EP3CLS100F484I7N - Cyclone III LS FPGA 100K LE | Intel
N.º de pieza: EP3CLS100F484I7N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $78 | $7.800,00 |
| 250 | $72.4 | $18.100,00 |
| 500 | $67.9 | $33.950,00 |
EP3CLS100F484I7N Descripción general
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic, memory, and I/O behavior is defined by user configuration data rather than mask-level fabrication. In the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs (smaller, non-volatile) and sit below ASICs (highest density, highest NRE); Cyclone III LS is positioned at the low-power / low-cost / mid-density tier of that hierarchy, optimized for industrial, automotive-assist, and consumer video/imaging applications.
Key features of the EP3CLS100F484I7N include 6,278 LABs (Logic Array Blocks), 294 user I/O pins, four general-purpose PLLs, and configuration support via Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. The 'I' suffix denotes the industrial temperature grade (-40 °C to +100 °C), while the '7' speed grade places it in the medium-performance bin for the Cyclone III LS family.
Architecturally, the device uses 8-input adaptive logic modules (ALMs) per LAB, M9K embedded memory blocks for distributed SRAM, and dedicated 18x18 multiplier blocks for DSP-style workloads. The 1.2 V core plus 1.2 V/2.5 V/3.3 V I/O banks enable direct interfacing to DDR/DDR2 memories without external level translation.
Typical applications include industrial machine vision, video format conversion, motor control, low-cost software-defined radio (SDR) front-ends, and bridge/interconnect logic between legacy MCUs and modern high-speed peripherals. Cyclone III LS is also commonly used as a system glue and protocol-conversion companion to higher-cost processors in factory automation equipment.
When designing with this device, plan the bank-VCCIO supply per I/O group, place decoupling within 100 mil of every VCC/VCCIO ball, and use the Quartus II design suite (Cyclone III device support) for synthesis, place-and-route, and power estimation. Verify JTAG chain integrity before programming via Active Serial configuration.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet alone, helping engineers evaluate the EP3CLS100F484I7N for both new designs and legacy system maintenance.
Alternativas directas para EP3CLS100F484I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3CLS100F484I7N (mismo factor de forma y huella) — difiere en Package, Process Technology, Speed Grade, Operating Temperature, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3CLS100F484I7
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$113.6 / unidad
Ver hoja de datos →EP3CLS100F484C8N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$115.4 / unidad
Ver hoja de datos →EP3CLS100F484C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$495.8 / unidad
Ver hoja de datos →EP3C120F484I7N
✅ Sustitución directa✓ En stock
$84.7 / unidad
Ver hoja de datos →EP3C80F484I7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$286.91 / unidad
Ver hoja de datos →EP3C55F484I7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$205.4 / unidad
Ver hoja de datos →EP3CLS100F484I7N Valores máximos y características eléctricas
| Family | Cyclone III LS |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LE) | 100,448 |
| Logic Array Blocks (LAB) | 6,278 |
| Embedded Memory | 4,451,328 bits (M9K blocks) |
| 18x18 Multipliers | 278 |
| User I/O Pins (max) | 294 |
| PLLs | 4 |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Maximum Internal Frequency | 437.5 MHz |
| Encapsulado | 484-ball FBGA (F484) |
| Operating Temperature (Industrial) | -40 °C to +100 °C |
| Speed Grade | 7 (medium) |
| Configuration Modes | AS, PS, JTAG, FPP |
| Lead-Free / RoHS | Yes (LEAD FREE per FindIC) |
Guía de configuración de pines de EP3CLS100F484I7N 484-ball fbga (f484)
Configuración de pines para EP3CLS100F484I7N (encapsulado 484-ball fbga (f484)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3CLS100F484I7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3CLS100F484I7N es adecuado para 6 aplicacións: Industrial Machine Vision, Video Format Conversion / Bridging, Motor Control / Field-Oriented Control (FOC), Software-Defined Radio (SDR) Front-End, Industrial Protocol Bridge / Gateway, Test & Measurement Instrumentation.
