EP20K1000CF672C7 - 1M Gate APEX 20KC FPGA 508 I/O FC-FBGA | Intel
MPN: EP20K1000CF672C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 250 | $175 | $43,750.00 |
| 500 | $158 | $79,000.00 |
Drop-in alternatives for EP20K1000CF672C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K1000EFC672-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K1000CF672C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$245.09 / Unit
View Datasheet →EP20K1000CF672C9
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K1000CF672C7 Maximum Ratings & Electrical Characteristics
| Family | APEX 20KC |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 1,000,000 (typical) |
| Logic Elements / Cells | 38400 |
| Maximum Internal Frequency | 375.94 MHz |
| Propagation Delay | 1.6 ns (typical) |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Core Supply Voltage | 1.8 V |
| User I/O Count | 488 (some sources list 508) |
| Package | 672-ball FC-FBGA (45 × 45 mm, 1.27 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +85 °C (commercial, C suffix) |
| Speed Grade | C7 (fastest) |
| Embedded Memory (EAB) | Embedded array blocks (RAM/CAM/ROM) |
| PLL Count | 4 |
| Configuration Interface | Passive Serial, JTAG (IEEE 1149.1), Fast Passive Parallel |
EP20K1000CF672C7 672-ball fc-fbga (45 × 45 mm, 1.27 mm pitch) Pin Configuration Guide
Complete pinout information for EP20K1000CF672C7 (672-ball fc-fbga (45 × 45 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K1000CF672C7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K1000CF672C7 is suitable for 6 applications: Telecommunications Line Cards, ASIC Prototyping and Emulation, Industrial Machine Control, DSP and Microprocessor Glue Logic, Military and Aerospace Embedded Computing, High-Speed Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP20K1000CF672C7's 1 M system gates, 38400 logic elements, and 488 user I/Os make it well suited to telecommunications line-card designs where hundreds of LVTTL/LVDS signals interface to TDM framers, network processors, and serializer/deserializer chips. The device's 375.94 MHz maximum internal frequency and embedded array blocks (EABs) support high-speed packet header inspection and ATM cell processing. Designers typically instantiate multiple soft MAC cores alongside hardware CAM lookups in EABs, with 1.8 V VCCINT supplied by a dedicated LDO and 2.5 V/3.3 V VCCIO banks for upstream ASIC I/O compatibility.
Recommended
ASIC Prototyping and Emulation
With 1 M gates and 38400 logic elements, the EP20K1000CF672C7 served as a primary ASIC prototyping vehicle for medium-complexity ASICs in the 2001–2010 timeframe. The 488 user I/Os allow direct connection to ASIC package emulation fixtures, while the 4 PLLs provide flexible clock synthesis for multi-clock-domain ASIC designs. Engineers partition the ASIC RTL across multiple APEX 20KC devices using JTAG daisy-chain configuration. For new ASIC prototyping today, designers should evaluate Cyclone V or Stratix 10 instead.
Recommended
Industrial Machine Control
The EP20K1000CF672C7 is widely deployed in industrial machine controllers, PLCs, and motor-drive boards because its 488 user I/Os handle dozens of opto-isolated digital inputs, PWM outputs, encoder interfaces, and HMI display buses. Embedded array blocks (EABs) implement deterministic state machines and lookup tables for motion control, while 4 PLLs synthesize multiple clock domains from a single crystal. Industrial designs typically operate the part at 0–70 °C with LVTTL or 24 V-tolerant opto-isolated I/O; the EP20K1000CF672C7's commercial 0–85 °C temperature range fits most factory-floor enclosures.
Recommended
DSP and Microprocessor Glue Logic
The EP20K1000CF672C7 acts as high-performance glue logic between microprocessors, DSPs, and external memory in embedded computing platforms. Its 38400 LEs easily absorb wide FIFO buffers, SDRAM controllers, DMA engines, and custom bus bridges; embedded array blocks (EABs) implement dual-port RAM up to 4096 bits each for high-bandwidth data path buffering. The 488 user I/Os accommodate 32-bit external memory buses plus PCI or LVDS links to co-processors. The 1.8 V core consumes modest power at moderate toggle rates, suitable for fanless embedded boxes.
Recommended
Military and Aerospace Embedded Computing
Although the EP20K1000CF672C7 is a commercial-temperature part, it is found in many legacy military and aerospace embedded computing platforms because of its high I/O count and proven APEX 20KC architecture. Designers pair it with radiation-tolerant front-end ASICs, store critical state in EAB-based CAM for deterministic lookup, and use the 4 PLLs for redundant clock synthesis. The 672-ball FC-FBGA package supports hermetic and ceramic-column-grid-array rework for ruggedized modules. For new Mil/Aero designs, Intel recommends the military-temperature EP20K1000CB652I8 variant or migrating to Rad-Hard Stratix equivalents.
