EP2A25B724C7 - APEX II FPGA 540 I/O 724-FCBGA | Altera
N.º de pieza: EP2A25B724C7 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $935 | $935,00 |
| 10 | $900 | $9.000,00 |
| 100 | $850 | $85.000,00 |
| 500 | $800 | $400.000,00 |
| 1.000 | $760 | $760.000,00 |
EP2A25B724C7 Descripción general
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that implements arbitrary digital logic through a configurable array of logic elements (LEs), embedded memory blocks, and routing interconnects. FPGAs sit between fixed-function ASICs and discrete logic, offering hardware-level parallelism, deterministic latency, and post-manufacture design revision. Within the broader taxonomy, FPGAs are a subset of programmable logic devices (PLDs), distinct from CPLDs by their higher logic density, embedded RAM, and on-die multipliers. The APEX II family specifically combines Look-Up Table (LUT)-based logic elements with embedded memory and dedicated carry chains optimized for DSP and datapath workloads.
Key features include up to 24,320 logic elements, embedded system blocks (ESBs) implementing dual-port RAM and ROM, dedicated multiplier support for DSP, multi-volt I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, and 8 PLLs for clock management. The 724-FCBGA package supports high signal-count designs with controlled-impedance traces and is compatible with multilayer PCB stack-ups. The device is rated for commercial operating temperatures and supports in-system programmability via JTAG.
The EP2A25B724C7 is built on Altera's MultiCore architecture, integrating LUT-based logic with embedded memory and dedicated arithmetic resources on the same die. The 1.5V core supply and 0.15 µm process reduce dynamic power relative to older APEX devices while preserving pin compatibility across speed grades. Designers can leverage the Quartus II design environment for synthesis, place-and-route, and timing closure.
Typical applications include high-throughput digital signal processing, telecommunication baseband processing, industrial machine vision, and high-speed data acquisition front-ends. The combination of 540 user I/Os and 24K logic elements makes the EP2A25B724C7 well suited for protocol bridging and parallel processing engines.
When designing with this device, allocate at least four PCB layers with dedicated ground and power planes, use 1 oz copper for high-current rails, and follow Altera's pin-out guidelines for FCBGA breakout. Decoupling should include 0.1 µF ceramics at every VCC pin and bulk capacitors near each supply island. Verify signal integrity on DDR/QSPI interfaces with controlled-impedance routing and length matching.
This page synthesizes distributor pricing, lifecycle observations, and drop-in same-brand speed-grade alternatives sourced from the Altera APEX II family datasheet, providing a one-stop engineering summary not found in any single distributor listing.
Alternativas directas para EP2A25B724C7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2A25B724C7 (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Process Technology, Speed Grade, System Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2A25B724C8
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2A25B724C9
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2A25B724-C7
✅ Sustitución directa✓ En stock
$195 / unidad
Ver hoja de datos →EP2A25B652C7
✅ Sustitución directa✓ En stock
$285 / unidad
Ver hoja de datos →EP2A15B724C7
✅ Sustitución directa✓ En stock
$125 / unidad
Ver hoja de datos →EP2A25B724C7 Valores máximos y características eléctricas
| Family | APEX II |
| Logic Elements | 24,320 |
| System Gates | 900,000 |
| Maximum User I/O | 540 |
| Internal Frequency | 500 MHz |
| Speed Grade | -7 |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Encapsulado | 724-BBGA / FCBGA (35 mm × 35 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) |
| Embedded System Blocks (ESB) | Yes (dual-port RAM/ROM) |
| PLLs | 8 |
| Multipliers | Yes (dedicated DSP blocks) |
| Configuration Interface | JTAG (IEEE 1149.1) |
Guía de configuración de pines de EP2A25B724C7 724-bbga / fcbga (35 mm × 35 mm)
Configuración de pines para EP2A25B724C7 (encapsulado 724-bbga / fcbga (35 mm × 35 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2A25B724C7.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2A25B724C7 es adecuado para 6 aplicacións: Telecommunication Baseband Processing, High-Throughput Digital Signal Processing, Industrial Machine Vision, High-Speed Data Acquisition Front-End, Protocol Bridging and Interface Conversion, Aerospace and Defense Avionics.
Telecommunication Baseband Processing
The EP2A25B724C7's 24,320 logic elements and embedded system blocks (ESBs) for dual-port RAM make it well suited for baseband signal processing in 3G/early-4G wireless infrastructure. With 540 user I/Os, the device can directly interface to multi-channel ADC/DAC pairs, digital up/down-converters, and CPRI/OBSAI fronthaul links without external bus-expanders. The 1.5V core supply keeps dynamic power manageable for always-on base station applications, while the eight on-chip PLLs provide independent clock domains for symbol-rate, chip-rate, and DSP pipeline stages.
Recomendado
High-Throughput Digital Signal Processing
With dedicated multipliers, ESB-based memory, and 500 MHz internal operation, the EP2A25B724C7 supports high-throughput DSP pipelines such as FFT/iFFT engines, FIR filters, and channelizers. The 900K system gates accommodate multi-stage processing chains with parallel datapaths, while 540 I/Os enable direct streaming interfaces to high-speed ADC/DAC converters. Designers can pipeline across ESBs to balance latency versus throughput, leveraging the eight PLLs for independent sample-rate and processing-rate clock domains.
