EP1SGX25FF1020C6N - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
MPN: EP1SGX25FF1020C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $217.51 | $217.51 |
| 10 | $205 | $2,050.00 |
| 100 | $188 | $18,800.00 |
| 500 | $172 | $86,000.00 |
| 1,000 | $160 | $160,000.00 |
Drop-in alternatives for EP1SGX25FF1020C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25FF1020C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | Stratix |
| Logic Elements | 25 660 |
| Number of LABs/CLBs | 2566 |
| Number of User I/O | 607 |
| Package | 1020-ball FC-FBGA, 33 x 33 mm, 1 mm pitch |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | CMOS |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 |
| Lead-Free (Pb-Free) | Yes |
| RoHS Status | Compliant (per Altera/Intel product page) |
| Mounting Type | Surface Mount (BGA) |
| Global Clocks | Up to 20 (Stratix GX family) |
| Configuration | Serial / Parallel (Altera Stratix GX family) |
EP1SGX25FF1020C6N Pin Configuration
| Pin 1 | VCCINT — Core voltage supply (1.5 V) - reference datasheet for ball map quadrant |
| Pin 2 | GND — Ground - distributed throughout ball array for return path integrity |
| Pin 3 | I/O Bank 1 — User I/O pin (LVTTL/LVCMOS/LVDS, bank 1) |
| Pin 4 | I/O Bank 1 — User I/O pin (LVTTL/LVCMOS/LVDS, bank 1) |
| Pin 5 | I/O Bank 2 — User I/O pin (bank 2) |
| Pin 6 | I/O Bank 2 — User I/O pin (bank 2) |
| Pin 7 | CLK0 — Dedicated clock input 0 (global clock network) |
| Pin 8 | CLK1 — Dedicated clock input 1 (global clock network) |
| Pin 9 | REFCLK — Transceiver reference clock input |
| Pin 10 | TX_P — Differential transmit positive (transceiver channel 0) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020C6N is suitable for 6 applications: 10 Gigabit Ethernet Line Card, Custom PCI Express Endpoint / Root Complex, DSP-Accelerated Optical Transport (FEC/FFT), Aurora / Interlaken Chip-to-Chip Bridge, Wireless Base-Station Protocol Processing, Industrial Test & Measurement Equipment.
10 Gigabit Ethernet Line Card
The EP1SGX25FF1020C6N fits 10 Gigabit Ethernet line cards because its Stratix GX multi-gigabit transceivers deliver up to 3.125 Gbps per channel, allowing designers to aggregate four XAUI lanes to 10 Gbps. Its 25 660 logic elements and 2 566 LABs are sufficient to instantiate a 10G MAC, XAUI PHY, and partial packet-processing pipeline, while the 607 user I/Os expose flexible memory and backplane interfaces. The 1020-FBGA package keeps the BOM compact for dense line-card layouts.
Recommended
Custom PCI Express Endpoint / Root Complex
The EP1SGX25FF1020C6N is well matched to custom PCI Express endpoint and root-complex designs because the Stratix GX family hard-IP includes PCI Express PHY and MAC blocks alongside the user fabric. Transceiver channels map directly to PCIe lanes at 2.5 Gbps, leaving logic resources for the application layer. Designers use the C6 speed grade to meet the PCIe base spec timing budget, while the 1020-FBGA package simplifies high-speed signal escape on standard FR-4.
Recommended
DSP-Accelerated Optical Transport (FEC/FFT)
Optical transport line cards benefit from the EP1SGX25FF1020C6N's embedded DSP blocks and on-chip RAM, which accelerate Reed-Solomon and Turbo forward-error-correction cores as well as FFT pipelines for OFDM transceivers. The transceiver-rich fabric connects to OTU/SONET framer ASICs at 2.5-3.125 Gbps, while the 25 660 logic elements support a complete DSP datapath. The 1020-ball BGA enables the high pin density required for parallel datapath interfaces to external SRAM/DRAM.
Recommended
Aurora / Interlaken Chip-to-Chip Bridge
The EP1SGX25FF1020C6N enables Aurora or Interlaken chip-to-chip bridging between ASICs, ASSPs, and FPGAs because each multi-gigabit transceiver channel can be soft-configured for these protocols. Twenty+ transceiver channels can be bonded for 40-60 Gbps aggregate bandwidth, while remaining logic fabric handles framing, CRC, and lane-alignment state machines. The 1020-FBGA package keeps the device compact enough for mezzanine-card placements.
