EP20K1000CF672I8 - APEX 20KC FPGA, 1M Gates, 672-FBGA | Intel
N.º de pieza: EP20K1000CF672I8 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $220.5 | $2.205,00 |
| 100 | $195 | $19.500,00 |
| 500 | $178 | $89.000,00 |
| 1.000 | $165 | $165.000,00 |
EP20K1000CF672I8 Descripción general
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between PALs/CPLDs (low-density, non-volatile, fixed interconnect) and ASICs (high-density, fixed-function, high NRE). The APEX 20KC family belongs to Intel's high-density SRAM-based programmable logic hierarchy: FPGA → programmable logic device → PLD → semiconductor. Because APEX 20KC cells are SRAM-backed, the device is re-programmable in-system and supports the MultiCore interconnect with embedded array blocks (EABs) for on-chip memory and constant storage.
Key features include 1M system gates, 38,400 logic elements, embedded array blocks (EABs) for true dual-port RAM and FIFO, four phase-locked loops (PLLs) for clock management, and LVTTL/LVCMOS/PCI/SSTL/HSTL I/O standards. Internal performance supports designs up to 301.21 MHz, and the 672-ball FineLine BGA package uses a 1.00 mm ball pitch suited for high-density, multi-layer PCB layouts. The industrial temperature grade (-40 °C to +85 °C) and 8 ns pin-to-pin logic delay further broaden its applicability.
Architecturally, the EP20K1000CF672I8 combines a fine-grained logic element fabric with coarse-grained EABs, allowing efficient implementation of wide datapath functions, FIFOs, and DSP-style multipliers without consuming excessive logic. The MultiCore interconnect provides predictable routing delays, which is essential for closing timing on multi-megahertz designs. Four PLLs support clock multiplication, division, and phase shifting, enabling multiple clock domains within a single device.
Typical applications include telecommunications backplane glue logic, PCI/PCI-X bridge and bus-interface controllers, high-speed parallel DSP pre-processing, industrial motion control and vision processing, and replacement of multiple CPLDs and gate arrays with a single reconfigurable part. The 508 I/O count makes the EP20K1000CF672I8 well suited for legacy 32-bit/64-bit bus aggregation that would otherwise require several discrete components.
When designing with this device, ensure all configuration pins (MSEL, nCONFIG, nSTATUS, CONF_DONE, DCLK) are pulled to the correct logic levels before power-up, and provide a stable 1.8 V supply with adequate bulk decoupling because SRAM-based FPGAs draw large inrush currents during configuration. Plan for JTAG (IEEE 1149.1) boundary-scan access to simplify board test.
Alternativas directas para EP20K1000CF672I8 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K1000CF672I8 (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Speed Grade, Process Technology, Configuration Interface.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K1000CF672I7
✅ Sustitución directa✓ En stock
$160 / unidad
Ver hoja de datos →EP20K1000CF672C8
✅ Sustitución directa✓ En stock
$245.09 / unidad
Ver hoja de datos →EP20K1000CF672C7
✅ Sustitución directa✓ En stock
$158 / unidad
Ver hoja de datos →EP20K1000CF672C8N
✅ Sustitución directa✓ En stock
$178.4 / unidad
Ver hoja de datos →EP20K1000CF672C7GZ
✅ Sustitución directa✓ En stock
$162.4 / unidad
Ver hoja de datos →EP20K1000CF672I8 Valores máximos y características eléctricas
| Family | APEX 20KC |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 0.15 µm CMOS |
| System Gates | 1,000,000 |
| Logic Elements / Cells | 38,400 |
| Encapsulado | 672-pin FC-FBGA (FineLine BGA) |
| Ball Pitch | 1.00 mm |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| User I/O Count | 508 |
| Dedicated Inputs | 4 |
| Internal Frequency (max) | 301.21 MHz |
| Pin-to-Pin Logic Delay | 8 ns |
| Temperatura de funcionamiento | -40 °C to +85 °C (industrial, I suffix) |
| Tipo de memoria | SRAM-based (volatile) |
| Embedded Memory | Embedded Array Blocks (EABs) for dual-port RAM / FIFO |
| PLL Count | 4 |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de EP20K1000CF672I8 672-pin fc-fbga (fineline bga)
Configuración de pines para EP20K1000CF672I8 (encapsulado 672-pin fc-fbga (fineline bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K1000CF672I8.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K1000CF672I8 es adecuado para 6 aplicacións: Telecommunications Backplane Interface Logic, PCI / PCI-X Bridge and Bus Aggregator, Industrial Motion Control, Machine Vision Pre-Processor, Multi-CPLD Replacement / Glue Logic Aggregation, High-Speed Parallel DSP Pre-Processing.
Telecommunications Backplane Interface Logic
The EP20K1000CF672I8 fits telecom backplane designs through its 508 user I/O and 1M system gates, enough to aggregate multiple low-speed T1/E1 framers, provide UART/SCAN muxing, and implement custom glue logic between line cards. The 301 MHz internal frequency sustains backplane bus repeaters, while the four PLLs derive independent clock domains for TDM and packet processing paths. Compared to a discrete CPLD bank, the APEX 20KC cuts board area and BOM line count significantly.
