EP1SGX40CF672C6 - Stratix GX FPGA 41,250 LEs | Altera/Intel
N.º de pieza: EP1SGX40CF672C6 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $385 | $385,00 |
| 10 | $365 | $3.650,00 |
| 100 | $340 | $34.000,00 |
| 250 | $318 | $79.500,00 |
| 500 | $295 | $147.500,00 |
EP1SGX40CF672C6 Descripción general
An FPGA (field-programmable gate array) is a reprogrammable digital semiconductor containing an array of programmable logic blocks, configurable I/O cells, and a routed interconnect fabric. Stratix GX devices belong to the high-density programmable-logic family — a hypernym hierarchy of PLD -> programmable logic -> logic IC -> integrated circuit. They integrate embedded transceivers and DSP blocks, sitting between traditional ASICs and DSP processors in the system architecture hierarchy.
Key features include 4,125 CLBs, dedicated high-speed transceivers (multi-gigabit serial interfaces typical of the Stratix GX family), embedded multiplier blocks, on-chip TriMatrix memory, and a flexible I/O subsystem supporting LVDS, SSTL, LVTTL, and PCI signalling. The 672-pin PBGA package exposes ample I/O for parallel external memory buses and high-speed serial links. The Stratix GX architecture combines a fine-grained LE fabric with embedded RAM and DSP blocks for high-throughput signal processing.
Typical applications include multi-gigabit serial-link aggregation, telecom backplane interfaces, high-speed serial protocol bridging (XAUI, PCI Express, Serial RapidIO), broadcast video processing, and defense/aerospace signal-processing platforms. The device's combination of embedded transceivers and parallel DSP makes it a strong fit for line-card and baseband subsystems.
Designers should validate power-up sequencing for VCCINT/VCCIO rails, supply sufficient decoupling near every PBGA quadrant, and use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure. Thermal design must account for the commercial junction-temperature envelope, and the I/O bank assignments should be planned before PCB layout because PBGA-672 fan-out requires careful escape routing.
This page synthesises drop-in variants in the same PBGA-672 footprint, current distributor price points, and design guidance that goes beyond the manufacturer datasheet's nominal spec table.
Alternativas directas para EP1SGX40CF672C6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1SGX40CF672C6 (mismo factor de forma y huella) — difiere en Package, Speed Grade, Process Technology, Mounting Type, Configuration Method.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1SGX40CF672C5
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →EP1SGX40CF672C7
✅ Sustitución directa✓ En stock
$165 / unidad
Ver hoja de datos →EP1SGX40CF672C6N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP1SGX40DF672C6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP1SGX25CF672C6
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →EP1SGX40CF672C6 Valores máximos y características eléctricas
| Family | Stratix GX |
| Series | EP1SGX40 |
| Manufacturer | Altera (now Intel) |
| Logic Elements (LEs) | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Encapsulado | PBGA-672 (CF672) |
| Package Material | Plastic / Epoxy |
| Ball Pitch | 1.000 mm |
| Package Shape | Square BGA |
| Terminal Count | 672 |
| Nominal Core Supply (VCCINT) | 1.5 V |
| Core Supply Range | 1.425 V to 1.575 V |
| Process Technology | 130 nm CMOS |
| Operating Temperature (Commercial) | 0 °C to 85 °C |
| Speed Grade | C6 |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de EP1SGX40CF672C6 square bga
Configuración de pines para EP1SGX40CF672C6 (encapsulado square bga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1SGX40CF672C6.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1SGX40CF672C6 es adecuado para 6 aplicacións: Multi-Gigabit Serial Backplane Aggregation, Telecom Line-Card Signal Processing, Broadcast Video Processing, Industrial High-Speed Control, Defense / Aerospace Signal Processing, Medical Imaging Preprocessing.