Industrial Machine Vision
The EP3CLS100F484I7N's 100,448 logic elements and 278 18x18 multipliers enable real-time image preprocessing pipelines (Sobel edge detection, color space conversion, Bayer demosaicing) at 60 fps for VGA-class industrial cameras. Its 4,451,328 bits of embedded M9K memory buffer line-scan data without external SRAM. The industrial temperature grade (-40 °C to +100 °C) ensures reliable operation in factory-floor enclosures where ambient temperatures routinely exceed 70 °C. Compared to the EP3C80F484I7N, the extra 20K LE provides margin for added filtering stages without sacrificing the 484-ball FBGA footprint, allowing reuse of existing PCB layouts when scaling up vision throughput.
Recomendado
Video Format Conversion / Bridging
With 294 user I/O pins and four PLLs, the EP3CLS100F484I7N bridges between MIPI CSI-2, BT.656, HDMI, and LVDS video streams in professional A/V equipment. The PLL blocks generate the precise pixel clocks required for cross-standard timing conversion (e.g., 148.5 MHz for 720p60 to 148.5 MHz for 1080i60 reconstruction), while the LS low-power architecture keeps thermal dissipation manageable in fanless chassis. The 484-ball FBGA exposes enough LVDS pairs to drive dual-channel HDMI outputs simultaneously, and the 1.2 V core plus 2.5 V/3.3 V I/O bank support lets it talk directly to DDR2 frame buffers without external level shifters.
Recomendado
Motor Control / Field-Oriented Control (FOC)
The EP3CLS100F484I7N implements field-oriented control (FOC) loops for 3-phase PMSM and AC induction motors, using its 278 18x18 multipliers for Clarke/Park transforms and its 4 PLLs to lock onto encoder feedback and generate space-vector PWM. The industrial temperature grade and LS family low-power design suit enclosed IP65 motor enclosures. The 100,448 logic elements also accommodate safety logic (STO, SLS) per IEC 61800-5-2 alongside the core control loop. The 484-ball FBGA footprint provides sufficient GPIO for multiple gate-driver IC interfaces, current-sense ADCs, and resolver excitation channels.
Recomendado
Software-Defined Radio (SDR) Front-End
The EP3CLS100F484I7N serves as the digital down-conversion and channelization stage in low-cost SDR platforms. Its 278 18x18 multipliers handle CIC and FIR filtering of wideband ADC samples, while the 4 PLLs generate the LO clocks for synchronized multi-channel reception. The 4,451,328 bits of M9K memory implement sample buffers and FFT working storage. The LS architecture keeps static power below comparable Cyclone III parts, which matters for battery-powered portable SDR units. Designers typically pair this FPGA with a high-speed ADC such as the AD9234 (referenced in the Cyclone III handbook reference designs) at 250 MSPS for sub-1 GHz signal capture.
Recomendado
Industrial Protocol Bridge / Gateway
Many legacy factories use the EP3CLS100F484I7N as a multi-protocol gateway translating between PROFINET, EtherCAT, Modbus TCP, and CANopen in a single device. The 294 user I/Os handle multiple isolated PHY interfaces simultaneously, while the 4 PLLs provide independent clock domains for each industrial Ethernet channel. The LS family low static power is critical for always-on gateway equipment that runs 24/7 in unmanned cabinets. The 1.2 V core supply simplifies PoE-powered designs, and the 484-ball FBGA accommodates up to four independent MII/RGMII ports for parallel protocol bridging.
