EP3SE110F1152C3 - 107500 Logic Elements Stratix III FPGA | Intel
N.º de pieza: EP3SE110F1152C3 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4017.68 | $4.017,68 |
| 10 | $3900 | $39.000,00 |
| 100 | $3650 | $365.000,00 |
| 500 | $3420 | $1.710.000,00 |
| 1.000 | $3200 | $3.200.000,00 |
EP3SE110F1152C3 Descripción general
An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and hardened IP such as block RAM, DSP slices, and high-speed transceivers. Stratix III sits in Intel's high-performance FPGA hierarchy below Stratix IV/V/10 and above Cyclone families, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs.
Key features include 4,300 Logic Array Blocks (LABs), an 800 MHz internal operating frequency, a 0.9 V core supply rail, and per-device transceivers suitable for multi-gigabit serial links. The 1152-BBGA FCBGA package supports high pin counts while maintaining the signal integrity required by parallel DDR interfaces and stacked die integration. Hardened memory controllers and embedded transceivers offload common functions from soft logic.
Architecturally, the device uses Altera's adaptive logic module (ALM) with 8-input fracturable look-up tables, multi-track interconnect with continuous routing, and TriMatrix memory blocks (MLAB, M9K, M144K). The combination enables both register-rich datapath designs and memory-heavy packet-processing implementations.
Typical applications include ASIC prototyping and emulation, high-speed digital signal processing, radar and beamforming front-ends, software-defined radio baseband, and high-end test and measurement instruments. The high user-I/O count also suits parallel video processing and high-channel-count data-acquisition backplanes.
When designing, plan power-rail sequencing carefully because Stratix III requires well-ordered ramp-up of the 0.9 V core and auxiliary supplies; many designs also use SmartVID to minimize quiescent power. Use the Quartus II toolchain with the Stratix III device library for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, package-level drop-in notes, and engineering guidance not found in the manufacturer datasheet, helping procurement and design engineers evaluate the EP3SE110F1152C3 against same-family and cross-family alternatives.
Alternativas directas para EP3SE110F1152C3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SE110F1152C3 (mismo factor de forma y huella) — difiere en Package, Family, Operating Temperature, Speed Grade, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SE110F1152C3N
✅ Sustitución directa✓ En stock
$1560 / unidad
Ver hoja de datos →EP3SE110F1152C4
✅ Sustitución directa✓ En stock
$2200 / unidad
Ver hoja de datos →EP3SE110F1152C2
✅ Sustitución directa✓ En stock
$4100 / unidad
Ver hoja de datos →EP3SL110F1152C3
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP3SE110F1152I3
✅ Sustitución directa✓ En stock
$4150 / unidad
Ver hoja de datos →EP3SE110F1152C3 Valores máximos y características eléctricas
| Family | Stratix III E |
| Logic Elements | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| Adaptive Logic Modules (ALMs) | 43,040 |
| Total Block Memory Bits | 8,936,448 |
| User I/Os | 744 |
| Internal Operating Frequency (max) | 800 MHz |
| Core Supply Voltage | 0.9 V |
| Temperatura de funcionamiento | 0 C to 85 C |
| Encapsulado | 1152-BBGA, FCBGA |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) |
| Estado RoHS | Compliant |
| Process Node | 40 nm |
| Speed Grade | C3 (commercial, slower speed grade) |
Guía de configuración de pines de EP3SE110F1152C3 1152-bbga, fcbga
Configuración de pines para EP3SE110F1152C3 (encapsulado 1152-bbga, fcbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SE110F1152C3.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SE110F1152C3 es adecuado para 6 aplicacións: ASIC Prototyping and Emulation, High-Speed Digital Signal Processing, Software-Defined Radio Baseband, Radar and Beamforming Front-End Processing, High-End Test and Measurement Instrumentation, High-Channel-Count Data Acquisition Backplanes.
ASIC Prototyping and Emulation
The EP3SE110F1152C3's 107,500 logic elements and 8.9 Mbits of block memory make it well suited for ASIC prototyping of mid-complexity SoCs and IP blocks. According to the Stratix III device handbook, the ALM-based fabric with embedded TriMatrix memory supports register-rich datapath and memory-heavy transaction models. Designers map RTL via Quartus II place-and-route and use multi-FPGA TDM partitioning for designs exceeding one device.
Recomendado
High-Speed Digital Signal Processing
With embedded DSP blocks and 800 MHz fabric performance, the EP3SE110F1152C3 handles FFT, FIR, and matrix-multiply kernels common in radar, beamforming, and software-defined radio baseband. The 744 user I/Os support parallel DDR2/DDR3 interfaces to external memory, while the embedded transceivers sustain multi-gigabit serial links to ADC/DAC front-ends. Quartus II DSP Builder accelerates model-based DSP design entry.
