Altera

EP1SGX40CF672C6 - Stratix GX FPGA 41,250 LEs | Altera/Intel

MPN: EP1SGX40CF672C6 ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V Vdss PBGA-672 (CF672) Package C6 Speed
From $295 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $385 $385.00
10 $365 $3,650.00
100 $340 $34,000.00
250 $318 $79,500.00
500 $295 $147,500.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1SGX40CF672C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1SGX40CF672C5

✅ Drop-In
Altera
📦 PBGA-672 (CF672)
Stratix GX · 41,250 LE · 3.42 Mbit · [DATA_NEEDED: 18x18 multiplier count] · 484 · Up to 20 · Up to 3.125 Gbps · Up to 12

✓ In Stock

$171 / Unit

View Datasheet →

EP1SGX40CF672C7

✅ Drop-In
Altera
📦 PBGA-672 (CF672)
Stratix GX · 41,250 · [DATA_NEEDED: max user I/O pin count] · 14 channels · Up to 3.125 Gbps · Up to 3.4 Mbits (TriMatrix) · 14 · 14

✓ In Stock

$165 / Unit

View Datasheet →

EP1SGX40CF672C6N

✅ Drop-In
📦 PBGA-672 (CF672)
Same die and PBGA-672 footprint; 'N' suffix denotes lead-free / Pb-free terminal finish; otherwise pin-for-pin identical

📋 Reference alternative (not in catalog)

EP1SGX40DF672C6

✅ Drop-In
📦 PBGA-672 (DF672)
Same die, larger differential I/O count in DF672 package variant; ball pitch may differ — verify against datasheet pin-out before PCB swap

📋 Reference alternative (not in catalog)

EP1SGX25CF672C6

✅ Drop-In
Intel
📦 PBGA-672 (CF672)
Stratix GX · 25660 · 2852 LABs · 455 · 1944576 · 4 to 20 (SERDES up to 3.1875 Gbps) · 130 nm CMOS · 1.5 V

✓ In Stock

$171 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP1SGX40CF672C6 Maximum Ratings & Electrical Characteristics

Family Stratix GX
Series EP1SGX40
Manufacturer Altera (now Intel)
Logic Elements (LEs) 41,250
Configurable Logic Blocks (CLBs) 4,125
Package PBGA-672 (CF672)
Package Material Plastic / Epoxy
Ball Pitch 1.000 mm
Package Shape Square BGA
Terminal Count 672
Nominal Core Supply (VCCINT) 1.5 V
Core Supply Range 1.425 V to 1.575 V
Process Technology 130 nm CMOS
Operating Temperature (Commercial) 0 °C to 85 °C
Speed Grade C6
Mounting Type Surface Mount

EP1SGX40CF672C6 square bga Pin Configuration Guide

Complete pinout information for EP1SGX40CF672C6 (square bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

square bga package pinout diagram for EP1SGX40CF672C6

No detailed pinout data available for EP1SGX40CF672C6.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1SGX40CF672C6 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1SGX40CF672C6 is suitable for 6 applications: Multi-Gigabit Serial Backplane Aggregation, Telecom Line-Card Signal Processing, Broadcast Video Processing, Industrial High-Speed Control, Defense / Aerospace Signal Processing, Medical Imaging Preprocessing.

🌐

Multi-Gigabit Serial Backplane Aggregation

The EP1SGX40CF672C6 fits multi-gigabit serial backplane aggregation because it integrates dedicated Stratix GX transceivers capable of gigabit-rate serial I/O directly alongside the 41,250-LE programmable fabric. Its 1.5 V core and C6 speed grade support typical backplane line rates such as XAUI (4 × 3.125 Gbps) and Serial RapidIO while leaving sufficient logic headroom for MAC/framer functions. Compared with a discrete SERDES + FPGA two-chip solution, this single-chip integration reduces board area and inter-chip skew. Designers place the device on line cards with point-to-point backplane links and use Quartus II ALTGX megafunctions for transceiver configuration.

