EP20K100QC240-3V - APEX 20KE FPGA 100K Gates 189 I/O 240-BFQFP | Intel
N.º de pieza: EP20K100QC240-3V ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $128.5 | $1.285,00 |
| 100 | $110 | $11.000,00 |
| 250 | $98.75 | $24.687,50 |
| 500 | $87.2 | $43.600,00 |
EP20K100QC240-3V Descripción general
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing configurable logic blocks, interconnect, and I/O cells that engineers can program after manufacturing to implement custom digital circuits. FPGAs sit within the programmable logic hierarchy above CPLDs and below ASICs, offering higher density than CPLDs and lower NRE cost than ASICs. The APEX 20KE family specifically targets SOPC (System-On-a-Programmable-Chip) integration, combining LUT logic, product-term logic, and embedded memory blocks in one fabric.
Key features of the EP20K100QC240-3V include a -3 speed grade, 0.22 µm process technology, maximum operating frequency of 167 MHz, in-system programmability via IEEE 1149.1 JTAG, and support for multiple I/O standards including LVTTL, LVCMOS, and LVDS. The MultiCore architecture lets designers place register-intensive logic in LUTs and combinatorial glue logic in product-term blocks, optimizing silicon efficiency for mixed datapath/control designs.
Typical applications include telecommunications line cards, high-speed datapath processing, DSP co-processing, glue-logic integration, and PCI bus interface bridging. The 53,248 bits of embedded memory can be configured as RAM, ROM, or FIFO, enabling single-chip implementation of state machines with on-chip buffering.
When designing with this part, note that the -3V suffix indicates the device is lead-free and RoHS-compliant, while -3 alone denotes the standard lead-bearing variant. Both share the same 240-BFQFP footprint (32x32 mm) and identical die, so PCB layouts can accommodate either part. Designers should use the Quartus II design software (legacy) for synthesis, place-and-route, and timing closure.
Alternativas directas para EP20K100QC240-3V — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K100QC240-3V (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Speed Grade, Total RAM Bits, Maximum Internal Frequency.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K100QC240-3N
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP20K100QC240-3
✅ Sustitución directa✓ En stock
$24.5 / unidad
Ver hoja de datos →EP20K100QC240-2
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP20K100QC240-1
✅ Sustitución directa✓ En stock
$98 / unidad
Ver hoja de datos →EP20K100QC240-1XV
✅ Sustitución directa✓ En stock
$52.1 / unidad
Ver hoja de datos →EP20K100QC240-3V Valores máximos y características eléctricas
| Series | APEX-20KE |
| Family | APEX-20K |
| Logic Logic Elements / Cells | 4,160 |
| Total System Gates | 100,000 |
| Total RAM Bits | 53,248 |
| Number of User I/O | 189 |
| Number of Logic Blocks | 53248 (LABs) |
| Core Voltage | 2.375 V to 2.625 V |
| Temperatura de funcionamiento | 0C to +85C (Commercial) |
| Maximum Frequency | 167 MHz |
| Process Technology | 0.22 µm CMOS |
| Tipo de montaje | Surface Mount |
| Encapsulado | 240-BFQFP (32 x 32 mm) |
| Speed Grade | -3 (fastest APEX 20KE grade) |
| Lead-Free / RoHS | Yes (-3V suffix) |
| In-System Programmability | Yes (IEEE 1149.1 JTAG) |
Guía de configuración de pines de EP20K100QC240-3V 240-bfqfp (32 x 32 mm)
Configuración de pines para EP20K100QC240-3V (encapsulado 240-bfqfp (32 x 32 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K100QC240-3V.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K100QC240-3V es adecuado para 6 aplicacións: Telecommunications Line Cards, DSP Co-Processing and Acceleration, PCI Bus Interface Bridging, Glue-Logic Integration and Chip-Set Replacement, Industrial Control and Automation, Legacy Telecom and Datacom Backplane Bridging.
Telecommunications Line Cards
The EP20K100QC240-3V fits telecom line-card designs through its combination of 100K system gates, 53,248 bits of embedded memory, and 189 user I/O pins enabling multi-protocol bridging. The MultiCore architecture lets designers place high-speed datapath (such as framer/mapper logic) in LUT cells while mapping glue control logic to product-term blocks. Operating at 167 MHz internal frequency, the part can handle T1/E1 aggregation, HDLC controllers, and UART multiplexing within a single device. The 240-BFQFP package provides the thermal headroom and pin density needed for chassis backplane interfaces while supporting LVDS I/O for low-EMI serial links.
Recomendado
DSP Co-Processing and Acceleration
With 4,160 logic elements and 167 MHz timing closure, the EP20K100QC240-3V serves as a co-processor that offloads DSP routines from a host DSP or microcontroller. The MultiCore architecture supports parallel multiplier/accumulator structures and FFT butterflies, while the 53 kbits of embedded RAM acts as a circular buffer for sample data. Designers can implement custom FIR filters, FFT engines, and video-processing kernels. The 240-BFQFP package exposes enough user I/O (189 pins) to stream parallel data buses between the host processor and the FPGA without multiplexing penalties.