Recomendado
Software-Defined Radio Baseband
The EP3SE110F1152C3 supports wideband baseband processing for LTE, WiMAX, and proprietary wireless standards. The combination of high logic density for PHY-layer processing, abundant block RAM for sample buffering, and integrated transceivers eliminates many external components. The 1152-BGA FCBGA package provides controlled impedance for high-speed serial lanes to RF front-end ICs.
Recomendado
Radar and Beamforming Front-End Processing
Beamforming requires phase-coherent multi-channel processing at sample rates up to hundreds of MSPS. The EP3SE110F1152C3's ALM fabric and DSP slices deliver parallel multiply-accumulate throughput per channel, while its 8.9 Mbits of block memory holds coefficient tables and windowing functions. The 744 I/Os accommodate LVDS-based ADC/DAC interfaces common in phased-array designs.
Recomendado
High-End Test and Measurement Instrumentation
Oscilloscope, logic analyzer, and protocol tester backplanes demand the combination of high logic density, abundant memory, and parallel I/O that the EP3SE110F1152C3 provides. Its ALM fabric implements protocol decoders and triggering logic, while TriMatrix memory buffers captured waveforms. The 1152-BGA FCBGA supports controlled-impedance routing required for multi-GSPS ADC interfaces.
Recomendado
High-Channel-Count Data Acquisition Backplanes
Industrial inspection, medical imaging, and scientific instrumentation backplanes aggregate dozens of ADC/DAC channels. The EP3SE110F1152C3's 744 user I/Os accept multi-lane LVDS or parallel CMOS data from front-end ADCs, while its 107,500 logic elements perform channel calibration, decimation, and packetization. The 8.9 Mbits of block memory buffer sample bursts before DMA transfer to host processors.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SE110F1152C3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SE110F1152C3N | EP3SE110F1152C4 | EP3SE110F1152C2 | EP3SL110F1152C3 | EP3SE110F1152I3 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) | 1152-BBGA, FCBGA (same) |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | C3 (commercial) | C3 | C4 (faster) | C2 (slower) | C3 (L sub-family) | I3 (industrial) |
| Sub-Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III L (low power) | Stratix III E |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C (industrial) |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Total Block Memory | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits | 8,936,448 bits |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Diferenciadores clave
- Mid-range Stratix III E density with 107,500 logic elements (frente a EP3SL110F1152C3)
- Lead-free finish variant available for RoHS builds (frente a EP3SE110F1152C3N)
- Industrial temperature grade option in same package (frente a EP3SE110F1152I3)
- Highest-speed commercial variant in same density (frente a EP3SE110F1152C4)
Notas de diseño
Stratix III E devices require sequenced ramp-up of the 0.9 V core and auxiliary rails (VCCAUX, VCCPD, VCCIO) to avoid latch-up. Use the Stratix III PowerPlay Early Power Estimator (EPE) and apply a SmartVID controller to minimize quiescent core current. Decoupling must follow the Stratix III PDN design guidelines with bulk, mid-frequency, and high-frequency capacitors placed as close as possible to each power pin on both top and bottom layers.
The 1152-BGA FCBGA package uses a 1.0 mm ball pitch requiring microvia HDI PCB stack-ups. Maintain controlled impedance for high-speed serial links (100 ohm differential for transceivers, 50 ohm SE for clocks) and route matched-length pairs within 5 mil tolerance for DDR2/DDR3 interfaces. Use the Stratix III package BGA breakout and de-population guidelines for BGA fan-out under the device.
Estimated: with full logic utilization at 800 MHz and the device mounted on a JEDEC 2s2p test board, the EP3SE110F1152C3 dissipates 10-15 W typical. The 1152-BGA FCBGA relies primarily on the PCB thermal ball grid for heat removal; provide at least 16 thermal vias in a 4x4 array directly under the die shadow, connected to inner copper planes. For sealed enclosures, use a heatsink with thermal interface material to keep junction below 100 C.
Do not confuse Stratix III E (enhanced performance) with Stratix III L (low static power) when migrating designs - transceiver and PLL ball assignments differ between sub-families even within the same 1152-BGA package. Verify the Quartus II pin-out file before PCB layout. Also confirm configuration scheme (AS, PS, JTAG, or FPP) and configuration flash density during early design - Cyclone-style FPP modes are supported but require additional pins.
Información de cumplimiento
RoHS compliance per distributor listings; the C3 suffix denotes the original SnPb finish, while the C3N variant is lead-free. AEC-Q100 is not applicable - this is a commercial/industrial-grade FPGA not qualified to automotive standards. REACH, halogen-free, and conflict-mineral data were not present in the verified sources.