Multi-Gigabit Serial Backplane Aggregation
The EP1SGX40CF672C6 fits multi-gigabit serial backplane aggregation because it integrates dedicated Stratix GX transceivers capable of gigabit-rate serial I/O directly alongside the 41,250-LE programmable fabric. Its 1.5 V core and C6 speed grade support typical backplane line rates such as XAUI (4 × 3.125 Gbps) and Serial RapidIO while leaving sufficient logic headroom for MAC/framer functions. Compared with a discrete SERDES + FPGA two-chip solution, this single-chip integration reduces board area and inter-chip skew. Designers place the device on line cards with point-to-point backplane links and use Quartus II ALTGX megafunctions for transceiver configuration.
Recomendado
Telecom Line-Card Signal Processing
The EP1SGX40CF672C6 suits telecom line-card signal processing where embedded transceivers interface to SFP/SFP+ optical modules while the 41,250-LE fabric implements channelised DSP, framing, and protocol bridging. The 1.5 V core, commercial 0 °C–85 °C grade, and PBGA-672 footprint are aligned with typical telecom shelf environments. Compared with a pure ASIC approach, the FPGA enables last-minute feature changes and faster time-to-market for evolving standards. The C6 speed grade provides timing margin for 3.125 Gbps SerDes lanes feeding DSP pipelines.
Recomendado
Broadcast Video Processing
The EP1SGX40CF672C6 enables broadcast video processing applications such as SDI de/embedding, format conversion, and chroma-keying, leveraging its 41,250 LEs and on-chip TriMatrix memory to hold line/frame buffers. The 672-ball PBGA exposes sufficient I/O for parallel SDI data paths plus a transceiver for SDI-over-IP or SMPTE 2022 links. Compared with a GPU-based approach, the FPGA delivers deterministic latency critical for live broadcast workflows. The commercial temperature grade suits controlled studio and headend environments.
Recomendado
Industrial High-Speed Control
The EP1SGX40CF672C6 supports industrial high-speed control applications including motion-control loop computation, machine-vision preprocessing, and high-speed serial sensor aggregation via the embedded transceivers. The 41,250-LE fabric handles multi-axis PID loops at microsecond rates while the transceiers aggregate EtherCAT or SERCOS-III traffic over fibre backbones. Compared with a microcontroller + DSP architecture, the FPGA offers deterministic latency and parallel DSP block utilisation. Designers can use the C5 speed-grade variant in cost-optimised industrial SKUs.
Recomendado
Defense / Aerospace Signal Processing
The EP1SGX40CF672C6 can serve defense and aerospace signal-processing platforms where high-density logic, embedded transceivers, and ruggedised board designs are needed. Although the C6 part itself is commercial grade, the same die in industrial or military temperature grades (denoted by 'I' or 'A' speed-grade suffixes) targets avionics, EW, and SDR subsystems. The PBGA-672 footprint is shared across grades, enabling PCB reuse. Compared with a discrete DSP + ADC architecture, the FPGA simplifies BOM and accelerates algorithm updates in the field.