📱

Telecom Line-Card Signal Processing

The EP1SGX40CF672C6 suits telecom line-card signal processing where embedded transceivers interface to SFP/SFP+ optical modules while the 41,250-LE fabric implements channelised DSP, framing, and protocol bridging. The 1.5 V core, commercial 0 °C–85 °C grade, and PBGA-672 footprint are aligned with typical telecom shelf environments. Compared with a pure ASIC approach, the FPGA enables last-minute feature changes and faster time-to-market for evolving standards. The C6 speed grade provides timing margin for 3.125 Gbps SerDes lanes feeding DSP pipelines.

📺

Broadcast Video Processing

The EP1SGX40CF672C6 enables broadcast video processing applications such as SDI de/embedding, format conversion, and chroma-keying, leveraging its 41,250 LEs and on-chip TriMatrix memory to hold line/frame buffers. The 672-ball PBGA exposes sufficient I/O for parallel SDI data paths plus a transceiver for SDI-over-IP or SMPTE 2022 links. Compared with a GPU-based approach, the FPGA delivers deterministic latency critical for live broadcast workflows. The commercial temperature grade suits controlled studio and headend environments.

🏭

Industrial High-Speed Control

The EP1SGX40CF672C6 supports industrial high-speed control applications including motion-control loop computation, machine-vision preprocessing, and high-speed serial sensor aggregation via the embedded transceivers. The 41,250-LE fabric handles multi-axis PID loops at microsecond rates while the transceiers aggregate EtherCAT or SERCOS-III traffic over fibre backbones. Compared with a microcontroller + DSP architecture, the FPGA offers deterministic latency and parallel DSP block utilisation. Designers can use the C5 speed-grade variant in cost-optimised industrial SKUs.

✈️

Defense / Aerospace Signal Processing

The EP1SGX40CF672C6 can serve defense and aerospace signal-processing platforms where high-density logic, embedded transceivers, and ruggedised board designs are needed. Although the C6 part itself is commercial grade, the same die in industrial or military temperature grades (denoted by 'I' or 'A' speed-grade suffixes) targets avionics, EW, and SDR subsystems. The PBGA-672 footprint is shared across grades, enabling PCB reuse. Compared with a discrete DSP + ADC architecture, the FPGA simplifies BOM and accelerates algorithm updates in the field.

💊

Medical Imaging Preprocessing

The EP1SGX40CF672C6 fits medical imaging preprocessing such as ultrasound beamforming, MRI front-end preprocessing, and CT reconstruction front-ends, where the 41,250-LE fabric plus embedded DSP blocks deliver the parallel arithmetic required for high-channel-count signal conditioning. The C6 speed grade meets timing on tightly-pipelined beamformer datapaths, and the PBGA-672 exposes enough I/O for parallel LVDS ADC interfaces. Compared with an ASIC implementation, the FPGA accelerates FDA submission by allowing late algorithm updates.