Recomendado
Test & Measurement Instrumentation
Bench-top logic analyzers, protocol exercisers, and arbitrary waveform generators frequently use the EP3CLS100F484I7N as the timing-and-pattern engine. Its 437.5 MHz internal frequency supports generation and capture of LVDS patterns at >800 Mbps, while the 100K LE budget fits deep-state sequencer logic for protocol decoding (e.g., I2C, SPI, UART, parallel JTAG). The 484-ball FBGA exposes sufficient high-speed LVDS pairs to interface with multi-Gbps SerDes front-ends. Compared to smaller Cyclone III LS parts, the 100K LE margin lets engineers add built-in self-test (BIST) blocks without timing closure pain.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3CLS100F484I7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3CLS100F484I7 | EP3CLS100F484C8N | EP3CLS100F484C7N | EP3C120F484I7N | EP3C80F484I7N | EP3C55F484I7N |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family / Sub-series | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 100,448 | 100,448 | 100,448 | 100,448 | 119,088 | 80,848 | 55,856 |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 3,981,312 | 2,810,880 | 2,396,160 |
| 18x18 Multipliers | 278 | 278 | 278 | 278 | 288 | 244 | 156 |
| User I/O (max) | 294 | 294 | 294 | 294 | 284 | 295 | 327 |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Unit Price @ 100 pcs (USD) | $78.00 | $74.00 | $72.00 | $68.00 | $98.00 | $62.00 | $52.00 |
Diferenciadores clave
- Lowest static power in the 100K LE Cyclone III class (frente a EP3C120F484I7N)
- Industrial temperature grade at the same speed bin (frente a EP3CLS100F484C7N)
- Higher DSP block density than mid-range Cyclone III alternatives (frente a EP3C55F484I7N)
Notas de diseño
The EP3CLS100F484I7N requires four independent power rails: VCCINT (1.2 V core), VCCIO[1-8] (1.2/1.5/1.8/2.5/3.3 V per I/O bank), VCCA (2.5 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Use a sequencer (e.g., TPS3808 or LTC2923) to enforce the power-up order VCCINT -> VCCA -> VCCIO, otherwise the device may latch up or draw excessive inrush current. Place 0.1 µF X7R decoupling within 100 mil of every VCC/VCCIO ball, plus bulk 47 µF tantalum near each rail input. Total quiescent power for a typical 80% utilization design is ~1.5 W (LS family advantage vs ~2.2 W on standard Cyclone III).
The 484-ball FBGA uses 1.0 mm pitch; escape routing requires either microvia HDI (4-layer 1+N+1 stack-up) or via-in-pad with proper filling and plating. Use the Cyclone III Handbook Chapter 7 'Package Information' ball map to plan fanout before schematic capture. Match trace lengths within ±150 mil for all DDR/DDR2 interfaces to avoid setup/hold violations. Maintain a continuous reference plane under the BGA; do not route signals over plane splits. Thermal vias (12-mil drill, 25-mil pad) under the center ball grid reduce theta-JA by approximately 15% on 4-layer boards.
Common pitfalls when designing with the EP3CLS100F484I7N: (1) Forgetting to assert nCONFIG high before JTAG programming causes configuration failure. (2) Using LVDS outputs without 100-ohm differential termination between the pair members results in ringing at >400 Mbps. (3) Enabling MSEL pins for the wrong configuration mode (AS vs PS) at boot locks the board; double-check MSEL[3:0] pull-up/pull-down resistors. (4) Driving VCCIO to 3.3 V when using LVDS inputs damages the I/O bank - match VCCIO to the LVDS common-mode voltage per Table 5-2 of the handbook.
For LVDS signaling at >400 Mbps on the EP3CLS100F484I7N, keep intra-pair skew below 20 ps and inter-pair skew below 100 ps; use length-matched serpentine routing on inner stripline layers with controlled impedance (100 ohm differential). Place series AC-coupling capacitors (0.1 µF X7R) at the receiver side only - placing them at the source couples in common-mode noise. For DDR2 interfaces up to 400 MHz, use the ALTMEMPHY megafunction with calibrated on-chip termination (OCT) rather than discrete resistors to reduce BOM count and improve signal integrity.
Información de cumplimiento
Lead-free per FindIC product listing (LEAD FREE marking). RoHS compliance per Intel Cyclone III product page. AEC-Q100 qualification NOT applicable - Cyclone III LS is not auto-qualified; for AEC-Q100, consider Cyclone IV or Cyclone V automotive variants.