Recomendado
PCI / PCI-X Bridge and Bus Aggregator
With 38,400 logic elements and abundant I/O, the EP20K1000CF672I8 implements a full PCI/PCI-X 64-bit/66 MHz target or master bridge plus additional side-band logic on a single device. The 8 ns pin-to-pin delay keeps register-to-register timing within PCI-X 133 timing budgets, while the four PLLs generate the required 33/66/133 MHz clock domains. Embedded array blocks (EABs) hold payload buffers, reducing external SRAM.
Recomendado
Industrial Motion Control
Industrial motion controllers benefit from the EP20K1000CF672I8's 508 I/O to drive many stepper/servo axes simultaneously, with EAB-based dual-port RAM acting as command/feedback FIFOs between host CPU and pulse-train generators. The industrial temperature grade (-40 °C to +85 °C) suits factory-floor enclosures. The four PLLs deliver deterministic motor PWM frequencies, while 1M gates absorb trajectory-planning state machines.
Recomendado
Machine Vision Pre-Processor
The EP20K1000CF672I8 sits between a camera link/parallel image sensor and a host processor as a real-time pre-processor for filtering, thresholding, and feature extraction. EABs store line buffers and lookup tables, while the 38,400 logic elements implement Sobel/threshold/median kernels at video rates. Industrial temperature and 508 I/O accommodate multi-tap Camera Link interfaces.
Recomendado
Multi-CPLD Replacement / Glue Logic Aggregation
A single EP20K1000CF672I8 can replace 5-10 legacy 84-pin/144-pin CPLDs that historically populated industrial control boards, consolidating address decoding, bus arbitration, interrupt steering, and reset sequencing into one device. The 1.8 V core, however, requires level shifters to 3.3 V/5 V legacy logic; design with mixed-voltage I/O banks to interface directly without external translators.
Recomendado
High-Speed Parallel DSP Pre-Processing
The EP20K1000CF672I8's 1M gates and 301 MHz fabric support FIR filters, FFT butterfly stages, and correlation engines for radar/sonar pre-processing. EABs implement coefficient ROMs and data shift registers, while PLLs derive sample clocks at 80-200 MHz. The 672-pin BGA exposes 508 I/O for parallel ADC/DAC interfaces, eliminating the bottleneck of a serial link to the host DSP.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K1000CF672I8 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K1000CF672I7 | EP20K1000CF672C8 | EP20K1000CF672C7 | EP20K1000CF672C8N | EP20K1000CF672C7GZ |
|---|---|---|---|---|---|---|
| Package | 672-pin FC-FBGA (FineLine BGA) | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same | 672-pin FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| Speed Grade | I8 (8 ns pin-to-pin) | I7 (slower) | C8 (8 ns) | C7 (slower) | C8 (8 ns) | C7 (slower) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| User I/O | 508 | 508 | 508 | 508 | 508 | 508 |
Diferenciadores clave
- Industrial temperature grade for harsh environments (frente a EP20K1000CF672C8)
- Faster I8 speed grade for higher throughput (frente a EP20K1000CF672C7)
- Same-family drop-in for supply continuity (frente a EP20K1000CF672C8N)
Notas de diseño
Estimated: at 1.8 V VCCINT, a fully utilized APEX 20KC device draws approximately 1.5-2.5 A of core current depending on toggle rate. Provide at least four 100 µF bulk capacitors near the BGA plus 0.1 µF + 0.01 µF decoupling on every VCCINT/VCCIO pin pair. Plan VCCIO banks at 3.3 V or 2.5 V per bank to match attached peripherals. Power-on ramp must follow Altera's specified monotonic ramp to avoid configuration failure.
The 672-ball FineLine BGA has θJA ≈ 12-15 °C/W with a 4-layer JEDEC test board and adequate thermal vias under the die pad. Estimated: at 2 A core current and 1.8 V VCCINT, internal dissipation reaches 3.6 W, yielding a junction-to-ambient temperature rise of 43-54 °C. Place thermal via arrays (≥25 vias, 0.3 mm drill, 1.0 mm pitch) under the package center thermal pad to keep Tj below 100 °C in enclosed industrial enclosures.
Use a minimum 6-layer PCB stack-up with continuous power and ground planes adjacent to the BGA breakout layers. Escape the 1.00 mm-pitch BGA using micro-via-in-pad (0.1 mm laser vias) for inner-row signals; dog-bone fan-out is impractical at 672 balls. Length-match all DDR/Clock pairs to within 25 mil; provide series-termination resistors on high-speed LVTTL outputs to suppress undershoot.
Do not assume pin-compatible with newer Altera/Intel families: Cyclone, Stratix, and Arria devices all use different packages, ball maps, and configuration schemes. Always verify the configuration mode pins (MSEL0/MSEL1) match the EPC or flash memory used, and confirm the bitstream file (.sof or .pof) was generated for the exact speed grade ordered (I8 vs C8 vs C7) before programming.
Información de cumplimiento
Original APEX 20KC family pre-dates widespread RoHS compliance documentation; specific RoHS/REACH status not stated in the provided Verified Web Data. AEC-Q100 qualification not applicable - APEX 20KC is not automotive qualified. Use N-suffix or GZ-suffix variants when lead-free terminal finish is required.