Recommended
Wireless Base-Station Protocol Processing
Wireless base-station designs use the EP1SGX25FF1020C6N for CPRI or OBSAI protocol processing between baseband and radio units because the Stratix GX transceivers support the required 1.228-2.457 Gbps CPRI data rates with low jitter. Embedded DSP blocks accelerate channel-filtering and crest-factor-reduction algorithms, while 607 user I/Os provide ample LVDS interconnect to baseband ASICs. The 1020-FBGA package is suited to dense ATCA or microTCA form factors.
Recommended
Industrial Test & Measurement Equipment
The EP1SGX25FF1020C6N fits high-end test and measurement equipment because designers can implement custom trigger logic, real-time DSP, and pattern generation in the 25 660 logic elements, while the multi-gigabit transceivers feed high-speed ADC/DAC data at multi-Gsps. The 607 I/Os provide fan-out to front-panel connectors and display interfaces, and the 1020-FBGA package supports dense mixed-signal PCB layouts. Commercial temperature range 0-85 °C suits controlled lab environments.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C6 | EP1SGX25FF1020C5N | EP1SGX25FF1020C7N | EP1SGX25FF1020C6ES | EP1SGX25FF1020C6BN |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (FF) | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (FF) - same | 1020-ball FC-FBGA (FF) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | C6 | C6 | C5 (-1 bin) | C7 (+1 bin) | C6 | C6 |
| Logic Elements | 25 660 | 25 660 | 25 660 | 25 660 | 25 660 | 25 660 |
| User I/O Count | 607 | 607 | 607 | 607 | 607 | 607 |
| Supply Voltage (Core) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free Finish | Yes (N suffix) | No (leaded finish) | Yes | Yes | Yes | Yes |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (USD, qty 1, as of 2026-09-07) | $217.51 | Lower (leaded, lower screening) | Lower (slower speed grade) | Higher (faster speed grade) | Similar (engineering sample) | Similar |
Key Differentiators
- Stratix GX hard-IP for PCI Express and serial protocols (vs EP1SGX25DF1020C6N)
- Drop-in compatible within the Stratix GX 1020-FBGA family (vs Xilinx Virtex-II Pro equivalent)
- Mid-density fabric with embedded transceivers (vs Stratix II EP2SGX60FF1508C5N)
Design Notes
The 1020-ball FC-FBGA at 1 mm pitch demands microvia or via-in-pad PCB technology for clean breakout. Plan at least 4 PCB layers with continuous GND planes beneath the BGA and matched-length (within 150 mil) differential routing for all multi-gigabit transceiver pairs. Decoupling: place 0.1 µF MLCCs on every VCCINT/GND ball pair within 2-3 mm of the package, plus bulk 10-22 µF tantalum or ceramic capacitors on the 1.5 V and 1.4 V (transceiver) rails.
Estimated: Stratix GX devices with active multi-gigabit transceivers typically dissipate 8-15 W depending on channel utilisation and toggle rate. With the FF (flip-chip) BGA's lower θJA compared to the wire-bond DF variant, a moderate copper pour on the top layer (≥ 25 cm² connected thermal pad) and 200 LFM airflow is sufficient for the 1020-FBGA. For enclosed chassis designs, attach a heatsink to the package lid with thermal interface material; verify with a CFD or thermal probe measurement on the prototype.
Do not reuse Altera legacy Quartus II projects targeting different Stratix GX speed grades without recompiling timing constraints - the C5/C6/C7 bins have different Fmax and IOE timing models. AC-couple every multi-gigabit transceiver channel with the capacitor value specified in the Stratix GX Device Handbook (typically 100 nF for 2.5 Gbps, 10 nF for 3.125 Gbps). Do not skip the nCONFIG / nSTATUS / CONF_DONE pull-ups or the MSEL[3:0] configuration mode pin settings, or the device will fail to configure silently.
Route transceiver differential pairs with 100 Ω differential impedance and keep intra-pair skew under 5 ps; use guard traces or ground-cox shielding if the layer stack permits. Reference-clock inputs (REFCLK) are extremely jitter-sensitive - drive them from a low-jitter clock conditioner (e.g., a dedicated PLL) rather than routing an FPGA-generated clock back into a REFCLK pin. For PCIe endpoints, maintain 85 Ω differential impedance per the PCIe CEM specification.
Compliance Information
RoHS compliance verified via the 'N' suffix per Altera/Intel ordering information. REACH and conflict-minerals status assumed compliant based on Intel corporate policy; not separately verified in the provided web data. AEC-Q100 not applicable - part is a commercial-grade FPGA.
