EP2A25F672C8 - APEX II FPGA 492 I/O 672-FBGA | Intel / Altera
N.º de pieza: EP2A25F672C8 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1305.72 | $1.305,72 |
| 10 | $1280.5 | $12.805,00 |
| 50 | $1245 | $62.250,00 |
| 100 | $1195 | $119.500,00 |
| 500 | $951.18 | $475.590,00 |
EP2A25F672C8 Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacture, via a hardware description language and a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and simple PLDs, and below fixed-function ASICs. APEX II specifically combines Look-Up Table (LUT)-based logic, Embedded System Blocks (ESBs) for memory and product-term functions, and True-LVDS/PLL clock management, making it suitable for high-throughput data-path and bus-interface designs.
Key features of the EP2A25F672C8 include 25,000 typical gates, 40,960 maximum system gates, 1.69 ns propagation delay, 1 Gbps LVDS-capable I/O performance, 4 PLLs, dual-port RAM, and embedded content-addressable memory (CAM) blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, and LVPECL through 16 I/O banks, allowing mixed-voltage interfacing to DDR SDRAM, ZBT SRAM, and QDR SRAM without external translators.
The architectural strength of APEX II lies in its MultiCore architecture: each Logic Array Block (LAB) contains 10 Logic Elements (LEs), and adjacent LABs share ESBs that can be configured as FIFO, dual-port RAM, ROM, CAM, or standard product-term logic. Four PLLs with up to 16 outputs each provide low-jitter clock synthesis for high-speed serializer/deserializer and DDR memory interfaces.
Typical applications include telecom line-card glue logic, high-speed serial backplane bridging, DDR/QDR memory controllers, digital signal processing front-ends, and industrial ASIC prototyping where time-to-market outweighs unit cost. Designers should note the -C8 speed grade (8 is the speed bin, slower than -C7 but faster than -C9) and confirm Quartus II version compatibility, as APEX II is a legacy device family supported by older Altera tool releases only.
Alternativas directas para EP2A25F672C8 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2A25F672C8 (mismo factor de forma y huella) — difiere en Package, Process Technology, Operating Temperature, Speed Grade, Embedded Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2A25F672C7
✅ Sustitución directa✓ En stock
$118 / unidad
Ver hoja de datos →EP2A25F672C9
✅ Sustitución directa✓ En stock
$700 / unidad
Ver hoja de datos →EP2A15F672C8
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2A25B652C8
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP2A25B724C7
✅ Sustitución directa✓ En stock
$760 / unidad
Ver hoja de datos →EP2A25F672C8 Valores máximos y características eléctricas
| Family | APEX II (EP2A25) |
| Logic Elements | 25,000 (typical gates) |
| Maximum System Gates | 40,960 |
| Macrocells / Embedded Logic | 2,432 macros |
| User I/O Count | 492 |
| Encapsulado | 672-FBGA (FineLine BGA, 27x27 mm, 1.0 mm pitch) |
| Propagation Delay (tpd) | 1.69 ns |
| Speed Grade | C8 |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) |
| Process Technology | 0.15 microm CMOS, 8-layer copper interconnect |
| I/O Standards Supported | LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, LVPECL |
| LVDS Data Rate | 1 Gbps |
| PLL Count | 4 |
| Embedded Memory | ESB blocks (dual-port RAM, FIFO, CAM, ROM) |
| I/O Banks | 16 |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Non-compliant (legacy product) |
Guía de configuración de pines de EP2A25F672C8 672-fbga (fineline bga, 27x27 mm, 1.0 mm pitch)
Configuración de pines para EP2A25F672C8 (encapsulado 672-fbga (fineline bga, 27x27 mm, 1.0 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2A25F672C8.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2A25F672C8 es adecuado para 6 aplicacións: Telecom Line-Card Glue Logic, DDR SDRAM Memory Controller, ASIC Prototyping Platform, Industrial Control & Machine Vision, High-Speed Serial Backplane Bridging, Legacy System Sustainment.
Telecom Line-Card Glue Logic
The EP2A25F672C8's 25,000 logic elements and 4 PLLs make it well-suited for telecom line-card bridging between backplane SERDES and TDM/datacom fabrics. Its 16 mixed-voltage I/O banks directly accept LVDS, LVPECL, GTL+, and SSTL, eliminating external translator chips and shrinking BOM. The 492 user I/Os expose enough pins for a 32-bit data path plus protocol-specific sideband signaling without multiplexing, and the 1.69 ns tpd in C8 grade supports 155 MHz POS-PHY interfaces comfortably.
Recomendado
DDR SDRAM Memory Controller
With embedded dual-port RAM blocks, 4 PLLs, and SSTL-2/3 I/O standard support, the EP2A25F672C8 can implement a 64-bit DDR SDRAM controller with a 133 MHz clock and source-synchronous capture without external buffers. The 1 Gbps LVDS capability on dedicated channels enables RSDS-class point-to-point links to companion memory or ASSP devices, while 16 I/O banks let designers isolate DDR VREF from GTL+ control planes. Trade-off: the C8 speed grade requires an extra pipeline stage vs C7 for 200 MHz DDR designs.
