EP2AGX260FF35I3N - 244K LE Arria II GX FPGA | Intel (Altera)
N.º de pieza: EP2AGX260FF35I3N ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1595 | $159.500,00 |
| 500 | $1480 | $740.000,00 |
| 1.000 | $1390 | $1.390.000,00 |
EP2AGX260FF35I3N Descripción general
An FPGA (field-programmable gate array) is a reconfigurable semiconductor device whose logic functionality is defined after manufacture by the user. Architecturally the FPGA sits within the broader category of programmable logic devices (PLDs) and competes with CPLDs on the low end and ASICs on the high end. FPGAs consist of an array of configurable logic blocks (ALMs/LEs), programmable interconnect, embedded memory (block RAM), DSP blocks, clock management PLLs, and high-speed transceiver/IO tiles. They are widely used to prototype logic, accelerate parallel algorithms, and provide reconfigurable interfaces in telecom, broadcast, defense, and industrial systems.
Key features of the EP2AGX260FF35I3N include 10260 LABs/CLBs, 612 I/O pins, embedded 6.375 Gbps multi-gigabit transceivers for protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CPRI, and Gbps Ethernet, hard PCIe Gen1/Gen2 IP blocks, up to 16 global clock networks, and dynamic on-chip termination (OCT). The device operates from a 1.0 V core supply, supports configuration via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes, and is rated for the industrial temperature range (-40 C to +100 C case).
The Arria II GX architecture uses an adaptive logic module (ALM) building block that combines 8-input fracturable look-up tables with dedicated arithmetic and register chains, increasing effective logic density by approximately 25 % over previous-generation 4-input LUT architectures. Multi-track routing and optimized pipeline registers enable sustained DSP throughput above 300 MHz, which is essential for wireless baseband and video codec pipelines. Hard memory controllers and variable-precision DSP blocks coexist with user-configurable fabric, allowing designers to instantiate high-bandwidth packet buffers and FFT engines without consuming programmable logic.
Typical applications include wireless baseband processing (LTE, WiMAX), video infrastructure (broadcast encoders, transcoders, display controllers), high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), test and measurement instrumentation, and radar signal processing. Designers typically pair the FPGA with DDR2/DDR3 SDRAM, external flash for configuration storage, and an FPGA power supply such as the Intel Enpirion EN63A0QI or Linear Technology (Analog Devices) LTM4620/LTM4644 multi-rail controller to meet the 1.0 V core and 2.5 V/3.3 V aux rail requirements.
When designing with this device, ensure 0.1 uF + 10 uF decoupling is placed adjacent to every power pin, follow the FCBGA escape and via-in-pad recommendations in the Arria II device handbook, and use Quartus II (or the later Quartus Prime) for synthesis, place-and-route, and timing closure. Estimating: total power at full transceiver utilization approaches 15-20 W and requires a multi-layer PCB with at least 2 oz copper and a thermal management plan (heat spreader or heatsink with controlled airflow) to keep the junction temperature within limits.
This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the Site MPN list, and practical FPGA design notes not found in a single datasheet reference, giving design engineers a one-stop engineering summary for the EP2AGX260FF35I3N.
Alternativas directas para EP2AGX260FF35I3N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2AGX260FF35I3N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Speed Grade, Process Technology, Mounting Type.
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EP2AGX260FF35I5N
✅ Sustitución directa✓ En stock
$1325 / unidad
Ver hoja de datos →EP2AGX260FF35I3G
✅ Sustitución directa✓ En stock
$1985 / unidad
Ver hoja de datos →EP2AGX260FF35C6N
✅ Sustitución directa✓ En stock
$1320 / unidad
Ver hoja de datos →EP2AGX260FF35C5N
✅ Sustitución directa✓ En stock
$1545 / unidad
Ver hoja de datos →EP2AGX260FF35C4N
✅ Sustitución directa✓ En stock
$3125 / unidad
Ver hoja de datos →EP2AGX260FF35I3N Valores máximos y características eléctricas
| Series | Arria II GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 244,188 |
| Number of LABs/CLBs | 10260 |
| Embedded Memory (bits) | 12,038,144 |
| Number of User I/Os | 612 |
| Transceiver Data Rate | 6.375 Gbps |
| Operating Frequency | 500 MHz |
| Process Technology | CMOS |
| Core Voltage | 1.0 V (nominal) |
| Encapsulado | 1152-BBGA, FCBGA (35 x 35 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (industrial, I3) |
| Lead Free | Yes |
| Estado RoHS | Compliant |
Guía de configuración de pines de EP2AGX260FF35I3N 1152-bbga, fcbga (35 x 35 mm)
Configuración de pines para EP2AGX260FF35I3N (encapsulado 1152-bbga, fcbga (35 x 35 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2AGX260FF35I3N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2AGX260FF35I3N es adecuado para 6 aplicacións: Wireless Baseband Processing (LTE / WiMAX), Video Broadcast Infrastructure (Encoder/Transcoder), PCIe Gen2 Protocol Bridge / Endpoint, Test and Measurement Instrumentation, Radar and Defense Signal Processing, Industrial Control and Robotics.
