EP3SE110F780C4N - 107500 LEs, 780-FCBGA FPGA | Intel
N.º de pieza: EP3SE110F780C4N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1590 | $159.000,00 |
| 500 | $1480 | $740.000,00 |
| 1.000 | $1395 | $1.395.000,00 |
EP3SE110F780C4N Descripción general
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that integrates configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, DSP blocks, and embedded memory into a single silicon die. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs): they offer higher density and throughput than microcontrollers while remaining reprogrammable, enabling rapid prototyping, low-NPI design cycles, and field upgrades that ASICs cannot support.
Key features of the EP3SE110F780C4N include 107500 LEs for combinational and sequential logic, 8.94 Mbits of embedded RAM distributed across M9K and M144K blocks, 488 general-purpose I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), up to 8 PLLs for clock management, and dedicated DSP blocks for high-speed fixed-point and floating-point math. The Stratix III E family also supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, and provides encryption and bitstream authentication through the security feature set.
Architecturally, the Stratix III E family uses Altera's (now Intel) Adaptive Logic Module (ALM) as the basic logic element, replacing the legacy 4-input LUT architecture of earlier Stratix generations. Each ALM contains an 8-input fracturable LUT, two dedicated adders, and two register outputs, giving significantly improved logic utilization and timing closure on wide datapath designs. The 780-FCBGA package uses a 0.8mm ball pitch, supports the full 488 user I/O count, and is compatible with the Stratix III E transceiver-less pinout footprint used in telecom, broadcast, and industrial DSP backplanes.
Typical applications include high-speed digital signal processing (software-defined radio, radar baseband, video processing), wireline telecom line cards (packet classification, traffic management, OTN framer/mapper), high-performance ASIC prototyping, industrial motor control and servo drive front-ends, medical imaging front-end processing, and test and measurement instrumentation. The combination of large on-chip memory and high logic density also makes it well suited to custom image processing pipelines and protocol-bridging designs.
When designing with this device, pay particular attention to power distribution: the 780-FCBGA requires a multi-rail PCB stackup (typically 1.0mm-1.4mm board thickness, microvia stackups preferred) with decoupling placed on the BGA land side. Thermal management is critical at -4 speed grade because the part can dissipate 10-20W in fully utilized designs; a thermal pad on the top of the package and forced airflow are typically required.
This page synthesizes distributor pricing, Stratix III E family pinout and package detail, and same-footprint drop-in alternatives across temperature and speed grades, providing engineering context not available on a single manufacturer datasheet page.
Alternativas directas para EP3SE110F780C4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SE110F780C4N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SE110F780C4LN
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3450 / unidad
Ver hoja de datos →EP3SE110F780C4L
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1550 / unidad
Ver hoja de datos →EP3SE110F780C4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2380 / unidad
Ver hoja de datos →EP3SE110F780C3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1245 / unidad
Ver hoja de datos →EP3SE110F780C3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$220 / unidad
Ver hoja de datos →EP3SE110F780C2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$305 / unidad
Ver hoja de datos →EP3SE110F780C2
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4350 / unidad
Ver hoja de datos →EP3SE110F780C4N Valores máximos y características eléctricas
| Series | Stratix III E |
| Family | Stratix III |
| Logic Elements (LEs) | 107500 |
| Embedded Memory Bits | 8936448 |
| User I/O Count | 488 |
| Number of Terminals | 780 |
| Package Type | 780-BBGA, FCBGA |
| Package Code | BGA |
| Terminal Form | Ball |
| Package Shape | Square |
| Speed Grade | C4 |
| Temperatura de funcionamiento | 0C to 85C (Commercial) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Process Node | 65 nm |
| Configuration Mode | PS / FPP / JTAG |
Guía de configuración de pines de EP3SE110F780C4N square
Configuración de pines para EP3SE110F780C4N (encapsulado square). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SE110F780C4N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SE110F780C4N es adecuado para 7 aplicacións: Software Defined Radio Baseband, Telecom Line Card / OTN Framer, High-Throughput ASIC Prototyping, Broadcast Video Processing, Medical Imaging Front-End, Industrial Motor Control & Servo Drive, Test & Measurement Instrumentation.
Software Defined Radio Baseband
The EP3SE110F780C4N's 107500 LEs and 8.94 Mbit embedded memory provide the DSP throughput and on-chip packet buffering required for SDR baseband processing, where FFT cores, channelizers, and demodulators run in parallel. Its 488 user I/Os allow direct interfacing to high-speed ADC/DAC lanes, and the dedicated DSP blocks deliver 600+ MHz fixed-point multiply-accumulate performance. Compared with a Stratix III E industrial grade, the commercial C4 speed grade offers the best Fmax margin for wideband LTE and 5G NR sub-6 GHz baseband.
Recomendado
Telecom Line Card / OTN Framer
Wireline telecom line cards and OTN framer/mapper designs need the high logic density and large embedded RAM that the EP3SE110F780C4N provides in a 780-FCBGA, with 488 user I/Os for parallel SFI/Interlaken lanes. The C4 speed grade supports 400+ MHz internal datapaths and 10+ Gbps SERDES-side framer pipelines. The same-footprint family parts (C3N, C4LN) let OEM designers reuse PCB layout across the -2, -3, and -4 speed grade SKUs.
Recomendado
High-Throughput ASIC Prototyping
ASIC prototyping platforms typically map 5-10 million ASIC gates onto a single Stratix III E device, and the EP3SE110F780C4N's 107500 LEs and 8.94 Mbit memory fit mid-complexity SoC prototypes. The 780-FCBGA package gives access to all 488 user I/Os for bring-up pads, JTAG, and DDR-style bulk memory interfaces. Pairing the FPGA with a debug logic analyzer via the JTAG chain allows real-time visibility during SoC bring-up.