Recommended
High-Speed Test and Measurement Instrumentation
The EP20K1000CF672C7's 375.94 MHz internal frequency and 488 user I/Os enable high-speed pattern generation, logic analyzer capture, and protocol exerciser designs used in bench-top test equipment. Embedded array blocks (EABs) implement deep capture buffers and pattern lookup tables, while the 4 PLLs synthesize multiple test clock domains from a single reference. Engineers typically combine the device with high-speed ADC/DAC front-ends, configuring the part via JTAG for fast design iteration. The 672-ball FC-FBGA package's 1.27 mm pitch keeps the board compact even with hundreds of test points.
Recommended
Recommended Products Summary
Engineering reference data for EP20K1000CF672C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K1000EFC672-2X | EP20K1000CF672C8 | EP20K1000CF672C9 | EP20K1000CB652I8 | EP20K1000CB652C9ES |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FC-FBGA (45x45 mm, 1.27 mm pitch) | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 652-ball BGA - different | 652-ball BGA - different |
| Family / Generation | APEX 20KC (0.15 µm) | APEX 20KE (0.22 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) | APEX 20KC (0.15 µm) |
| Logic Elements | 38400 | 38400 | 38400 | 38400 | 38400 | 38400 |
| System Gates | 1 M | 1 M | 1 M | 1 M | 1 M | 1 M |
| Max Internal Frequency | 375.94 MHz | 350 MHz (-7%) | ~330 MHz (-12%) | ~290 MHz (-23%) | 375.94 MHz | ~290 MHz (-23%) |
| User I/O Count | 488 | 488 | 488 | 488 | fewer (652-ball package) | fewer (652-ball package) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Fastest speed grade (C7) in the APEX 20KC family at 672-ball FC-FBGA (vs EP20K1000CF672C8)
- Newer 0.15 µm copper process vs 0.22 µm in APEX 20KE (vs EP20K1000EFC672-2X)
- Largest I/O count variant (488 user I/Os) in the APEX 20KC family (vs EP20K1000CB652I8)
Design Notes
Estimated: core power scales with toggle rate. At 100 MHz system clock with 50 % logic utilization, the EP20K1000CF672C7 typically draws 1–2 A from the 1.8 V VCCINT rail. Provide a 1.8 V LDO rated for at least 3 A with 100 mV peak-to-peak noise, and decouple every VCCINT pin with 0.1 µF X7R plus 10 µF bulk. VCCIO banks (2.5 V or 3.3 V) supply I/O drivers and can draw up to 1 A per bank under heavy switching; use separate regulator zones per VCCIO bank to prevent switching noise coupling into VCCINT.
The 672-ball FC-FBGA package has a 45 × 45 mm body and 1.27 mm ball pitch, which is reworkable but requires a 4-layer minimum PCB with continuous ground plane beneath the package. Use 0.8 mm via-in-pad micro-vias under the BGA balls if you need to escape all 672 signals on a 4-layer stack, or move to a 6-layer stack with buried vias for higher yield. Keep all configuration/JTAG traces short (< 50 mm) and route them on the top layer adjacent to the BGA to minimize reflection on the TCK/TMS chain.
Configuration-mode pin strapping (MSEL0/MSEL1/MSEL2) must match the desired mode on power-up or the device will not enter user mode. Do not leave any VCCIO bank floating - unused banks must still be tied to a valid voltage to avoid I/O buffer latch-up during configuration. The CONF_DONE pin must be monitored by the host CPU or external watchdog because stuck-at-low indicates a configuration failure; do not assume a successful boot from power-good alone.
Estimated: at 1 A core current and 1.8 V, the EP20K1000CF672C7 dissipates roughly 1.8 W at full toggle rate. The FC-FBGA package has a θJA around 12–15 °C/W with a standard 4-layer JEDEC test board, producing a 22–27 °C temperature rise. No external heatsink is required for typical commercial designs, but ensure adequate airflow (> 100 LFM) if the part sits adjacent to a > 2 W power supply on the board.
LVDS I/O on the EP20K1000CF672C7 requires 100 Ω differential termination near the receiver; do not route LVDS pairs longer than 500 mm without re-evaluating eye margins. For DDR-style interfaces, place the FPGA, memory, and termination resistors in a 'fly-by' topology with stubs under 25 mm. Use the Quartus II 13.0sp1 toolchain's pin planner to assign SSO (Simultaneously Switching Output) limits per bank and avoid exceeding the I/O bank's VCCIO current rating.
Compliance Information
APEX 20KC family pre-dates widespread RoHS/REACH material declarations by Intel/Altera. Engineers shipping into the EU or automotive applications should request a manufacturer material declaration from the specific lot/date code before design-in.
