EP1SGX40CF672C5 - 40K LE Stratix GX FPGA, 672-Pin BGA | Altera
MPN: EP1SGX40CF672C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
Drop-in alternatives for EP1SGX40CF672C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX25CF672C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$340 / Unit
View Datasheet →EP1SGX40CF672C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 LE |
| Embedded RAM | 3.42 Mbit |
| Maximum User I/O | 484 |
| Transceiver Channels | Up to 20 |
| Transceiver Data Rate | Up to 3.125 Gbps |
| PLLs | Up to 12 |
| Core Voltage | 1.5 V |
| Package | 672-ball FineLine BGA (27 x 27 mm) |
| Speed Grade | C5 (commercial) |
| Operating Temperature | 0C to +85C |
| Configuration Method | EPC / JTAG / Passive Serial |
| RoHS Status | unknown |
EP1SGX40CF672C5 672-ball fineline bga (27 x 27 mm) Pin Configuration Guide
Complete pinout information for EP1SGX40CF672C5 (672-ball fineline bga (27 x 27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40CF672C5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40CF672C5 is suitable for 6 applications: Multi-Gigabit Serial Backplane, SONET/SDH Framer Interface, Broadcast Video Router, Storage Area Network Switch, Industrial High-Speed Data Acquisition, Wireless Baseband Processing.
Multi-Gigabit Serial Backplane
The EP1SGX40CF672C5's 20 multi-gigabit transceiver channels operating up to 3.125 Gbps make it well suited for serial backplane switching fabrics in telecom central offices and data-center leaf/spine topologies. Each MGT lane carries XAUI, Serial RapidIO, or PCI Express with 8b/10b encoding, and the 41,250 LE fabric absorbs layer-2 forwarding, buffer management, and protocol encapsulation. The 672-ball FineLine BGA keeps serial lane lengths matched, which is critical for keeping jitter under the 0.35 UI budget of XAUI. Place external AC-coupling capacitors within 200 mils of each transceiver ball, and reference-clock distribution must use a low-jitter clock fanout buffer such as the CDCL6010.
Recommended
SONET/SDH Framer Interface
The EP1SGX40CF672C5 is widely used in OC-192/STM-64 framer line cards where 16-20 transceivers aggregate 2.488 Gbps optical tributaries. The 12 PLLs provide independent clock synthesis per channel, allowing different line rates to coexist on the same device, while the 3.42 Mbits of TriMatrix RAM store pointer state machines and payload mappings. The C5 commercial speed grade is sufficient for indoor central-office deployments, and Quartus II includes Altera's POS-PHY Level 4 and UTOPIA IV IP cores. Designers should budget 0.5W per active MGT at 3.125 Gbps and use a 12-layer PCB stackup with dedicated transceiver power islands.
Recommended
Broadcast Video Router
In broadcast SDI/HD-SDI/3G-SDI router chassis the EP1SGX40CF672C5 acts as the crosspoint fabric and re-clocker, replacing discrete FPGA/CPLD arrays. The 20 transceivers accept SMPTE 259M/292M/424M serial streams while the 41,250 LE fabric implements matrix switching up to 256 x 256. TriMatrix RAM holds line buffers for embedded audio (SMPTE 272M/299M) and ancillary data, and the 484 user I/O support GPIO for control and tally. Commercial temperature grade (0C to +85C) fits climate-controlled studios. Pair with the LMH0344 SDI reclocker for cable-equalized inputs.
Recommended
Storage Area Network Switch
The EP1SGX40CF672C5 is used in 4G/8G Fibre Channel and SATA/SAS storage switches where the 3.125 Gbps transceivers drive SFP+ cages. The 41,250 LE fabric absorbs cut-through FC frame handling, FSPF routing tables, and SAS expander logic, while TriMatrix RAM buffers large frame bursts. The 672-ball FineLine BGA exposes enough general-purpose I/O for SAS wide-port implementations. Quartus II 5.1+ supports the Altera FC and SAS IP cores, and the design migrates cleanly to Stratix IV GX for 8G FC upgrades.
Recommended
Industrial High-Speed Data Acquisition
Industrial test-and-measurement platforms use the EP1SGX40CF672C5 to capture multi-channel ADC data streams at gigabit rates and pre-process them in fabric DSP blocks before forwarding to host processors. The 3.42 Mbits of TriMatrix RAM plus on-chip multipliers implement FIR filters and FFT engines, while the 20 transceivers accept LVDS or SerDes streams from front-end ADCs. Commercial C5 grade is adequate for indoor industrial cabinets. Designers should validate thermal envelope with the 27 x 27 mm BGA thermal model since the device can dissipate 4-6 W under full MGT load.
