EP2AGZ350FH29I3G - Arria II GZ FPGA, 350K LE, 780-HBGA | Intel
部品番号: EP2AGZ350FH29I3G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 250 | $1520 | $380,000.00 |
| 500 | $1450 | $725,000.00 |
EP2AGZ350FH29I3G 概要
Background: An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior can be reconfigured after manufacture via an HDL-defined bitstream. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors, and they are commonly categorized by logic-element density, transceiver count, and memory block count. The Arria II GZ family sits in Intel's mid-to-high density, transceiver-rich tier and is intended for ASIC prototyping, DSP-heavy pipelines, and high-speed serial interfaces.
Key features of the EP2AGZ350FH29I3G include high logic-element density for parallel DSP pipelines, multi-gigabit transceivers for backplane and chip-to-chip links, dedicated hardware multipliers for signal-processing acceleration, and an extensive clock network with PLLs for timing closure on multi-domain designs. The FH29 780-FBGA package exposes a high pin count, allowing access to nearly all of the device's user I/O and transceiver channels simultaneously, which is essential when the application requires maximum interface bandwidth.
Technically, the Arria II GZ architecture pairs a logic fabric and DSP blocks with hardened transceivers operating at multi-gigabit line rates and external memory controllers supporting DDR3 with read/write leveling. Designers typically pair this device with synchronous SRAM and DDR3 SDRAM, and they instantiate hard IP such as PCIe Gen2 and Ethernet MACs from the Quartus II IP catalog to shorten time-to-prototype.
Typical applications include high-speed digital signal processing in wireless baseband, ASIC prototyping and emulation, broadcast video processing, high-performance computing accelerator cards, and military/aerospace signal processing where the industrial temperature grade and ruggedized packaging are required.
Design consideration: pin allocation must account for dedicated transceiver banks, PLL supply pins, and global clock networks; the FH29 package exposes most dedicated pins but floorplanning the transceiver channels against the FPGA fabric is critical for signal-integrity closure.
This page synthesizes authorized distributor availability, drop-in device-family alternatives, and design guidance not bundled in the manufacturer datasheet.
ドロップイン代替品: EP2AGZ350FH29I3G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGZ350FH29I3G （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, Logic Elements (LE), Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGZ350FH29I3N
✅ ドロップイン✓ 在庫あり
$3550 / 個
データシートを見る →EP2AGZ350FH29I4N
✅ ドロップイン✓ 在庫あり
$2620 / 個
データシートを見る →EP2AGZ350FH29C4N
✅ ドロップイン✓ 在庫あり
$1245 / 個
データシートを見る →EP2AGZ350FH29C3N
✅ ドロップイン✓ 在庫あり
$1920 / 個
データシートを見る →EP2AGZ350FH29C3G
✅ ドロップイン✓ 在庫あり
$1350 / 個
データシートを見る →EP2AGZ300FH29I3G
✅ ドロップイン✓ 在庫あり
$1340 / 個
データシートを見る →EP2AGZ300FH29I3N
✅ ドロップイン✓ 在庫あり
$1380 / 個
データシートを見る →EP2AGZ350FH29I3G 最大定格＆電気的特性
| Family | Arria II GZ |
| Logic Elements (LE) | 350000 (approximately) |
| Process Node | 40 nm |
| User I/O Count | 281 |
| パッケージ | 780-FBGA (FineLine BGA, FH29) |
| Temperature Grade | Industrial (-40C to +100C) |
| 実装タイプ | Surface Mount |
| 動作温度範囲 | -40C to +100C |
| Transceivers | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Memory Interface | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | 18x18 hardware multipliers (family feature) |
| Configuration Method | Serial or parallel via Quartus II (family feature) |
| MSLレベル | 3 (per BGA package handling guidelines) |
| RoHS ステータス | Compliant |
| Lead Free | Yes |
EP2AGZ350FH29I3G 780-fbga (fineline bga, fh29) ピン配置ガイド
EP2AGZ350FH29I3G (780-fbga (fineline bga, fh29) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGZ350FH29I3G.
詳細は データシート をご参照ください。
主な用途
EP2AGZ350FH29I3G の用途: 6 件s: Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing, High-Performance Computing Accelerator Cards, Military and Aerospace Signal Processing, Industrial Test and Measurement Instrumentation.
Wireless Baseband Signal Processing
The EP2AGZ350FH29I3G fits wireless baseband DSP because its approximately 350,000 logic elements, hardware 18x18 multipliers, and Arria II GZ DSP blocks deliver the parallel MAC throughput required by LTE and 5G NR physical-layer pipelines. Multi-gigabit transceivers connect the FPGA to RF front-end ADCs/DACs and to CPRI/eCPRI links toward the radio unit. The industrial -40C to +100C temperature grade supports outdoor base-station enclosures without thermal derating. Place the FPGA on a 12-layer PCB with transceiver channels routed to the edge connector for shortest signal-integrity path.
おすすめ
ASIC Prototyping and Emulation
ASIC prototyping demands hundreds of thousands of logic elements per FPGA so a single chip can swallow a meaningful slice of an ASIC RTL design. The EP2AGZ350FH29I3G's ~350K LE fabric is well suited to multi-FPGA partitioning of mid-complexity ASICs, and the 780-FBGA FH29 package exposes enough user I/O to interconnect prototype boards through high-density board-to-board connectors. Industrial temperature grade lets the same prototype board validate ASIC designs in lab and field. Quartus II synthesis and TimeQuest timing closure are well documented for this family.
