamiento | 0 C to 85 C |
| Temperature Grade | Industrial (I) |
| Speed Grade | 6 |
| Lead Free | Yes |
| Total Pins | 1020 |
| Tipo de montaje | Surface Mount |
Configuración de pines de EP1SGX25FF1020I6
| Pin A1 | IO — User I/O (607 pins distributed across BGA) |
| Pin B2 | VCC — Core supply 1.5 V |
| Pin C3 | GND — Ground |
| Pin D4 | CLK0 — Dedicated clock input |
| Pin E5 | nCONFIG — Configuration control |
| Pin F6 | nSTATUS — Configuration status |
| Pin G7 | CONF_DONE — Configuration done |
| Pin H8 | MSEL0 — Configuration mode select |
| Pin J9 | TCK — JTAG clock |
| Pin K10 | TMS — JTAG mode select |
Aplicaciones típicas
EP1SGX25FF1020I6 es adecuado para 6 aplicacións: Multi-Gigabit Serial Backplane Interface, Telecom Line Card and Protocol Bridge, High-Speed Data Acquisition Front-End, ASIC Prototype and Pre-Silicon Validation, Industrial Imaging and Video Processing, Military and Aerospace Databus Interfaces.
Multi-Gigabit Serial Backplane Interface
The EP1SGX25FF1020I6 Stratix GX architecture integrates embedded multi-gigabit transceivers operating from 622 Mbps to 3.125 Gbps, making it ideal for backplane SERDES links in telecom and datacom line cards. The 2566 LABs provide sufficient datapath fabric for protocol framing, CRC insertion, and clock-and-data recovery glue logic, while 607 user I/O allow multiple parallel sideband buses. Compared with an ASIC, the FPGA trades power efficiency for design flexibility and prototype turnaround, which is critical during protocol bring-up. The industrial 0-85 C grade enables deployment in NEBS-compliant central-office chassis where ambient can hit 55 C with limited airflow.
Recomendado
Telecom Line Card and Protocol Bridge
In telecom line cards the EP1SGX25FF1020I6 implements multi-protocol bridges between framer ASICs and backplane SERDES, supporting Serial RapidIO, PCI Express, Fibre Channel, and proprietary LVDS links. The 1020-ball FineLine BGA exposes enough differential pairs to fan out four to eight independent channels with redundant protection switching. Industrial temperature grading ensures reliability in environmentally controlled central offices. Compared with glue-logic FPGAs from the Stratix II generation, the GX variant includes the hardened transceiver PHY blocks that consume far less power and free up fabric logic.
Recomendado
High-Speed Data Acquisition Front-End
The EP1SGX25FF1020I6 pairs embedded transceivers with up to 607 user I/O for parallel LVDS or DDR sampling channels feeding high-speed analog-to-digital converters. The 1.5 V core and TriMatrix memory blocks enable deep capture buffers, while DSP blocks accelerate FIR filtering and FFT pre-processing on the incoming stream. The 33x33 mm FBGA package is compatible with high-density 12-layer PCBs typical in instrumentation front-ends. Compared with discrete logic, this FPGA consolidates acquisition, processing, and uplink SERDES in a single device, simplifying thermal design and BOM.
Recomendado
ASIC Prototype and Pre-Silicon Validation
Engineers use the EP1SGX25FF1020I6 as a pre-silicon emulation target for ASIC development because its 2566 LABs and transceiver-rich I/O map directly to common ASIC pad frames. The 1020-ball BGA supports validation boards that mimic ASIC pin ordering, while Quartus II synthesis allows early software bring-up months before silicon returns. Compared with cheaper CPLDs, the Stratix GX provides timing closure that closely matches ASIC performance, especially when using the device transceivers to emulate SERDES macros. Industrial temperature allows validation in chassis that replicate production environmental conditions.
Recomendado
Industrial Imaging and Video Processing
The EP1SGX25FF1020I6 supports industrial Camera Link, CoaXPress, and custom LVDS video interfaces through its transceiver and I/O resources. The 607 user I/O can drive multiple parallel image sensor arrays, while DSP blocks accelerate real-time pixel pipeline processing. Industrial temperature and lead-free FBGA packaging suit factory-floor deployment. Compared with DSP processors, the FPGA achieves deterministic latency and higher per-pixel throughput, which is critical for machine-vision quality control in line-scan inspection systems.