Recomendado
PCI Bus Interface Bridging
The EP20K100QC240-3V's 100K gate capacity and 189 user I/O pins make it well-suited as a PCI-to-local-bus bridge, a common use case for APEX 20KE devices in industrial PCs and embedded motherboards. The 167 MHz performance supports 33 MHz PCI at full throughput, while the JTAG boundary-scan capability simplifies board-level test. Embedded memory blocks handle PCI transaction FIFOs without external SRAM, reducing BOM cost. Designers can route 32-bit PCI plus local bus plus interrupt and arbitration signals within the 189 available user I/O pins.
Recomendado
Glue-Logic Integration and Chip-Set Replacement
Designers frequently choose the EP20K100QC240-3V to consolidate discrete 74-series glue logic, FIFOs, and address-decoder PLDs into a single programmable device. The MultiCore architecture's product-term logic is well-suited to decoder, mux, and state-machine functions, while LUT logic handles wider datapaths. Replacing 5-15 discrete logic chips with one APEX 20KE cuts PCB area, simplifies sourcing, and adds in-system reconfigurability for late-stage design fixes. The 240-BFQFP footprint provides ample I/O for chip-set replacement in legacy industrial and military designs.
Recomendado
Industrial Control and Automation
Industrial control applications leverage the EP20K100QC240-3V's embedded memory for storing PLC ladder-logic-equivalent state machines and the high I/O count for interfacing to sensor arrays and motor-control peripherals. The 2.5V core and 167 MHz internal clock support deterministic timing for closed-loop control loops, while the LVDS I/O standard enables noise-immune communication with industrial sensors over long cable runs. The 240-BFQFP package is robust for industrial thermal environments and supports both commercial and industrial temperature grades within the family.
Recomendado
Legacy Telecom and Datacom Backplane Bridging
Backplane bridging designs in legacy telecom and datacom systems frequently use the EP20K100QC240-3V to translate between proprietary backplane protocols, custom serial formats, and standard buses. The 189 user I/O pins are sufficient for 8-bit to 32-bit parallel bus widths plus clock, frame-sync, and interrupt signals. Embedded memory acts as elastic-store FIFO between mismatched clock domains. The JTAG-based in-system programmability allows remote firmware upgrades, valuable for unmanned or hard-to-access sites.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K100QC240-3V — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K100QC240-3N | EP20K100QC240-3 | EP20K100QC240-2 | EP20K100QC240-1 | EP20K100QC240-1XV |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP (32x32 mm) | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same | 240-BFQFP (32x32 mm) - same |
| Speed Grade | -3 (fastest) | -3 (same) | -3 (same) | -2 (slower) | -1 (slowest) | -1 (slowest, lead-free) |
| Lead-Free / RoHS | Yes | Yes | No (leaded) | No (leaded, default) | No (leaded, default) | Yes (lead-free, XV) |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Total System Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Total RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| User I/O Count | 189 | 189 | 189 | 189 | 189 | 189 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Lead-free RoHS construction while sharing identical die with leaded -3 variant (frente a EP20K100QC240-3)
- Fastest -3 speed grade in the APEX 20KE 100K family (frente a EP20K100QC240-2)
- MultiCore architecture with embedded memory for single-chip implementations (frente a EP20K100QC240-1)
Notas de diseño
The 240-BFQFP package uses a 0.5 mm lead pitch and gull-wing leads. PCB layout must use 0.15-0.20 mm wide traces between lands with at least 4 mil spacing for the inner rows; do not route signals through the lead footprint. Place decoupling capacitors (0.1 µF ceramic plus 10 µF tantalum) within 5 mm of every VCCINT/VCCIO pin pair. For the PLL analog supply pins, use a ferrite bead and 10 µF tantalum bypass.
Configure I/O banks for LVDS only when adjacent I/O standards permit. APEX 20KE requires that all I/O in a bank share the same VCCIO reference voltage. For high-speed LVDS outputs (>200 MHz toggle), use controlled-impedance routing (50 ohm differential, 100 ohm differential), keep trace length matching to within 0.5 mm, and use ground-plane reference with via stitching every 10 mm.
Estimated: the APEX 20KE configuration flash memory is one-time-programmable for some device variants. Engineers planning field upgrades must select a serial-configuration scheme or use JTAG-based in-system programmability. When migrating between -3, -2, and -1 speed grades, expect ~25-40% timing closure differences - re-run Quartus II timing analysis after any speed-grade swap. Do not assume -V (lead-free) and non-V variants share identical thermal profiles; the lead-free solder-joint metallurgy has slightly different thermal-fatigue characteristics.
Información de cumplimiento
Lead-free / RoHS compliant per -3V suffix designation. AEC-Q100 qualification is not applicable for legacy Altera APEX 20KE FPGAs (automotive applications require newer Cyclone Auto parts). Halogen-free and conflict-minerals compliance not specified in available data.