おすすめ
Broadcast Video Processing
Broadcast video pipelines for 4K/UHD SDI, HDR tone mapping, and multi-stream transcoding require thousands of parallel DSP operations per frame, which the EP2AGZ350FH29I3G's DSP blocks and 18x18 multipliers execute efficiently. The Arria II GZ family provides dedicated video IP for SDI, display port, and HDMI interfaces, and the FH29 780-FBGA exposes enough user I/O for multiple parallel video streams. Industrial temperature lets the same board sit in mobile production trucks and outdoor broadcast racks.
おすすめ
High-Performance Computing Accelerator Cards
HPC and data-center accelerator cards use FPGAs as coprocessors for low-latency packet processing, financial feed handling, and search/filter pipelines. The EP2AGZ350FH29I3G supplies the logic capacity and embedded memory bandwidth those workloads demand, while its multi-gigabit transceivers host PCIe Gen2 hard IP and 10 Gigabit Ethernet MACs directly. The 780-FBGA FH29 package mounts to a host card with a high-pin-count edge connector, supporting both PCIe x8 and proprietary mezzanine interfaces. Industrial temperature extends deployment to edge computing nodes.
おすすめ
Military and Aerospace Signal Processing
Defense and aerospace signal-processing platforms require high logic density for radar, EW, and SIGINT pipelines, combined with industrial-or-wider operating temperature and ruggedized BGA packaging. The EP2AGZ350FH29I3G's industrial -40C to +100C grade, 780-ball FBGA construction, and Arria II GZ radiation-tolerant silicon variant supports ground-vehicle and avionics platforms. Multi-gigabit transceivers link the FPGA to RF digitizers and to high-speed recording systems.
おすすめ
Industrial Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and ATE hardware use FPGAs for real-time acquisition and processing of multi-gigabit signals. The EP2AGZ350FH29I3G's ~350K logic elements and 18x18 multipliers implement deep capture FIFOs, FFT engines, and protocol decoders, while the FH29 780-FBGA exposes enough user I/O for parallel probe interfaces. Industrial temperature lets the same hardware platform ship into factory-floor test racks without thermal derating.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGZ350FH29I3G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGZ350FH29I3N | EP2AGZ350FH29I4N | EP2AGZ350FH29C4N | EP2AGZ350FH29C3N | EP2AGZ350FH29C3G | EP2AGZ300FH29I3G | EP2AGZ300FH29I3N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (FH29) | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same |
| Logic Elements (LE) | ~350,000 | ~350,000 | ~350,000 | ~350,000 | ~350,000 | ~350,000 | ~300,000 (-14%) | ~300,000 (-14%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial enhanced | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| User I/O Count | 281 | 281 | 281 | 281 | 281 | 281 | 281 | 281 |
| RoHS / Pb-Free | Pb-free option available | Yes (N suffix = Pb-free) | Yes | Yes | Yes | Pb-free tray | Pb-free option available | Yes |
| Family / Process Node | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm | Arria II GZ / 40 nm |
| Approx. Unit Price (qty 1) | $1,850 USD | Similar (Pb-free) | Similar | Similar | Similar | Similar | Slightly lower (lower density) | Slightly lower (lower density, Pb-free) |
主な差別化要因
- Higher logic density at the same FH29 footprint （vs EP2AGZ300FH29I3G)
- Industrial temperature grade at the same die （vs EP2AGZ350FH29C3N)
- Identical silicon and bitstream across suffix variants （vs EP2AGZ350FH29I3N)
設計ノート
The 780-FBGA FH29 package requires a high-density PCB with microvia-in-pad construction and at least 4-6 PCB layers dedicated to the FPGA escape routing. Plan via-in-pad with 0.4mm pitch to escape the inner ball rows, and route differential transceiver pairs on the top layers with reference planes intact to maintain 90 ohm differential impedance for multi-gigabit signals. Estimated: a 12-layer stack-up with the FPGA on the top side and transceiver breakouts on outer microstrip layers is typical.
Estimated power consumption for the EP2AGZ350FH29I3G at full utilization is approximately 10-15 W core plus 1-2 W per active transceiver channel. Provide a multi-rail power solution with sequenced VCC, VCCPT, VCCAUX, and VCCA_FPLL supplies per the Arria II GZ PowerPlay early-power-estimator output. Use a dedicated PLL supply filter (ferrite + decoupling) to keep jitter low on the multi-gigabit transceivers.
The 780-FBGA package dissipates heat primarily through the PCB; a thermal pad or copper coin under the BGA is recommended for designs pushing >5 W. Industrial temperature grade (-40C to +100C) is required for outdoor enclosures; derate utilization if the enclosure is passively cooled. Estimated: at 10 W dissipation, expect a 30-40 C junction-to-ambient rise with a 4-layer PCB and moderate copper pour; use a heatsink or thermal pad if the ambient exceeds 70 C.
Do not confuse I3, I4, C3, and C4 temperature-grade suffixes - they are not interchangeable across thermal envelopes. Do not skip the configuration-mode pin strapping (MSEL pins) - the wrong strap causes the FPGA to fail to configure. Do not forget the POR (power-on-reset) capacitor on the nCONFIG pin if you are using a custom configuration scheme. Always run TimeQuest timing closure across all transceiver corners before sign-off.
Multi-gigabit transceiver channels at up to 6.375 Gbps demand strict length matching within each transceiver bank (typically within 150 mil of the channel's nominal length). Keep AC-coupling capacitors close to the receiver pins, and never route a TX pair across a plane split. The FH29 package exposes enough balls to route each transceiver channel to a board-edge SMA or high-speed connector without crossing through the FPGA fabric.
コンプライアンス情報
RoHS compliant per Intel product environmental compliance information. AEC-Q100 not applicable (FPGA is not an automotive-qualified discrete). Pb-free option available with N suffix. Halogen-free status not stated in verified web data - [DATA_NEEDED: halogen free status].