Recommended
Wireless Baseband Processing
In WiMAX and early LTE picocell base stations the EP1SGX40CF672C5 performs baseband modulation/demodulation, channel coding, and CPRI/OBSAI framer termination to the radio unit. The 20 transceivers handle CPRI line rates up to 3.072 Gbps, the 41,250 LE fabric runs Turbo and Viterbi decoders, and the 12 PLLs synthesize the radio clock tree. The C5 commercial temperature range suits indoor picocell enclosures. Plan for ~5 W device power under full load and use a heat-spreader-equipped BGA socket for field-replaceable modules.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40CF672C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25CF672C7 | EP1SGX40CF1020C5 |
|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same footprint | 1020-ball FineLine BGA - different footprint |
| Logic Elements | 41,250 LE | 25,560 LE | 41,250 LE (same die) |
| Embedded RAM | 3.42 Mbit | 1.99 Mbit | 3.42 Mbit (same die) |
| Transceiver Channels | 20 | 16 | 20 (same die) |
| Transceiver Data Rate | Up to 3.125 Gbps | Up to 3.125 Gbps | Up to 3.125 Gbps |
| PLLs | Up to 12 | Up to 8 | Up to 12 (same die) |
| Maximum User I/O | 484 | 486 | 658 |
| Speed Grade | C5 (commercial) | C7 (slower, commercial) | C5 (commercial, same) |
| Lifecycle Status | NRND | NRND | NRND |
Key Differentiators
- Highest transceiver count in 672-ball FineLine BGA within Stratix GX family (vs EP1SGX25CF672C7)
- Highest-density 672-ball BGA option for long-lifecycle telecom programs (vs EP1SGX40CF1020C5)
- Mature Quartus II 5.1+ toolchain with extensive IP library (vs Newer Stratix II GX EP1SGX40)
Design Notes
Estimated: Use a 12-layer PCB stackup with dedicated transceiver power islands (VCCMGT, VTT, VCCT) routed as solid planes. Maintain 100-ohm differential impedance on MGT pairs and place AC-coupling capacitors within 200 mils of each transceiver ball. Decoupling: 0.1uF X7R at every power pin plus 10uF bulk per power island. Reference-clock traces must be length-matched to within 25 mils and routed on an inner stripline layer with continuous ground reference to keep jitter under 0.35 UI.
Estimated: The EP1SGX40CF672C5 can dissipate 4-6 W under full MGT load (0.5 W per active 3.125 Gbps transceiver plus core power at 1.5V). The 27 x 27 mm FineLine BGA thermal resistance theta_JA is approximately 12 C/W with 4-layer JEDEC test board, which yields a 72 C junction temperature rise above 85 C ambient - exceeding the C5 commercial spec. For full-load operation, mount a heat spreader or use 12-layer boards with 1 oz copper inner planes and thermal vias under the center balls.
Do not substitute the EPC16 configuration device for the older EPC8 or EPC2 - the EP1SGX40CF672C5 requires the enhanced configuration device family (EPC16, EPC64, EPC128) and will not configure from legacy EPC1/EPC2 chains. The C5 speed grade must be selected explicitly in Quartus II device selection; using C6 or C7 defaults will give incorrect timing analysis. JTAG chain ordering should place the EPC device between TDI and the FPGA for in-system programming safety.
Reference-clock distribution for the 20 MGT channels must use a low-jitter fanout buffer such as the CDCL6010 or AD9516. Crosstalk between adjacent MGT pairs exceeds -25 dB without proper spacing, so enforce at least 4x dielectric spacing between differential pairs and stitch vias every 200 mils along the ground return path. The reference-clock PCB traces should be 50-ohm single-ended controlled impedance; place a 49.9 ohm 1% termination at the receiver end and avoid stubs by using 0402 or smaller series resistor footprints.
Compliance Information
RoHS, REACH, and lead-free status not stated in the verified web data; consult the Altera/Intel package materials declaration or the manufacturer datasheet for compliance documentation. AEC-Q100 is not applicable because this is an industrial/telecom FPGA rather than an automotive-grade part.
