EP1SGX25FF1020I5 - Stratix GX FPGA, 25.6K Logic Cells | Intel / Altera
MPN: EP1SGX25FF1020I5 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1550 | $775,000.00 |
| 1,000 | $1490 | $1,490,000.00 |
EP1SGX25FF1020I5 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, interconnect, and I/O cells that the designer can program after manufacture. FPGAs sit between fixed-function ASICs and software-defined processors in the digital-logic hierarchy: logic block -> programmable interconnect -> FPGA -> programmable logic device -> semiconductor IC. The Stratix GX family further adds embedded multi-gigabit transceivers, positioning this part as a programmable equivalent of an ASSP for high-speed serial I/O.
Key features of the EP1SGX25FF1020I5 include 25,660 logic elements organized into 2,566 CLBs, a 1020-ball FC-FBGA (flip-chip fine-pitch BGA) package, and a 1.5 V core supply supported from 1.425 V to 1.575 V. The 'I5' speed/temperature grade targets industrial-temperature environments. CMOS technology with 130 nm geometry provides a balance of density and power for high-performance embedded processing, while the GX variant brings dedicated serial transceivers for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom high-speed serial links.
The architecture combines look-up-table based logic fabric with embedded memory blocks and high-speed I/O. Designers can implement complex state machines, DSP pipelines, and custom peripherals on a single device, while leveraging the integrated transceivers for chip-to-chip or backplane serial links.
Typical applications include high-speed serial interface bridging, telecommunications line cards, military and aerospace signal processing, test and measurement instrumentation, and high-performance compute accelerators. The industrial temperature grade (I5) makes it especially useful in ruggedized or extended-environment deployments.
When designing with this part, ensure that PCB BGA layout, power-plane decoupling, and JTAG configuration circuitry follow Altera Stratix GX hardware reference design guidelines. Thermal management on a 1020-ball FC-BGA must be planned around the flip-chip thermal envelope, and configuration bitstreams require the corresponding Quartus II or Quartus Prime support version.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP1SGX25FF1020I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1SGX25FF1020I5 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25FF1020C5
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1SGX25FF1020
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →EP1SGX25DF1020I5
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1SGX25FF1020CS
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1SGX25DF1020I5N
✅ Drop-In✓ In Stock
$985 / Unit
View Datasheet →EP1SGX25FF1020C7
✅ Drop-In✓ In Stock
$1280 / Unit
View Datasheet →EP1SGX25FF1020I5 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Cells | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Maximum Internal Performance | 5000 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (Nominal) | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Package | 1020-ball FC-FBGA (FF1020) |
| Terminal Form | Ball |
| Number of Terminals | 1020 |
| Temperature Grade (suffix I5) | Industrial |
| Combinatorial Delay (ES variant) | 7.49 ns max |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| Embedded Transceivers | Present (Stratix GX family) |
EP1SGX25FF1020I5 1020-ball fc-fbga (ff1020) Pin Configuration Guide
Pin configuration for EP1SGX25FF1020I5 (1020-ball fc-fbga (ff1020) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020I5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1SGX25FF1020I5 is suitable for 6 applications: High-Speed Serial Interface Bridging, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation, Telecommunications Line Cards, Test and Measurement Instrumentation, Industrial Control and Ruggedized Computing.
High-Speed Serial Interface Bridging
The EP1SGX25FF1020I5's embedded multi-gigabit transceivers (a hallmark of the Stratix GX family) and 25,660 logic cells make it well-suited for bridging between high-speed serial protocols such as PCI Express, Gigabit Ethernet, and Serial RapidIO. Its 1020-ball FC-FBGA package exposes enough transceiver and general-purpose I/O pins to support multiple lanes concurrently. Unlike discrete PHY-plus-FPGA solutions, integration reduces board area, latency, and BOM cost for protocol-conversion and aggregation designs in telecom line cards and backplanes.
Recommended
Military and Aerospace Signal Processing
The industrial temperature grade (I5) of the EP1SGX25FF1020I5, combined with its high logic density (25,660 cells / 2,566 CLBs) and high-speed serial capability, suits ruggedized signal-processing platforms. Defense and aerospace subsystems benefit from the integrated transceivers for sensor data links and the abundant logic for FFT, filtering, and channelization. Compared to older ASIC-based solutions, this FPGA offers in-the-field reprogrammability while maintaining the extended-temperature envelope required for avionics and ground-mobile platforms.
Recommended
ASIC Prototyping and Emulation
With 25,660 logic cells and abundant I/O, the EP1SGX25FF1020I5 is commonly used as an ASIC prototyping vehicle. Multiple FPGAs can be partitioned to emulate a large ASIC, with the FF1020 BGA package providing high I/O density for chip-to-chip interconnect. Designers gain functional verification at near-real-time speeds and the ability to iterate firmware before tape-out. The Quartus II toolchain supports incremental synthesis flows that map RTL partitions efficiently onto this device.
