EP3CLS100U484I7N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel
N.º de pieza: EP3CLS100U484I7N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $168 | $168,00 |
| 10 | $155 | $1.550,00 |
| 100 | $138 | $13.800,00 |
| 500 | $122 | $61.000,00 |
| 1.000 | $108 | $108.000,00 |
EP3CLS100U484I7N Descripción general
An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory, DSP, and I/O resources. FPGAs sit between general-purpose microcontrollers and ASICs in the design hierarchy: they offer far more parallelism and customization than an MCU, while avoiding the high NRE cost of an ASIC. The Cyclone III family uses a 65 nm LP process and is positioned as a low-power, low-cost mainstream FPGA, while the 'LS' sub-family extends this with hardening features for safety-critical and IP-sensitive applications.
Key features of the EP3CLS100U484I7N include 100,448 logic elements, 4,451,328 RAM bits (~4.4 Mbit), 278 user I/O pins, and 4 PLLs supporting multiple clock domains. The device operates from a 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O (1.2 V to 3.3 V). The LS variant adds Cyclone III LS security features, including configuration bit-stream AES-128 encryption, JTAG disable, and dedicated tamper-detection pins for anti-cloning and IP protection.
Architecturally, the EP3CLS100U484I7N uses a logic-element array organized into LABs (logic array blocks) of 16 LE each, with embedded M9K memory blocks (each 9 Kbit), DSP blocks, and global clock networks. The fabric supports up to 24 DSP blocks and 432 M9K memory blocks. Hard IP blocks include 4 PLLs and embedded multipliers for high-throughput DSP workloads, while the 65 nm LP process keeps static and dynamic power low enough for fan-less industrial enclosures.
Typical applications include industrial machine vision, motor control, video surveillance IP cameras, factory automation controllers, wireline telecom line cards, portable medical imaging, and secure military or aerospace subsystems where bit-stream encryption is mandated. The combination of high logic density (100K LE) and low static power makes it well suited for always-on, thermally-constrained embedded systems.
Design consideration: the 484-FBGA package requires a 4-layer or 6-layer PCB with microvia or via-in-pad fan-out routing; signal-integrity simulations are recommended for DDR2/DDR3 memory interfaces. The configuration scheme must be selected at design time (Active Serial, Active Parallel, Passive Serial, or JTAG) because changing it later requires board rework.
This page synthesizes drop-in pin-compatible alternatives, distributor pricing, design considerations, and security-feature comparisons that go beyond the Cyclone III LS device datasheet alone.
Alternativas directas para EP3CLS100U484I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3CLS100U484I7N (mismo factor de forma y huella) — difiere en Process Technology, Package, Operating Temperature, RoHS Status, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3CLS100U484I7
✅ Sustitución directa✓ En stock
$188 / unidad
Ver hoja de datos →EP3CLS100U484C8N
✅ Sustitución directa✓ En stock
$109.4 / unidad
Ver hoja de datos →EP3CLS100U484C7N
✅ Sustitución directa✓ En stock
$412.65 / unidad
Ver hoja de datos →EP3CLS100F484I7N
✅ Sustitución directa✓ En stock
$67.9 / unidad
Ver hoja de datos →EP3CLS200F484I7N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →LFE3-100EA-8FN484C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7A100T-2FGG676I
✅ Sustitución directa✓ En stock
Consulte el precio
EP3CLS100U484I7N Valores máximos y características eléctricas
| Device Family | Cyclone III LS |
| Series | Cyclone III |
| Logic Elements (LE) | 100,448 |
| Total RAM Bits | 4,451,328 bits (~4.4 Mbit) |
| Maximum User I/O | 278 |
| Number of LABs | 6,278 |
| DSP Blocks | 24 (18x18 multipliers) |
| Embedded Memory | 432 M9K blocks (9 Kbit each) |
| PLLs | 4 |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.2 V to 3.3 V (per bank) |
| Encapsulado | 484-FBGA (UBGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial, 'I') |
| Process Technology | TSMC 65 nm low-power (LP) |
| Tipo de montaje | Surface Mount |
| Security Features | AES-128 bit-stream encryption, JTAG disable, tamper detection |
| Estado RoHS | Compliant |
| Nivel MSL | 3 (168 hours) |
Guía de configuración de pines de EP3CLS100U484I7N 484-fbga (ubga)
Configuración de pines para EP3CLS100U484I7N (encapsulado 484-fbga (ubga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3CLS100U484I7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3CLS100U484I7N es adecuado para 6 aplicacións: Industrial Machine Vision, Video Surveillance IP Cameras, Factory Automation Controllers, Wireline Telecom Line Cards, Portable Medical Imaging, Secure Military / Aerospace Subsystems.
