EP20K30EFC324-1 - APEX-20K 30KLE FPGA 324-FBGA | Altera
N.º de pieza: EP20K30EFC324-1 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 250 | $108 | $27.000,00 |
| 500 | $99.5 | $49.750,00 |
EP20K30EFC324-1 Descripción general
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can configure after manufacture. APEX-20K belongs to the PLD -> CPLD/FPGA -> SRAM-based FPGA -> programmable logic IC hierarchy, providing system-on-a-programmable-chip (SOPC) integration. The MultiCore architecture of APEX-20KE combines look-up table (LUT) logic, product-term logic, and embedded memory blocks in one fabric.
Key features of the EP20K30EFC324-1 include 30,000 typical logic elements (LEs), 24,576 total RAM bits, 128 maximum user I/O, and 1.8 V core operation. The device supports LVDS I/O and embeds an enhanced clock management capability with up to four phase-locked loops (PLLs). The 324-FBGA package is a 19 mm x 19 mm FineLine BGA suitable for high-density PCB designs and high-speed signal fan-out.
From an architectural perspective, the APEX-20KE family uses a four-level hierarchy (Logic Array, MegaLAB, Logic Element, Embedded System Block) and embedded array blocks (EABs) for memory and product-term logic. Hot-socketing and JTAG boundary-scan testability are supported. The fabric is configured by an industry-standard serial configuration device.
Typical applications include telecommunications line cards, ASIC prototyping, glue-logic consolidation, DSP co-processing front-ends, and industrial control boards where the 30KLE density is appropriate. The 324-FBGA footprint is appropriate for high-I/O designs (128 user I/O). When designing with this part, confirm the configuration scheme (passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG) and use Altera Quartus II for synthesis and place-and-route.
Alternativas directas para EP20K30EFC324-1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K30EFC324-1 (mismo factor de forma y huella) — difiere en Process Technology, Family, Package, Speed Grade, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K30EFC324-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP20K30EFC324-1N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP20K30EFC324-3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$175 / unidad
Ver hoja de datos →EP20K60EFC324-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$41.75 / unidad
Ver hoja de datos →EP20K100EFC324-1N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$108 / unidad
Ver hoja de datos →EP20K30EFC324-1 Valores máximos y características eléctricas
| Manufacturer | Altera (now Intel) |
| Series | APEX-20K |
| Family | APEX-20KE (1.8V, LVDS) |
| Logic Elements (typical) | 30,000 (30KLE) |
| Total RAM Bits | 24576 |
| Maximum User I/O | 128 |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| Encapsulado | 324-FBGA (FineLine BGA, 19x19 mm) |
| Tipo de montaje | Surface Mount |
| Recuento de pines | 324 |
| Temperature Grade | Commercial (per Altera family specification) |
| Temperatura de funcionamiento | 0C to +85C (commercial grade per Altera family spec) |
| Process Technology | SRAM-based, 0.18 um |
| Configuration | Passive serial / passive parallel / JTAG |
| Speed Grade | -1 |
| PLLs | Up to 4 (per APEX-20KE family) |
Guía de configuración de pines de EP20K30EFC324-1 324-fbga (fineline bga, 19x19 mm)
Configuración de pines para EP20K30EFC324-1 (encapsulado 324-fbga (fineline bga, 19x19 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K30EFC324-1.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K30EFC324-1 es adecuado para 7 aplicacións: Legacy Telecom Line Cards, ASIC Prototyping, Industrial Control and Glue Logic Consolidation, DSP Co-Processing Front-Ends, Flat-Panel Display and Video Processing, Test and Measurement Instrumentation, Legacy Networking Backplane Bridges.
Legacy Telecom Line Cards
The EP20K30EFC324-1's 30KLE logic capacity and 128 user I/O make it suitable for legacy telecom line card glue logic, particularly E1/T1 framers, HDLC controllers, and bus-aggregation logic where APEX-20KE boards are already field-deployed. The 1.8 V core, 324-FBGA footprint and embedded array blocks (EABs) allow consolidation of multiple 5V CPLDs into one low-power device. PLLs (up to 4) can recover clock from multiple E1/T1 streams simultaneously. Use Quartus II 9.1sp2 for synthesis because newer Quartus releases dropped APEX-20KE support.
Recomendado
ASIC Prototyping
With 30KLE of logic and 24,576 bits of embedded RAM (EABs), the EPEX-20K30EFC324-1 is sized appropriately for ASIC prototyping of small gate-array designs (roughly 30-60K gates). The MultiCore architecture mixing LUT logic, product-term logic, and memory blocks is faithful to common ASIC styles, allowing accurate timing simulation. The 324-FBGA package exposes all I/O for easy logic-analyzer probing on prototype boards. Designers should plan migration to Cyclone IV E or Cyclone V once the ASIC is taped out.
Recomendado
Industrial Control and Glue Logic Consolidation
The EP20K30EFC324-1 is widely used in legacy industrial controllers to consolidate multiple 5 V or 3.3 V PLDs and glue-logic ICs into a single 1.8 V device, reducing board area and BOM cost. The 324-FBGA package supports 128 user I/O, sufficient for backplane glue logic, interrupt controllers, and protocol bridges (e.g. UART to SPI). Industrial users should note that the part is obsolete; redesign is recommended for new platforms but the part remains field-supported via Rochester Electronics.