Wireless Baseband Processing (LTE / WiMAX)
The EP2AGX260FF35I3N fits wireless baseband designs that require hundreds of thousands of logic elements plus hard multi-gigabit transceivers. Its 244,188 logic elements and 12 Mbits of block RAM can hold multiple subframes of LTE/WiMAX samples, while the hard 6.375 Gbps transceivers deliver CPRI link rates to radio units. The 1.0 V core plus 2.5 V/3.3 V auxiliary supply scheme matches standard baseband card power trees, and the -40 C to +100 C industrial range covers outdoor radio head environments.
Recomendado
Video Broadcast Infrastructure (Encoder/Transcoder)
The EP2AGX260FF35I3N's 244K logic elements and abundant block RAM support multi-channel SD/HD/3G-SDI processing, JPEG2000, H.264, or HEVC pre-processing pipelines at broadcast-grade latencies. Integrated 6.375 Gbps transceivers simplify SMPTE 2022, 10 GbE video over IP, and dual-link 3G-SDI connectivity. The 1152-ball FCBGA provides 612 user I/Os, enough to interface to parallel video ADCs/ DACs and the host CPU simultaneously without multiplexing.
Recomendado
PCIe Gen2 Protocol Bridge / Endpoint
Arria II GX hard PCIe Gen1/Gen2 IP blocks let the EP2AGX260FF35I3N implement x1/x4 PCIe endpoints with minimal fabric utilization. Designers commonly use it as a PCIe-to-Serial RapidIO, PCIe-to-XAUI, or PCIe-to-DDR3 bridge card. The 6.375 Gbps transceivers provide headroom for non-PCIe serial links on the same device, and the 244K LE fabric is large enough for protocol conversion state machines and packet buffering.
Recomendado
Test and Measurement Instrumentation
The 500 MHz fabric and DSP blocks make the EP2AGX260FF35I3N ideal for digital oscilloscopes, protocol analyzers, and bit-error-rate testers that require parallel DSP at high sample rates. Its 12 Mbits of block RAM is well suited to deep trace buffers, and the 612 I/Os accommodate wide parallel ADC/DAC interfaces without external muxes. The industrial temperature grade and FCBGA package suit benchtop instruments and rack-mounted ATE.
Recomendado
Radar and Defense Signal Processing
The EP2AGX260FF35I3N is commonly deployed in phased-array radar, electronic warfare, and SIGINT subsystems where FFT/ FIR pipelines must run at 300 MHz or more on hundreds of thousands of logic elements. Hard 6.375 Gbps transceivers move digitized RF samples between FPGAs across backplanes with minimal latency. The industrial temperature rating and high IO count support multi-channel ADC/DAC mezzanine cards in rugged defense enclosures.