Recomendado
Broadcast Video Processing
Broadcast video pipelines for 4K/UHD up/down/cross-conversion and color-space conversion need real-time pixel-rate processing of 3840x2160 at 60 fps, which the EP3SE110F780C4N's 107500 LEs and dedicated DSP blocks can sustain at 300 MHz. The 488 I/Os support parallel 36/48-bit video buses (BT.1120, BT.2020, DisplayPort 1.2) and the embedded RAM holds multiple line buffers simultaneously. The C4 speed grade is the standard choice for new video board designs and matches reference timing budgets.
Recomendado
Medical Imaging Front-End
Ultrasound, CT, and MRI front-end processing boards map raw sensor data through FIR/IIR filter banks and beamforming logic that benefit from the EP3SE110F780C4N's DSP blocks and 488 user I/Os for high-channel-count transducer arrays. The 8.94 Mbit on-chip memory holds entire channel buffers and lookup tables for the beamforming matrix. The commercial temperature grade is appropriate for controlled-environment imaging suites; industrial-grade -4N (EP3SE110F780I4N) is recommended for portable cart or ambulance equipment.
Recomendado
Industrial Motor Control & Servo Drive
Multi-axis servo drives require deterministic control loops for FOC/PWM generation running at 20-50 kHz across 6-8 axes, a workload the EP3SE110F780C4N handles with significant margin given 107500 LEs and 488 user I/Os. The 8.94 Mbit embedded memory can hold position/speed look-up tables and the 780-FCBGA exposes dedicated PLL pins for clean switching-frequency clocking. Industrial-temperature variant (EP3SE110F780I4N) is recommended for factory-floor and outdoor cabinets where the commercial grade 85C limit is exceeded.
Recomendado
Test & Measurement Instrumentation
Real-time oscilloscopes, protocol analyzers, and logic analyzers rely on the EP3SE110F780C4N for deep trace memory, real-time triggering, and protocol decoding at multi-gigabit line rates. The 107500 LEs implement custom protocol decoders (PCIe Gen2, USB 3.0, SATA, Ethernet) while 8.94 Mbit embedded RAM holds the deep trace FIFO. The 488 user I/Os support multi-lane front-end probe cards and the JTAG chain allows remote in-system programming and diagnostics.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SE110F780C4N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SE110F780C4LN | EP3SE110F780C4L | EP3SE110F780C4 | EP3SE110F780C3N | EP3SE110F780C3 | EP3SE110F780C2N | EP3SE110F780C2 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA (0.8 mm pitch) | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Logic Elements | 107500 | 107500 - same | 107500 - same | 107500 - same | 107500 - same | 107500 - same | 107500 - same | 107500 - same |
| Embedded Memory (bits) | 8936448 | 8936448 - same | 8936448 - same | 8936448 - same | 8936448 - same | 8936448 - same | 8936448 - same | 8936448 - same |
| Speed Grade | C4 (mainstream) | C4 - same | C4 - same | C4 - same | C3 (~25-30% slower) | C3 (~25-30% slower) | C2 (~40% slower) | C2 (~40% slower) |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same |
| Power Variant | Standard | Low-power (L) | Low-power (L) | Standard | Standard | Standard | Standard | Standard |
| Lead-Free (Pb-free) Terminals | Yes (N suffix) | Yes | No | No | Yes | No | Yes | No |
Diferenciadores clave
- Highest speed grade in commercial 780-FCBGA Stratix III E family (frente a EP3SE110F780C3N)
- Pb-free terminal finish for RoHS-restricted markets (frente a EP3SE110F780C4)
- Standard power vs lower-power sibling (frente a EP3SE110F780C4LN)
Notas de diseño
Estimated: the 780-FCBGA package uses a 0.8mm ball pitch and requires a high-density PCB stackup. Use at least an 8-layer board with 1.0-1.4mm total thickness; microvia HDI stackups (laser-drilled 0.1mm vias stacked on 0.4mm-pitch pads) are recommended for fanout. Decoupling capacitors (typically 100nF 0402 size) should be placed on the BGA land side within 2mm of the associated VCC/GND ball pairs, with bulk 10uF/47uF ceramics on the back side of the package. Power plane cuts and splits under the BGA should be avoided to prevent return-path discontinuities.
Estimated: at full LE utilization (75-85% logic density) and high switching activity, the EP3SE110F780C4N can dissipate 10-20W, requiring both forced airflow and a top-side thermal pad (TIM2 interface). Junction-to-ambient thermal resistance (theta_JA) for a properly heat-sunk FCBGA in still air is approximately 12-15 C/W. For designs where the commercial 85C junction limit is approached, the lower-power EP3SE110F780C4LN variant reduces static power by 10-15% and can extend thermal headroom by approximately 2-3 C in the same airflow profile.
Common design pitfalls include (1) omitting the JTAG chain pull-up on TCK/TMS/TDO which prevents configuration from completing, (2) failing to assert nCONFIG and nSTATUS in the correct sequence during multi-FPGA configuration, (3) under-estimating the configuration bitstream size which can exceed 30 Mbit for the EP3SE110F780C4N and requires a sufficiently large EPCS configuration flash, and (4) treating the C2/C3 speed grades as equivalent to C4 for high-fanout register-to-register paths - the C2 grade is approximately 40% slower and many Fmax-critical paths will fail timing closure without RTL rework.
Información de cumplimiento
RoHS compliant per the Altera/Intel Stratix III E product family data. N suffix in the MPN denotes Pb-free terminal finish. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC.