EP3SE110F780C4N - 107500 LEs, 780-FCBGA FPGA | Intel
料号： EP3SE110F780C4N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1590 | $159,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP3SE110F780C4N 概述
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that integrates configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, DSP blocks, and embedded memory into a single silicon die. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs): they offer higher density and throughput than microcontrollers while remaining reprogrammable, enabling rapid prototyping, low-NPI design cycles, and field upgrades that ASICs cannot support.
Key features of the EP3SE110F780C4N include 107500 LEs for combinational and sequential logic, 8.94 Mbits of embedded RAM distributed across M9K and M144K blocks, 488 general-purpose I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), up to 8 PLLs for clock management, and dedicated DSP blocks for high-speed fixed-point and floating-point math. The Stratix III E family also supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, and provides encryption and bitstream authentication through the security feature set.
Architecturally, the Stratix III E family uses Altera's (now Intel) Adaptive Logic Module (ALM) as the basic logic element, replacing the legacy 4-input LUT architecture of earlier Stratix generations. Each ALM contains an 8-input fracturable LUT, two dedicated adders, and two register outputs, giving significantly improved logic utilization and timing closure on wide datapath designs. The 780-FCBGA package uses a 0.8mm ball pitch, supports the full 488 user I/O count, and is compatible with the Stratix III E transceiver-less pinout footprint used in telecom, broadcast, and industrial DSP backplanes.
Typical applications include high-speed digital signal processing (software-defined radio, radar baseband, video processing), wireline telecom line cards (packet classification, traffic management, OTN framer/mapper), high-performance ASIC prototyping, industrial motor control and servo drive front-ends, medical imaging front-end processing, and test and measurement instrumentation. The combination of large on-chip memory and high logic density also makes it well suited to custom image processing pipelines and protocol-bridging designs.
When designing with this device, pay particular attention to power distribution: the 780-FCBGA requires a multi-rail PCB stackup (typically 1.0mm-1.4mm board thickness, microvia stackups preferred) with decoupling placed on the BGA land side. Thermal management is critical at -4 speed grade because the part can dissipate 10-20W in fully utilized designs; a thermal pad on the top of the package and forced airflow are typically required.
This page synthesizes distributor pricing, Stratix III E family pinout and package detail, and same-footprint drop-in alternatives across temperature and speed grades, providing engineering context not available on a single manufacturer datasheet page.
直接替换替代料： EP3SE110F780C4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE110F780C4N （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP3SE110F780C4LN
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3450 / 个
查看数据手册 →EP3SE110F780C4L
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1550 / 个
查看数据手册 →EP3SE110F780C4
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2380 / 个
查看数据手册 →EP3SE110F780C3N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1245 / 个
查看数据手册 →EP3SE110F780C3
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$220 / 个
查看数据手册 →EP3SE110F780C2N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$305 / 个
查看数据手册 →EP3SE110F780C2
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4350 / 个
查看数据手册 →EP3SE110F780C4N 最大额定值与电气特性
| Series | Stratix III E |
| Family | Stratix III |
| Logic Elements (LEs) | 107500 |
| Embedded Memory Bits | 8936448 |
| User I/O Count | 488 |
| Number of Terminals | 780 |
| Package Type | 780-BBGA, FCBGA |
| Package Code | BGA |
| Terminal Form | Ball |
| Package Shape | Square |
| Speed Grade | C4 |
| 工作温度 | 0C to 85C (Commercial) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Process Node | 65 nm |
| Configuration Mode | PS / FPP / JTAG |
EP3SE110F780C4N square 引脚配置指南
EP3SE110F780C4N（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE110F780C4N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE110F780C4N 适用于 7 应用s: Software Defined Radio Baseband, Telecom Line Card / OTN Framer, High-Throughput ASIC Prototyping, Broadcast Video Processing, Medical Imaging Front-End, Industrial Motor Control & Servo Drive, Test & Measurement Instrumentation.
Software Defined Radio Baseband
The EP3SE110F780C4N's 107500 LEs and 8.94 Mbit embedded memory provide the DSP throughput and on-chip packet buffering required for SDR baseband processing, where FFT cores, channelizers, and demodulators run in parallel. Its 488 user I/Os allow direct interfacing to high-speed ADC/DAC lanes, and the dedicated DSP blocks deliver 600+ MHz fixed-point multiply-accumulate performance. Compared with a Stratix III E industrial grade, the commercial C4 speed grade offers the best Fmax margin for wideband LTE and 5G NR sub-6 GHz baseband.
推荐
Telecom Line Card / OTN Framer
Wireline telecom line cards and OTN framer/mapper designs need the high logic density and large embedded RAM that the EP3SE110F780C4N provides in a 780-FCBGA, with 488 user I/Os for parallel SFI/Interlaken lanes. The C4 speed grade supports 400+ MHz internal datapaths and 10+ Gbps SERDES-side framer pipelines. The same-footprint family parts (C3N, C4LN) let OEM designers reuse PCB layout across the -2, -3, and -4 speed grade SKUs.