Recomendado
Industrial Machine Vision
The EP2A25B724C7's 540 I/Os and embedded memory are well matched to multi-camera machine vision systems requiring simultaneous sensor capture, Bayer-to-RGB conversion, and feature extraction. The APEX II architecture supports parallel processing pipelines for edge detection, object segmentation, and pattern matching without external co-processors. Its commercial temperature range (0 °C to +85 °C) suits factory-floor enclosures, while the 724-FCBGA package accommodates controlled-impedance routing for LVDS/Channel Link sensor interfaces on industrial-grade PCBs.
Recomendado
High-Speed Data Acquisition Front-End
For data-acquisition systems digitizing multi-MHz analog signals, the EP2A25B724C7 buffers, packetizes, and routes data from high-speed ADCs to host processors via PCIe or serial RapidIO. The 540 I/Os accept parallel LVDS data from interleaved ADC arrays, while ESBs provide FIFO buffering at full sample rate. Eight PLLs derive independent clocks for ADC sampling, FPGA fabric, and host interface, and the dedicated multipliers support real-time digital-down-conversion. The 1.5V core supply simplifies power-tree design for instrument-grade front-ends.
Recomendado
Protocol Bridging and Interface Conversion
The EP2A25B724C7's 540 user I/Os and embedded memory make it ideal for multi-protocol bridge ASICs that translate between legacy parallel buses (PCI, VME, RapidIO) and modern serial links (SFP+, 10G Ethernet, Aurora). The fabric can implement bus-arbitration, DMA engines, and protocol state machines in parallel hardware, while ESBs buffer packets between domains. The APEX II's JTAG-based in-system programmability enables post-deployment firmware updates for evolving protocol standards.
Recomendado
Aerospace and Defense Avionics
The EP2A25B724C7's commercial temperature rating and 724-FCBGA package suit avionics subsystems such as flight-control interfaces, radar pre-processors, and electronic-warfare test beds. Long-life-cycle programs that designed in the APEX II family continue to qualify the part through authorized brokers like Rochester Electronics for sustainment production. The 24,320 logic elements accommodate MIL-STD-1553 / ARINC 429 bus monitors and signal-conditioning pipelines, while the eight PLLs support multi-channel radar timing.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2A25B724C7 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2A25B724C8 | EP2A25B724C9 | EP2A25B724-C7 | EP2A25B652C7 | EP2A15B724C7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 724-FCBGA | 724-FCBGA - same | 724-FCBGA - same | 724-FCBGA - same | 652-FBGA | 724-FCBGA - same |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 16,640 (-32%) |
| Speed Grade | -7 | -8 (faster) | -9 (fastest) | -7 (same) | -7 (same) | -7 (same) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Internal Frequency (max) | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Fully drop-in identical die/package with one-bin timing margin upgrade (frente a EP2A25B724C8)
- Two-bin timing margin upgrade within the same 724-FCBGA package (frente a EP2A25B724C9)
- Lower-cost entry to APEX II architecture when full 24K LEs are not required (frente a EP2A15B724C7)
Notas de diseño
The 724-FCBGA package requires careful thermal management because the high pin count limits PCB-side copper area for heat spreading. Estimated: at 500 MHz internal frequency and typical APEX II utilization around 60-70% logic activity, the device dissipates roughly 2-3 W. Designers should provide a 4-layer PCB with a continuous internal ground plane under the BGA footprint, plus thermal vias in a 1.2 mm grid pattern connecting the BGA pad to the opposite-side copper pour. For enclosed chassis, verify junction temperature with a thermal probe before finalizing the layout.
The 724-FCBGA with 35 mm × 35 mm body and 1.0 mm pitch demands microvia or via-in-pad PCB technology on at least the top signal layers. Use a 6- or 8-layer stack-up with dedicated VCCINT (1.5 V), VCCIO (per-bank voltage), and GND planes. Decouple every VCC pin with a 0.1 µF X7R ceramic placed within 2 mm of the ball, plus bulk decoupling (10-22 µF tantalum or polymer) on each supply island. Routing between BGA rows should escape on inner layers with 50 Ω controlled impedance for LVDS/clock signals.
Do not assume the APEX II device is RoHS-compliant - the EP2A25B724C7 is RoHS non-compliant per third-party broker listings. For new designs targeting RoHS/REACH compliance, migrate to Altera/Intel Cyclone IV or MAX 10 families. Also verify the configuration bitstream format compatibility between speed grades - the -C7, -C8, and -C9 share the same bitstream format, but bitstreams targeting an APEX II part cannot load on a Cyclone or Stratix device. Always re-run Quartus II timing analysis when migrating between -C7/-C8/-C9 speed grades even though the bitstream is reusable.
Información de cumplimiento
RoHS non-compliant per alterachips.com third-party listing as of 2026-09-08; consistent with the APEX II launch era. REACH, AEC-Q100, halogen-free, and conflict-mineral status were not disclosed in the verified web data and remain unknown.