Recomendado
DSP Co-Processing Front-Ends
The EP20K30EFC324-1's embedded array blocks (EABs) provide up to 24,576 RAM bits that can be configured as dual-port RAM or ROM look-up tables, suitable for FIR filter coefficients or waveform tables in DSP co-processing designs. Combined with up to 4 PLLs and LVDS I/O, the part can feed data into an external DSP (e.g. a TI TMS320C6000) at high sample rates. For new DSP co-processing designs, however, modern Cyclone V or MAX 10 are recommended.
Recomendado
Flat-Panel Display and Video Processing
The EP20K30EFC324-1's LVDS I/O support (a defining APEX-20KE feature) and 128 user I/O permit driving multiple LVDS data channels for flat-panel display controllers and low-resolution video processing front-ends. The fabric can implement scaling engines, color-space converters, and timing controllers. Legacy LCD TV mainboards and projector engines historically used APEX-20KE parts at this density. Modern video processing uses Cyclone IV/V with hard PCIe and DDR controllers.
Recomendado
Test and Measurement Instrumentation
With 128 user I/O, four PLLs, and embedded RAM blocks, the EP20K30EFC324-1 has been used in test and measurement gear for stimulus generation, custom protocol decoding, and timing-critical pattern generation. The 324-FBGA package provides generous I/O access for parallel logic-analyzer probes. Maintenance of legacy T&M equipment (e.g. ATE loadboards, protocol testers) remains a stable use case for this part because the bitstreams are already deployed and validated.
Recomendado
Legacy Networking Backplane Bridges
Legacy networking hardware - in particular PCI/PCI-X bridges, SPI/I2C aggregators, and switch fabric controllers - was designed around APEX-20KE devices like the EP20K30EFC324-1. The 324-FBGA package and 128 I/O support multi-port bridging on compact line cards. Although new networking designs use modern Cyclone V/10 and Stratix families, the EP20K30EFC324-1 remains in service for legacy switch and router platforms via Rochester Electronics' stocking program.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K30EFC324-1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K30EFC324-2 | EP20K30EFC324-1N | EP20K30EFC324-3 | EP20K60EFC324-2 | EP20K100EFC324-1 |
|---|---|---|---|---|---|---|
| Package | 324-FBGA (19x19 mm) | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 30,000 (30KLE) | 30,000 | 30,000 | 30,000 | 60,000 (60KLE) | 100,000 (100KLE) |
| Speed Grade | -1 (fastest) | -2 (slower) | -1 (same, lead-free) | -3 (slowest) | -2 | -1 |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Bitstream Compatibility | Reference | Compatible (same IDCODE/density) | Compatible (same IDCODE/density) | Compatible (same IDCODE/density) | NOT compatible - different IDCODE/density | NOT compatible - different IDCODE/density |
Diferenciadores clave
- Fastest speed grade in APEX-20KE 30KLE 324-FBGA family (frente a EP20K30EFC324-3)
- Lead-free (-1N) variant preserves identical timing for reflow compatibility (frente a EP20K30EFC324-1 (lead version))
- Lowest-density / smallest-bitstream 324-FBGA APEX-20KE option (frente a EP20K100EFC324-1)
Notas de diseño
Do not assume 324-FBGA across different APEX-20KE logic densities share bitstreams. EP20K30EFC324-1, EP20K60EFC324, and EP20K100EFC324 all share the same 324-FBGA ballmap, but each has a unique IDCODE and bitstream. Programming an EP20K30EFC324-1 bitstream into a larger-density device does NOT work - Quartus II will detect the IDCODE mismatch and refuse to configure. For migration, re-synthesize the design at the new density before programming.
The 324-FBGA 19 mm x 19 mm package requires a 1.27 mm ball pitch and at least 6 PCB layers to route 128 user I/O with controlled impedance. Use microvia or via-in-pad technology if the PCB stackup is 8 layers or fewer; otherwise dog-bone fan-out is acceptable but consumes more board area. BGA landing pads must be NSMD (non-solder-mask defined) for reliable joint formation - MSMD pads are prone to cracking under thermal cycling.
Estimate: at typical 1.8 V core, 30KLE utilization around 70%, and 50 MHz clock, ICCINT is approximately 0.3-0.5 A (estimate based on APEX-20KE family typical current). VCCIO banks consume additional current proportional to switching I/O; a fully-loaded 16-bit LVDS bank can draw an additional 0.05-0.1 A. Decouple each VCCINT pin with 0.1 uF + 10 uF, and each VCCIO bank with 0.1 uF per pin. A bulk 47-100 uF tantalum at the regulator output is recommended.
Keep all configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL, DCLK, DATA0) routed away from switching I/O to avoid noise coupling during configuration. The JTAG chain (TCK, TMS, TDI, TDO) should be series-terminated with 33 ohm if the chain exceeds 4 inches. Place the configuration EPROM/CPLD within 2 inches of the FPGA to minimize DCLK skew during passive-serial configuration.
Información de cumplimiento
RoHS and lead-free status not specified in the verified web data; EP20K30EFC324-1N variant is a lead-free / Pb-free variant per APEX-20KE family naming convention. Original -1 (without N suffix) is presumed non-RoHS.