Recommended
Telecommunications Line Cards
Telecom line cards aggregate and switch high-speed serial traffic, and the EP1SGX25FF1020I5's combination of multi-gigabit transceivers and programmable logic fits this role precisely. The 1020-ball BGA exposes multiple transceiver channels alongside general-purpose I/O for backplane SERDES, framer interfaces, and timing distribution. Compared to ASSP solutions, the Stratix GX allows carriers to update packet-processing or framing logic in firmware, supporting evolving standards like OTN, Ethernet, and CPRI without respinning hardware.
Recommended
Test and Measurement Instrumentation
High-end test and measurement equipment requires both fast serial links (for data acquisition backhaul) and dense programmable logic for real-time DSP, triggering, and protocol decode. The EP1SGX25FF1020I5 supports these needs with embedded transceivers for high-speed sample transport and 25,660 logic cells for on-chip processing. Compared to a multi-chip ASSP-plus-FPGA design, this single-chip integration simplifies PCB layout and reduces measurement uncertainty from inter-chip skew.
Recommended
Industrial Control and Ruggedized Computing
Industrial-grade embedded controllers with deterministic real-time I/O and serial fieldbus connectivity can use the EP1SGX25FF1020I5 as a single-chip compute-and-interface engine. The I5 industrial temperature grade supports factory floor environments with extended thermal margins, while the integrated transceivers handle protocols such as EtherCAT, PROFINET, or custom high-speed fieldbus links. The high logic density allows on-chip implementation of motion-control loops, safety interlocks, and deterministic networking stacks that previously required an external processor.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C5 | EP1SGX25FF1020 | EP1SGX25DF1020I5 | EP1SGX25FF1020CS | EP1SGX25FF1020C7 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (FF1020) | 1020-ball FC-FBGA (FF1020) - same | 1020-ball FC-FBGA (FF1020) - same | 1020-ball FC-FBGA (FF1020) - same | 1020-ball FC-FBGA (FF1020) - same | 1020-ball FC-FBGA (FF1020) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Cells | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed/Temperature Grade | I5 (industrial) | C5 (commercial, faster) | Base (industrial, no suffix) | I5 (industrial, DF silicon rev) | CS (commercial) | C7 (commercial, slower) |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Core Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Transceivers | Yes (Stratix GX) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial I5 temperature grade with embedded Stratix GX multi-gigabit transceivers (vs EP1SGX25FF1020C5)
- Original silicon revision with longest third-party reference design support (vs EP1SGX25DF1020I5)
- Same 1020-ball FF1020 package as the entire Stratix GX 25K logic-cell family (vs EP1SGX25FF1020C7)
Design Notes
Estimated: at full utilization the EP1SGX25FF1020I5 can dissipate 5 W to 15 W depending on clock rate and transceiver activity. The 1020-ball FC-FBGA exposes a thermal pad on the package underside that MUST be soldered to a continuous ground/power copper pour on the top layer with thermal vias to inner planes. Designers should follow the Altera Stratix GX thermal management application note and target a junction-to-ambient thermal resistance below 5 C/W via heat sink attachment for continuous industrial-temperature operation.
The 1020-ball FC-FBGA requires a high-density PCB stack-up with matched-impedance routing for the multi-gigabit transceiver channels. Per the Stratix GX hardware reference design, allocate 4 to 8 PCB layers with dedicated ground and power planes, use microstrip or stripline routing with controlled 50 ohm differential impedance for SERDES lanes, and place transceiver AC-coupling capacitors within 250 mil of the package balls. Decoupling requires 0.1 uF and 0.01 uF MLCCs adjacent to every power ball per Altera's reference decoupling schematic.
Common pitfalls include: (1) using the wrong Quartus II device support pack leading to bitstream failure - confirm the support pack matches the silicon revision (FF vs DF); (2) leaving JTAG configuration pins floating, which can cause intermittent configuration errors - tie MSEL, nCONFIG, nSTATUS, and CONF_DONE per the Stratix GX configuration handbook; (3) insufficient power-supply decoupling causing PLL lock failures - add bulk tantalum/polymer capacitors at every regulator output feeding VCCINT, VCCA, and VCCP; (4) ignoring I/O bank VCCIO compatibility when mixing voltage standards.
Compliance Information
RoHS/REACH/lead-free status not present in the verified web snippets for EP1SGX25FF1020I5. Marked [DATA_NEEDED] in specs. AEC-Q100 not applicable for FPGAs.