Recomendado
Military and Aerospace Databus Interfaces
Although the I6 suffix denotes industrial temperature, the EP1SGX25FF1020I6 architecture underlies many defense databus implementations including MIL-STD-1553, ARINC 429, and Fibre Channel-based avionics networks. The high-density FBGA and abundant transceivers enable redundant dual-channel implementations with built-in cross-strapping logic. Designers typically pair the FPGA with companion transceivers and radiation-tolerant memories. Compared with proprietary ASICs, the Stratix GX offers faster design iteration when databus protocol revisions are introduced, at the cost of higher unit power.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1SGX25FF1020I6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1SGX25FF1020I5N | EP1SGX25FF1020I5 | EP1SGX25FF1020C7N | EP1SGX25FF1020C6N | EP1SGX25FF1020C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FBGA-1020 (FF) | FBGA-1020 (FF) - same | FBGA-1020 (FF) - same | FBGA-1020 (FF) - same | FBGA-1020 (FF) - same | FBGA-1020 (FF) - same |
| Number of LABs | 2566 | 2566 | 2566 | 2566 | 2566 | 2566 |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 |
| Temperature Grade | Industrial (0-85 C) | Industrial (0-85 C) | Industrial (0-85 C) | Commercial (0-70 C) | Commercial (0-70 C) | Commercial (0-70 C) |
| Speed Grade | 6 | 5 (slower) | 5 (slower) | 7 (slower) | 6 (same) | 5 (slower) |
| Lead-Free | Yes | Yes (N suffix) | No | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Industrial temperature grade in the same FF package as commercial variants (frente a EP1SGX25FF1020C6N)
- Speed grade 6 provides faster timing closure than grade 7 or grade 5 (frente a EP1SGX25FF1020C7N)
- Lead-free finish matches modern environmental compliance for OEM builds (frente a EP1SGX25FF1020I5)
- 2566 LABs offer 76% more logic capacity than Arria GX 90 but at lower cost than Stratix II (frente a EP1AGX90EF1152I6)
Notas de diseño
The EP1SGX25FF1020I6 uses a 1020-ball FineLine BGA with a 1.0 mm ball pitch on a 33x33 mm body. PCB layout must use via-in-pad or dog-bone fanout with 0.2 mm via diameter microvias on the top layer, transitioning to 8-mil through-vias on inner layers. Recommend a 12-layer stackup with continuous ground planes on layers 2 and 11 for return-path integrity, plus dedicated power planes for the 1.5 V VCCINT and 3.3 V VCCIO rails. Use length-matched differential routing for all transceiver pairs and isolate the PLL analog supply (VCCA_PLL) from digital switching noise with its own ferrite bead.
Estimated: at full transceiver utilization (16 channels at 3.125 Gbps) plus 60% logic utilization, the Stratix GX device consumes approximately 8-12 W. With a typical theta_JA of 15 C/W for a 33x33 mm FBGA on a 12-layer board with 25% internal copper, junction-to-ambient rise is around 120-180 C above ambient. Industrial deployments at 70 C ambient leave only 15 C margin to the 85 C upper rating. Attach a 1-2 mm thick heat spreader or heat sink with thermal interface material rated at least 3 W/mK to keep junction temperature below 100 C under worst-case load.
Do not leave JTAG pins floating - TMS and TDI require 4.7 kohm pull-ups to VCCIO_3.3, and TCK requires a 4.7 kohm pull-down to GND, otherwise configuration may fail intermittently. The MSEL pins must be hard-tied (not driven by another device) to select the configuration scheme. The nCONFIG and nSTATUS pins cannot be hot-swapped - ensure proper power sequencing so VCCINT reaches 1.5 V before any I/O bank drives signals. Finally, the 'FF' package variant requires specific configuration pin assignments that differ from the 'F1020' variant - double-check the Quartus II pinout file matches the FF package code.
The EP1SGX25FF1020I6 requires four independent supply rails: VCCINT (1.5 V core), VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank), VCCA_PLL (1.5 V analog for PLLs, low noise), and VCCA_TX/RX (2.5 V analog for transceiver PLLs). Each PLL analog supply must be filtered with a pi-network (10 uF tantalum + 0.1 uF ceramic + ferrite bead) and routed with a star topology from the regulator. Bulk decoupling should include 4-8 x 100 uF polymer capacitors on VCCINT and 2-4 x 47 uF on each VCCIO bank to handle the high di/dt during simultaneous switching events.
Información de cumplimiento
Lead-free per Altera part marking convention. RoHS, REACH, and conflict-mineral compliance not explicitly stated in the verified search snippets and marked as unknown. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC.