Recomendado
ASIC Prototyping Platform
Engineers prototyping ASICs in the 50k-200k gate range choose the EP2A25F672C8 because its 25,000 logic elements (40,960 max system gates) and 492 I/Os are large enough to map medium-complexity ASICs with reasonable partition cost. Quartus II APEX II support provides synthesis, simulation libraries, and incremental compile flows that match pre-silicon verification needs. Designers should select C7 for timing-margin headroom on the prototype; C8 as in the EP2A25F672C8 is acceptable for designs targeting 100 MHz or below.
Recomendado
Industrial Control & Machine Vision
The EP2A25F672C8's parallel-processing fabric, on-chip CAM blocks, and LVDS throughput are well-suited to industrial machine-vision pipelines where multiple Camera Link streams must be merged, line-buffered, and preprocessed in real time. ESB-based dual-port RAM provides per-line buffering without external SRAM, and the 4 PLLs let designers derive pixel, line, and frame clocks from a single LVDS reference. The 0-85 C commercial temperature range is sufficient for most factory-floor enclosures; industrial temperature -I8 grades exist on the APEX II family.
Recomendado
High-Speed Serial Backplane Bridging
The APEX II's 1 Gbps LVDS I/O and True-LVDS support make the EP2A25F672C8 a viable pre-transceiver bridging device between legacy parallel backplanes and emerging serial fabrics. Its 16 I/O banks allow mixed LVDS/LVPECL/HSTL domains on a single die, supporting protocol conversion for SPI-4.2, SFI-4, and POS-PHY Level 4 interfaces. Designers typically pair the FPGA with external SERDES ASSPs and use the FPGA's 25k logic elements for buffer management and protocol mapping; 492 I/Os accommodate 16-bit data paths plus overhead.
Recomendado
Legacy System Sustainment
Long-lifecycle defense, aerospace, and industrial customers maintaining deployed APEX II-based systems use the EP2A25F672C8 as a direct replacement for field failures. Because APEX II is obsolete, sustaining engineering must qualify sources carefully, validate bitstream compatibility across C7/C8/C9 speed grades, and verify that Rochester Electronics or franchised brokers have traceable stock. The 672-FBGA package is footprint-stable across the EP2A25 family, so existing PCBs accept the EP2A25F672C7, EP2A25F672C8, or EP2A25F672C9 without re-layout.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2A25F672C8 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2A25F672C7 | EP2A25F672C9 | EP2A15F672C8 | EP2A25B652C8 | EP2A25B724C7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 652-BGA | 724-BGA |
| Logic Elements | 25,000 | 25,000 | 25,000 | 15,000 | 25,000 | 25,000 |
| Speed Grade | C8 | C7 (faster) | C9 (slower) | C8 (same) | C8 | C7 |
| Propagation Delay (tpd) | 1.69 ns | ~1.5 ns | ~1.9 ns | 1.69 ns | 1.69 ns | ~1.5 ns |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| LVDS Data Rate | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps |
Diferenciadores clave
- Pin-compatible speed-bin flexibility within the same 672-FBGA footprint (frente a EP2A25F672C7)
- Larger logic capacity than the EP2A15 family in identical package (frente a EP2A15F672C8)
- Industry-standard fine-pitch BGA with established second-source distribution (frente a Altera Stratix IV EP4SGX230KF40C2)
Notas de diseño
Estimated: APEX II EP2A25 quiescent current at 1.5V core is approximately 0.5-1.0A plus I/O bank current. For 16 active banks at 3.3V VCCIO driving 20 mA each, add approximately 320 mA. Total estimated system power at full utilization is 5-8W. Designers should provide at least 4 power planes (VCCINT, VCCIO, VCCPD, VCCPLL) with 0.1 uF decoupling per bank and bulk capacitors rated for the worst-case transient load step.
Estimated: at 6W total dissipation with the 672-FBGA package (typical theta_JA ~10 C/W on a 4-layer JEDEC board), junction temperature rise is approximately 60 C above ambient. Combined with the 0-85 C commercial operating range, maximum ambient is approximately 25 C - below typical office temperatures. Designers must use thermal vias under the package center array, multiple inner-plane copper pours, and confirm airflow to remain within spec.
The 672-FBGA package uses 1.0 mm ball pitch on a 27 x 27 mm body. PCB design requires HDI microvia stack-ups (laser-drilled microvias to inner planes), 0.4 mm pad-to-trace clearance, and matched-length routing on LVDS pairs within 150 mil skew. Use 50 ohm controlled impedance for LVDS/LVPECL traces and 60 ohm differential. Refer to Altera AN315 (PCB Layout Guidelines for APEX II) and the device handbook package diagrams for via-pattern and ball-map references.
Three recurring pitfalls: (1) mixing 3.3V PCI and 2.5V SSTL signals on the same I/O bank without separate VCCIO and VREF rails; (2) failing to connect all unused I/O banks to a valid VCCIO - floating VCCIO causes I/O buffer oscillation that couples noise into VCCINT; (3) ignoring the JTAG TRST pin which must be tied low for normal operation - leaving it floating prevents configuration. Also: APEX II is supported only through Quartus II 13.0sp1; newer Quartus Prime releases will not synthesize this device.
Información de cumplimiento
RoHS non-compliant per Rochester Electronics listing (legacy part predates RoHS revisions). Lead-free status: no (legacy SnPb or matte Sn finish). REACH compliant per EU declaration. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free status unknown - not stated on distributor pages.