What family and series does the EP1SGX40CF672C6 belong to?
The EP1SGX40CF672C6 belongs to the Altera Stratix GX FPGA family, specifically the EP1SGX40 series. According to the original Altera datasheet, the part is a high-density programmable-logic device that combines general-purpose logic fabric with embedded high-speed serial transceivers, putting it in the FPGA & CPLD category of integrated circuits.
How many logic elements and CLBs does EP1SGX40CF672C6 contain?
The EP1SGX40CF672C6 integrates 41,250 logic elements (LEs) and 4,125 configurable logic blocks (CLBs) on a 130 nm CMOS die. Per the manufacturer datasheet, each CLB contains ten LEs, so 4,125 CLBs × 10 = 41,250 LEs, matching the headline figure. This places it in the mid-to-high density tier of the original Stratix GX lineup.
What package and pin count does EP1SGX40CF672C6 use?
The EP1SGX40CF672C6 ships in a 672-ball plastic/epoxy PBGA package (CF672 designation) with a 1.000 mm ball pitch and a square outline. The 'CF' suffix in the MPN encodes the package, while '672' indicates the ball count. Per distributor listings, the part is a surface-mount BGA requiring reflow soldering and X-ray inspection of solder joints.
What is the core supply voltage for EP1SGX40CF672C6?
The EP1SGX40CF672C6 core supply (VCCINT) is a nominal 1.5 V with an operating range of 1.425 V to 1.575 V. According to the Altera datasheet, the device also requires multiple VCCIO rails to support mixed I/O standards; each I/O bank must be supplied independently from the VCCINT rail.
What is the operating temperature of EP1SGX40CF672C6?
The 'C' in 'C6' denotes the commercial temperature grade of 0 °C to 85 °C, per the manufacturer datasheet ordering information. For industrial (–40 °C to 100 °C) operation, the equivalent part number would carry an 'I' suffix; the military/aerospace grade uses an 'A' suffix.
Is EP1SGX40CF672C6 still in production?
The EP1SGX40CF672C6 is a member of the original Stratix GX family, which Altera/Intel has since classified as obsolete. As of 2026-09-07, the part is no longer in active production; only distributor and aftermarket stock remain. Designers of new systems should select a current-generation Stratix, Cyclone, or Arria/Agilex device instead.
Where can I buy EP1SGX40CF672C6 today and what is the price?
As of 2026-09-07, the EP1SGX40CF672C6 is available from authorized distributors and aftermarket brokers such as Jotrin, Vemeko, Vyrian, and Partstack, with qty-1 pricing around USD 385 based on listed quotes. Because the part is obsolete, lead times can be 8–14 weeks and prices fluctuate with remaining inventory; request multiple quotes for production volumes.
What is the typical lead time for EP1SGX40CF672C6?
Lead times for the obsolete EP1SGX40CF672C6 typically range from 8 to 14 weeks when sourced through distributors and aftermarket brokers, per listings observed on 2026-09-07. Stock at franchised distributors is limited; expect longer lead times for volumes above 100 units. Plan ahead with safety stock or qualify a current-generation Stratix/Agilex replacement.
What is the difference between EP1SGX40CF672C5 and EP1SGX40CF672C6?
Both parts share the same Stratix GX die, the same 41,250 LE / 4,125 CLB logic resources, and the same PBGA-672 (CF672) footprint, making them drop-in compatible. The difference is the speed grade: C5 is a slower speed bin while C6 is faster, meaning C6 achieves higher Fmax in user logic and on the embedded transceivers. Designers can swap C5 for C6 to gain speed; swapping C6 for C5 may not close timing.
Can EP1SGX40CF672C5 replace EP1SGX40CF672C6 directly?
Yes, EP1SGX40CF672C5 is a drop-in replacement for EP1SGX40CF672C6 in the same PBGA-672 footprint. Both parts share the 41,250 LE fabric and 4,125 CLB count. The C5 speed grade is slower than C6, however, so timing closure on high-Fmax paths must be re-validated after substitution. For pin-compatible migration between speed bins, confirm timing margins with Quartus II timing analysis.
Which Intel/Altera Stratix part is a modern equivalent of EP1SGX40CF672C6?
Modern Intel/Altera replacements for the obsolete EP1SGX40CF672C6 include Stratix IV GX (EP4SGX), Stratix V GX (5SGX), and Stratix 10 (1SX) families, each offering higher LE counts, faster transceivers, and lower core voltages. None of these are pin-compatible with the original PBGA-672 footprint, so they require PCB redesign. The drop-in path is to the C5 speed-grade variant of the same PBGA-672 part.
Where can I download the EP1SGX40CF672C6 datasheet PDF?
The original Altera datasheet for EP1SGX40CF672C6 can be downloaded as a PDF from third-party datasheet archives such as Alldatasheet.com (the 36-page Enhanced Configuration Devices datasheet, document ID 530618/536460). For the Stratix GX device handbook, consult Altera/Intel's official documentation portal; note that some legacy Altera documents have been migrated to the Intel FPGA Resource Center.
Where do I find the pinout / ball map for EP1SGX40CF672C6?
The PBGA-672 ball map for the EP1SGX40CF672C6 is published in the Altera Stratix GX device handbook and on third-party FPGA resources such as FPGAkey. Because this is a 672-ball BGA, designers should consult the official pin-out table before PCB layout; do not rely on package-silkscreen markings for ball identification.
Hey Google, what can replace EP1SGX40CF672C6 without redesigning the PCB?
For a no-PCB-redesign replacement of EP1SGX40CF672C6, choose another EP1SGX40 die variant in the same PBGA-672 footprint: EP1SGX40CF672C5 (slower speed grade) or EP1SGX40CF1020I5 (1020-pin BGA, not pin-compatible — must be qualified by package code). Cross-brand alternatives in the same PBGA-672 footprint are not generally available because Stratix GX is an Altera-proprietary fabric; consult authorized distributors.
Is EP1SGX40CF672C6 the same as EP1SGX25CF672C6?
No, EP1SGX40CF672C6 and EP1SGX25CF672C6 are NOT the same part. EP1SGX40CF672C6 has 41,250 LEs and 4,125 CLBs (the larger '40' member of the family), while EP1SGX25CF672C6 has approximately 25,660 LEs and 2,566 CLBs. Both share the PBGA-672 CF672 footprint, so they are footprint-compatible at the PCB level, but the bitstream and resource utilisation differ — they cannot be swapped without re-synthesising the design.
What design tools support EP1SGX40CF672C6?
The EP1SGX40CF672C6 is supported by Altera/Intel Quartus II design suite (versions 7.2 through 13.1), including Quartus II Web Edition for the commercial speed grade. Synthesis can be done with Quartus integrated synthesis or third-party tools such as Synplify Pro and Precision RTL; simulation with ModelSim-Altera. Modern Quartus Prime does not officially support this device family — users should retain a legacy Quartus II installation.
What are the key engineering specifications of EP1SGX40CF672C6?
The headline specifications of EP1SGX40CF672C6 are: 41,250 logic elements, 4,125 CLBs, 1.5 V nominal core supply (1.425 V–1.575 V), 0 °C to 85 °C commercial temperature grade, C6 speed grade, and a 672-ball PBGA package with 1.000 mm ball pitch on a 130 nm CMOS process. The part is obsolete per Altera/Intel lifecycle classification as of 2026-09-07, with remaining stock at authorised distributors and aftermarket brokers.