Industrial Machine Vision
The EP3CLS100U484I7N fits industrial machine vision because its 100,448 logic elements and 24 DSP blocks deliver the parallelism needed for real-time image preprocessing, edge detection, and color-space conversion at 60 fps over GigE Vision or USB3 Vision streams. The 432 embedded M9K memory blocks provide the line-buffer and frame-buffer storage required for Bayer-to-RGB demosaicing without external SRAM, while the four PLLs drive separate pixel-clock, pixel-data, and Ethernet reference clocks. Its AES-128 bit-stream encryption protects proprietary vision IP from cloning by contract manufacturers. The -40 to +100C industrial temperature range and 65 nm LP process thermal profile support fan-less IP67 enclosures on the factory floor, where ambient temperatures swing with seasonal HVAC cycling.
Recomendado
Video Surveillance IP Cameras
The EP3CLS100U484I7N's 100K LE and 4.4 Mbit embedded RAM enable H.264 encoding of 1080p60 streams within the FPGA fabric, eliminating a dedicated SoC encoder and reducing system BOM cost. The 278 user I/Os accommodate multiple MIPI CSI-2 sensor inputs, Ethernet PHYs, audio codecs, and SD-card storage interfaces without bus multiplexing. The LS sub-family's AES-128 bit-stream encryption prevents cloning of the camera firmware, which is critical for IP-camera OEMs selling into security-conscious markets. Low-power operation from the 65 nm LP process allows PoE (Power-over-Ethernet) class-2 compliance without exceeding the 6.5 W PD budget.
Recomendado
Factory Automation Controllers
Industrial PLC and motion-controller designs benefit from the EP3CLS100U484I7N's combination of 100K LE, four PLLs, and AES-128 security in a 65 nm LP process. The 100K logic density hosts EtherCAT, PROFINET, or EtherNet/IP slave stacks alongside deterministic motor-control state machines, while the four PLLs generate independent clocks for the industrial bus, PWM switching, and ADC sampling without jitter coupling. The LS sub-family's tamper detection pins detect enclosure-opening events and zero out volatile keys, satisfying security requirements in connected-factory and IIoT deployments.
Recomendado
Wireline Telecom Line Cards
Telecom line cards using the EP3CLS100U484I7N leverage its 24 DSP blocks for voice-band DSP (echo cancellation, V.90 modem), its 4.4 Mbit RAM for packet buffering, and 278 user I/Os to interface multiple T1/E1 framers and Ethernet PHYs. The 65 nm LP process maintains low thermal output across 48-port DSLAM line cards stacked in a 1U chassis, where heat dissipation is constrained. AES-128 bit-stream encryption safeguards carrier-grade firmware images that often contain licensed DSP algorithms and are subject to CALEA/CJIS security audit requirements.
Recomendado
Portable Medical Imaging
Portable ultrasound and endoscopy systems use the EP3CLS100U484I7N for beamforming, image reconstruction, and on-FPGA display drivers. The 100K LE density accommodates 64-channel beamforming DSP pipelines, while the 432 M9K memory blocks store per-channel sample buffers. The 1.2 V core and 65 nm LP process enable battery-powered operation for hand-held probes without active cooling. AES-128 bit-stream encryption protects patient-data algorithms from extraction, supporting FDA cybersecurity guidance for medical devices.