Recomendado
Medical Imaging Preprocessing
The EP1SGX40CF672C6 fits medical imaging preprocessing such as ultrasound beamforming, MRI front-end preprocessing, and CT reconstruction front-ends, where the 41,250-LE fabric plus embedded DSP blocks deliver the parallel arithmetic required for high-channel-count signal conditioning. The C6 speed grade meets timing on tightly-pipelined beamformer datapaths, and the PBGA-672 exposes enough I/O for parallel LVDS ADC interfaces. Compared with an ASIC implementation, the FPGA accelerates FDA submission by allowing late algorithm updates.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1SGX40CF672C6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1SGX40CF672C5 | EP1SGX40CF672C7 | EP1SGX40CF672C6N | EP1SGX40DF672C6 | EP1SGX25CF672C6 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | PBGA-672 (CF672), 1.000 mm pitch | PBGA-672 (CF672), 1.000 mm pitch - same | PBGA-672 (CF672), 1.000 mm pitch - same | PBGA-672 (CF672), 1.000 mm pitch - same | PBGA-672 (DF672) - verify ball map vs CF672 | PBGA-672 (CF672), 1.000 mm pitch - same |
| Logic Elements (LEs) | 41,250 | 41,250 - same | 41,250 - same | 41,250 - same | 41,250 - same die | ~25,660 (-38%) |
| Configurable Logic Blocks (CLBs) | 4,125 | 4,125 - same | 4,125 - same | 4,125 - same | 4,125 - same die | ~2,566 (-38%) |
| Speed Grade | C6 (commercial) | C5 (slower than C6) | C7 (faster than C6) | C6 (same), lead-free terminal finish | C6 (same) | C6 (same) |
| Core Voltage (VCCINT) | 1.5 V nominal (1.425–1.575 V) | 1.5 V nominal - same | 1.5 V nominal - same | 1.5 V nominal - same | 1.5 V nominal - same | 1.5 V nominal - same |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C - same | 0 °C to 85 °C - same | 0 °C to 85 °C - same | 0 °C to 85 °C - same | 0 °C to 85 °C - same |
| Lifecycle Status | Obsolete (as of 2026-09-07) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Qty-1 Unit Price (USD) | 385.00 | 335.00 | 445.00 | 395.00 | 410.00 | 275.00 |
Diferenciadores clave
- Faster speed grade than C5 variant (frente a EP1SGX40CF672C5)
- Lower unit price than C7 speed grade (frente a EP1SGX40CF672C7)
- Larger logic capacity than '25' family members (frente a EP1SGX25CF672C6)
- Standard SnPb terminal finish vs lead-free N variant (frente a EP1SGX40CF672C6N)
Notas de diseño
The EP1SGX40CF672C6 requires multiple supply rails: VCCINT (1.5 V core), VCCIO (bank-dependent I/O voltage, typically 1.5 V / 1.8 V / 2.5 V / 3.3 V), VCCAUX (auxiliary analogue), and transceiver PLLs (VCCR, VCCT). Estimated: at full resource utilisation and 50% toggle rate, the 1.5 V core can draw 1.5–2.5 A; size your regulator with at least 30% margin and place 10 µF + 0.1 µF decoupling pairs within 5 mm of every supply pin. Sequence VCCINT before VCCIO per Altera's power-up guidelines to avoid latch-up.
Estimated: the PBGA-672 package has a typical θJA of ~10 °C/W with adequate PCB copper and forced airflow. At 3 W total dissipation, the junction rises ~30 °C above ambient, leaving comfortable margin in the 85 °C commercial envelope. For high-utilisation designs (full fabric + active transceivers), provide a thermal via array under the centre balls and consider a heatsink. Always validate with a thermal simulation in the Quartus II PowerPlay tool before sign-off.
Route the 672-ball PBGA with a 1.000 mm pitch escape using microvia (laser-drilled) stack-up; through-hole vias will not fit between balls. Provide at least four PCB layers for signal routing plus dedicated power planes. Place 0402-size 0.1 µF decoupling capacitors on the BGA underside adjacent to every supply pin, plus bulk 22 µF tantalum or polymer capacitors around the package perimeter. Match length on differential pairs (LVDS / transceiver lanes) within the skew tolerances specified in the device handbook.
Do not assume the 'DF672' and 'CF672' packages are interchangeable: although both are 672-ball PBGA, the ball map differs between the 'CF' (commercial feature set) and 'DF' (differential-heavy) variants — verify the pin-out table before PCB redesign. Modern Quartus Prime does not officially support EP1SGX40; retain a Quartus II 13.0 (or earlier) installation for bitstream generation. Finally, source via authorised distributors or brokers with traceability documentation because obsolete FPGAs are a known counterfeiting risk.
Información de cumplimiento
Standard EP1SGX40CF672C6 ships with SnPb (tin-lead) terminal finish; lead-free 'N' suffix variant available. RoHS / REACH / halogen-free / conflict-minerals status not present in the verified web data — set to 'unknown' rather than assumed.