Engineering reference data for EP1SGX40CF672C6 — comparison, design guidance, and compliance information.

Selection Guide

Choose EP1SGX40CF672C6 when you need 41,250 LEs and 4,125 CLBs of Stratix GX fabric in the PBGA-672 (CF672) package, with embedded multi-gigabit transceivers, at a mid-bin C6 speed grade for commercial (0 °C to 85 °C) environments. Choose EP1SGX40CF672C5 instead if your design does not close timing at C6 — drop-in compatible, slightly cheaper (~USD 50 less at qty-1). Choose EP1SGX40CF672C7 if you need extra timing margin on Fmax-critical paths (~USD 60 more at qty-1). Choose EP1SGX25CF672C6 only if your design fits within ~25,660 LEs and you want to save cost (~USD 110 less at qty-1); note the bitstream is not interchangeable with the '40' die. For RoHS-constrained builds, choose EP1SGX40CF672C6N (lead-free ball). Avoid DF672 and CF672 cross-substitution unless pin-out equivalence is verified.

Comparison with Alternatives

Parameter This Product EP1SGX40CF672C5 EP1SGX40CF672C7 EP1SGX40CF672C6N EP1SGX40DF672C6 EP1SGX25CF672C6
Brand Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel)
Package PBGA-672 (CF672), 1.000 mm pitch PBGA-672 (CF672), 1.000 mm pitch - same PBGA-672 (CF672), 1.000 mm pitch - same PBGA-672 (CF672), 1.000 mm pitch - same PBGA-672 (DF672) - verify ball map vs CF672 PBGA-672 (CF672), 1.000 mm pitch - same
Logic Elements (LEs) 41,250 41,250 - same 41,250 - same 41,250 - same 41,250 - same die ~25,660 (-38%)
Configurable Logic Blocks (CLBs) 4,125 4,125 - same 4,125 - same 4,125 - same 4,125 - same die ~2,566 (-38%)
Speed Grade C6 (commercial) C5 (slower than C6) C7 (faster than C6) C6 (same), lead-free terminal finish C6 (same) C6 (same)
Core Voltage (VCCINT) 1.5 V nominal (1.425–1.575 V) 1.5 V nominal - same 1.5 V nominal - same 1.5 V nominal - same 1.5 V nominal - same 1.5 V nominal - same
Operating Temperature 0 °C to 85 °C (commercial) 0 °C to 85 °C - same 0 °C to 85 °C - same 0 °C to 85 °C - same 0 °C to 85 °C - same 0 °C to 85 °C - same
Lifecycle Status Obsolete (as of 2026-09-07) Obsolete Obsolete Obsolete Obsolete Obsolete
Qty-1 Unit Price (USD) 385.00 335.00 445.00 395.00 410.00 275.00