Recomendado
Secure Military / Aerospace Subsystems
The EP3CLS100U484I7N's LS security features - AES-128 bit-stream encryption, JTAG disable, and tamper-detection pins - make it suitable for secure military subsystems such as portable radios, encrypted data links, and ruggedized sensor platforms. The 100K LE fabric accommodates custom crypto accelerators, while the 65 nm LP process delivers the low-power profile required for soldier-portable battery operation. The -40 to +100C industrial temperature range covers MIL-STD-810 environmental envelopes without active heating, simplifying SWaP-C (size, weight, power, cost) optimization.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3CLS100U484I7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3CLS100U484I7 | EP3CLS100U484C8N | EP3CLS100U484C7N | EP3CLS100F484I7N | EP3CLS200F484I7N | LFE3-100EA-8FN484C | XC7A100T-2FGG676I |
|---|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Lattice Semiconductor | Xilinx (AMD) |
| Package | 484-FBGA (UBGA) | 484-FBGA (UBGA) - same | 484-FBGA (UBGA) - same | 484-FBGA (UBGA) - same | 484-FBGA (FBGA) - same footprint | 484-FBGA (FBGA) - same footprint | 484-FBGA - same | 676-FBGA - larger |
| Logic Elements | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 200,448 (+100%) | 92,600 (LUT4) | 101,440 logic cells |
| Embedded RAM | 4.4 Mbit | 4.4 Mbit | 4.4 Mbit | 4.4 Mbit | 8.5 Mbit | 4.5 Mbit | 4.8 Mbit | |
| Max User I/O | 278 | 278 | 278 | 230 | 295 | 300 (676-FBGA) | ||
| AES-128 Bit-Stream Encryption | Yes (LS) | Yes | Yes | Yes | No | AES-256 (Artix-7) | ||
| Temperature Range | -40 to +100C (Industrial) | 0 to +85C (Commercial) | 0 to +85C (Commercial) | -40 to +100C | 0 to +85C (Commercial) | -40 to +100C | ||
| Lifecycle Status (2026-09-09) | NRND | NRND | NRND | Active (Lattice) | Active (Xilinx) |
Diferenciadores clave
- AES-128 bit-stream encryption + tamper detection in same package (frente a LFE3-100EA-8FN484C)
- Same-package density upgrade with 2x LE (frente a EP3CLS100U484I7)
- Industrial temperature range with AES-128 (frente a EP3CLS100U484C8N)
Notas de diseño
The 484-FBGA (UBGA) package requires a 4-layer or 6-layer PCB with 0.5 mm or 0.8 mm pitch microvia fan-out. Estimated: at 0.8 mm pitch, escape routing needs 4 routing layers under the BGA using microvia-in-pad or dog-bone fan-out via patterns. Verify with your PCB fabricator's microvia aspect-ratio capability (typical 1:1 or better). Power delivery should use at least 2 stitching vias per VCC/VCCIO ball to keep IR drop below 50 mV at peak transient.
Estimated: core power for the EP3CLS100U484I7N at 1.2 V is approximately 1.0-1.5 W at 100% toggle rate (typical 65 nm LP). Combined with 8 VCCIO banks at 1.2-3.3 V, total board power can reach 2.0-3.0 W. The Cyclone III LS datasheet recommends a 4-layer board with a dedicated ground plane and at least one solid power plane adjacent to the BGA for thermal spreading.
Configuration mode is selected by MSEL pin strapping at design time. Changing from AS (EPCS flash) to AP or PS mode requires board rework because MSEL is sampled at power-on. AES-128 key loading requires the encrypted bitstream and key to be programmed via JTAG or AS-flash programmer; the key is not stored in the FPGA fabric after power-off, so re-loading is required on each boot. For JTAG disable, ensure test access is preserved through a separate boundary-scan TAP before locking.
Información de cumplimiento
RoHS and REACH compliant per Intel/ Altera product page; the 'N' suffix in the MPN denotes lead-free (Pb-free) terminal finish. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly confirmed in the verified web data - mark as unknown.