Recomendado
Industrial Control and Robotics
Designers use the EP2AGX260FF35I3N in multi-axis motor controllers, machine-vision inspection systems, and high-speed deterministic EtherCAT / PROFINET controllers. The 612 user I/Os support dozens of incremental encoder inputs, parallel vision data, and serial links to servo drives; the 6.375 Gbps transceivers enable deterministic industrial Ethernet and SERCOS III on the same device. The -40 C to +100 C industrial range covers factory-floor cabinets and outdoor robotics cells.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2AGX260FF35I3N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2AGX260FF35I5N | EP2AGX260FF35I3G | EP2AGX260FF35C6N | EP2AGX260FF35C5N | EP2AGX260EF29I5G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand |
| Package | 1152-BBGA FCBGA (35 x 35 mm) | 1152-BBGA FCBGA (35 x 35 mm) - same | 1152-BBGA FCBGA (35 x 35 mm) - same | 1152-BBGA FCBGA (35 x 35 mm) - same | 1152-BBGA FCBGA (35 x 35 mm) - same | 780-FBGA (29 x 29 mm) - different package |
| Logic Elements | 244,188 | 244,188 - same | 244,188 - same | 244,188 - same | 244,188 - same | 244,188 - same |
| Number of LABs/CLBs | 10260 | 10260 - same | 10260 - same | 10260 - same | 10260 - same | 10260 - same |
| Embedded Memory (bits) | 12,038,144 | 12,038,144 - same | 12,038,144 - same | 12,038,144 - same | 12,038,144 - same | 12,038,144 - same |
| User I/Os | 612 | 612 - same | 612 - same | 612 - same | 612 - same | 372 - smaller |
| Temperature Grade | Industrial I3 (-40 C to +100 C) | Industrial I5 (-40 C to +100 C, faster speed) | Industrial I3 (-40 C to +100 C) | Commercial C6 (0 C to +85 C) | Commercial C5 (0 C to +85 C) | Industrial I5 (-40 C to +100 C) |
| Speed Grade | -3 (I3) | -5 (I5) | -3 (I3) | -6 (C6) | -5 (C5) | -5 (I5) |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Diferenciadores clave
- Hard 6.375 Gbps multi-gigabit transceivers save fabric logic vs soft SERDES implementations (frente a Cyclone IV E (non-GX) devices)
- 1152-ball FCBGA footprint exposes 612 user I/Os without multiplexing (frente a EP2AGX260EF29I5G (780-FBGA))
- Industrial -3 speed grade at -40 C to +100 C for outdoor and factory deployments (frente a EP2AGX260FF35C6N (commercial 0-85 C))
Notas de diseño
The EP2AGX260FF35I3N requires a multi-rail power tree: 1.0 V core, 2.5 V and 3.3 V auxiliary, plus dedicated PLL supplies (1.0 V VCC_PLL, 2.5 V VCCA_PLL). Use a low-impedance multi-rail controller such as the Analog Devices LTM4620 or Intel Enpirion EN63A0QI. Estimating: total power at full transceiver utilization approaches 15-20 W, so power supply design must budget for 25-30 W to maintain headroom. Place 0.1 uF + 10 uF ceramic decoupling within 1 cm of every supply pin, and add bulk tantalum or polymer caps near each supply island.
The 1152-ball FCBGA package at 35 x 35 mm mandates via-in-pad (VIP) PCB construction. Use 0.4 mm pitch ball escape with 0.2 mm laser-drilled microvias, 1-2-1 or 2-2-2 stack-up, and a 0.8 mm core plus 0.2 mm buildup dielectric. Follow the Arria II device handbook for BGA breakout, signal-integrity recommendations on 6.375 Gbps transceivers (controlled-impedance 100 ohm differential with 5 mil trace width), and return-path vias within 50 mil of every signal-via transition.
Estimating: full-fabric utilization plus all transceivers running at 6.375 Gbps consumes 15-20 W, requiring a thermal management strategy. The FCBGA does not have an integrated heat spreader, so designers must attach a custom heat spreader or heatsink with thermal interface material. Design for theta-JA below 1.5 C/W using 1+ oz copper layers, thermal vias, and forced airflow. Always validate junction temperature with Quartus PowerPlay estimates before finalizing the mechanical design.
Common pitfalls when designing with the EP2AGX260FF35I3N: (1) forgetting transceiver reference-clock jitter spec - require an ultra-low-jitter clock source (<100 fs RMS) feeding the REFCLK pins; (2) using the wrong configuration mode - for production systems prefer Active Serial (AS) with a 16-bit EPCQ flash for fast boot; (3) missing reset sequencing of PCIe IP block - follow the hard IP reset sequence in the Arria II device handbook; (4) under-budgeting IO bank supplies - each IO bank has its own VCCIO pin and mixing 1.8 V and 2.5 V interfaces requires careful bank planning.
Información de cumplimiento
RoHS compliance per Altera/Intel product page. Halogen-free status not explicitly stated in the verified web data and is left as 'unknown'. Not AEC-Q100 - this part targets industrial, not automotive.