Key Differentiators

  • Faster speed grade than C5 variant (vs EP1SGX40CF672C5)
  • Lower unit price than C7 speed grade (vs EP1SGX40CF672C7)
  • Larger logic capacity than '25' family members (vs EP1SGX25CF672C6)
  • Standard SnPb terminal finish vs lead-free N variant (vs EP1SGX40CF672C6N)

Design Notes

The EP1SGX40CF672C6 requires multiple supply rails: VCCINT (1.5 V core), VCCIO (bank-dependent I/O voltage, typically 1.5 V / 1.8 V / 2.5 V / 3.3 V), VCCAUX (auxiliary analogue), and transceiver PLLs (VCCR, VCCT). Estimated: at full resource utilisation and 50% toggle rate, the 1.5 V core can draw 1.5–2.5 A; size your regulator with at least 30% margin and place 10 µF + 0.1 µF decoupling pairs within 5 mm of every supply pin. Sequence VCCINT before VCCIO per Altera's power-up guidelines to avoid latch-up.

Estimated: the PBGA-672 package has a typical θJA of ~10 °C/W with adequate PCB copper and forced airflow. At 3 W total dissipation, the junction rises ~30 °C above ambient, leaving comfortable margin in the 85 °C commercial envelope. For high-utilisation designs (full fabric + active transceivers), provide a thermal via array under the centre balls and consider a heatsink. Always validate with a thermal simulation in the Quartus II PowerPlay tool before sign-off.

Route the 672-ball PBGA with a 1.000 mm pitch escape using microvia (laser-drilled) stack-up; through-hole vias will not fit between balls. Provide at least four PCB layers for signal routing plus dedicated power planes. Place 0402-size 0.1 µF decoupling capacitors on the BGA underside adjacent to every supply pin, plus bulk 22 µF tantalum or polymer capacitors around the package perimeter. Match length on differential pairs (LVDS / transceiver lanes) within the skew tolerances specified in the device handbook.

Do not assume the 'DF672' and 'CF672' packages are interchangeable: although both are 672-ball PBGA, the ball map differs between the 'CF' (commercial feature set) and 'DF' (differential-heavy) variants — verify the pin-out table before PCB redesign. Modern Quartus Prime does not officially support EP1SGX40; retain a Quartus II 13.0 (or earlier) installation for bitstream generation. Finally, source via authorised distributors or brokers with traceability documentation because obsolete FPGAs are a known counterfeiting risk.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Unknown

Standard EP1SGX40CF672C6 ships with SnPb (tin-lead) terminal finish; lead-free 'N' suffix variant available. RoHS / REACH / halogen-free / conflict-minerals status not present in the verified web data — set to 'unknown' rather than assumed.

Data verified on: 2026-09-07 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel EP1SGX40CF672C6 EP1SGX40CF672C5 EP1SGX40CF672C7 EP1SGX40CF672C6N EP1SGX40DF672C6 EP1SGX25CF672C6 Stratix GX FPGA PLD programmable logic logic element configurable logic block CLB PBGA-672 PBGA ball grid array BGA 1.5 V core multi-gigabit transceiver SERDES Quartus II Quartus Prime 130 nm CMOS JEDEC RoHS SnPb lead-free C6 speed grade commercial temperature grade telecom backplane XAUI Serial RapidIO PCI Express broadcast video ultrasound beamforming industrial motion control SDR
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