推荐
High-Throughput ASIC Prototyping
ASIC prototyping platforms typically map 5-10 million ASIC gates onto a single Stratix III E device, and the EP3SE110F780C4N's 107500 LEs and 8.94 Mbit memory fit mid-complexity SoC prototypes. The 780-FCBGA package gives access to all 488 user I/Os for bring-up pads, JTAG, and DDR-style bulk memory interfaces. Pairing the FPGA with a debug logic analyzer via the JTAG chain allows real-time visibility during SoC bring-up.
推荐
Broadcast Video Processing
Broadcast video pipelines for 4K/UHD up/down/cross-conversion and color-space conversion need real-time pixel-rate processing of 3840x2160 at 60 fps, which the EP3SE110F780C4N's 107500 LEs and dedicated DSP blocks can sustain at 300 MHz. The 488 I/Os support parallel 36/48-bit video buses (BT.1120, BT.2020, DisplayPort 1.2) and the embedded RAM holds multiple line buffers simultaneously. The C4 speed grade is the standard choice for new video board designs and matches reference timing budgets.
推荐
Medical Imaging Front-End
Ultrasound, CT, and MRI front-end processing boards map raw sensor data through FIR/IIR filter banks and beamforming logic that benefit from the EP3SE110F780C4N's DSP blocks and 488 user I/Os for high-channel-count transducer arrays. The 8.94 Mbit on-chip memory holds entire channel buffers and lookup tables for the beamforming matrix. The commercial temperature grade is appropriate for controlled-environment imaging suites; industrial-grade -4N (EP3SE110F780I4N) is recommended for portable cart or ambulance equipment.
推荐
Industrial Motor Control & Servo Drive
Multi-axis servo drives require deterministic control loops for FOC/PWM generation running at 20-50 kHz across 6-8 axes, a workload the EP3SE110F780C4N handles with significant margin given 107500 LEs and 488 user I/Os. The 8.94 Mbit embedded memory can hold position/speed look-up tables and the 780-FCBGA exposes dedicated PLL pins for clean switching-frequency clocking. Industrial-temperature variant (EP3SE110F780I4N) is recommended for factory-floor and outdoor cabinets where the commercial grade 85C limit is exceeded.
推荐
Test & Measurement Instrumentation
Real-time oscilloscopes, protocol analyzers, and logic analyzers rely on the EP3SE110F780C4N for deep trace memory, real-time triggering, and protocol decoding at multi-gigabit line rates. The 107500 LEs implement custom protocol decoders (PCIe Gen2, USB 3.0, SATA, Ethernet) while 8.94 Mbit embedded RAM holds the deep trace FIFO. The 488 user I/Os support multi-lane front-end probe cards and the JTAG chain allows remote in-system programming and diagnostics.
推荐
推荐产品汇总
工程参考数据： EP3SE110F780C4N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE110F780C4LN | EP3SE110F780C4L | EP3SE110F780C4 | EP3SE110F780C3N | EP3SE110F780C3 | EP3SE110F780C2N | EP3SE110F780C2 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA (0.8 mm pitch) | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Logic Elements | 107500 | 107500 - same | 107500 - same | 107500 - same | 107500 - same | 107500 - same | 107500 - same | 107500 - same |
| Embedded Memory (bits) | 8936448 | 8936448 - same | 8936448 - same | 8936448 - same | 8936448 - same | 8936448 - same | 8936448 - same | 8936448 - same |
| Speed Grade | C4 (mainstream) | C4 - same | C4 - same | C4 - same | C3 (~25-30% slower) | C3 (~25-30% slower) | C2 (~40% slower) | C2 (~40% slower) |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same | 0C to 85C - same |
| Power Variant | Standard | Low-power (L) | Low-power (L) | Standard | Standard | Standard | Standard | Standard |
| Lead-Free (Pb-free) Terminals | Yes (N suffix) | Yes | No | No | Yes | No | Yes | No |
关键差异点
- Highest speed grade in commercial 780-FCBGA Stratix III E family （对比 EP3SE110F780C3N)
- Pb-free terminal finish for RoHS-restricted markets （对比 EP3SE110F780C4)
- Standard power vs lower-power sibling （对比 EP3SE110F780C4LN)
设计说明
Estimated: the 780-FCBGA package uses a 0.8mm ball pitch and requires a high-density PCB stackup. Use at least an 8-layer board with 1.0-1.4mm total thickness; microvia HDI stackups (laser-drilled 0.1mm vias stacked on 0.4mm-pitch pads) are recommended for fanout. Decoupling capacitors (typically 100nF 0402 size) should be placed on the BGA land side within 2mm of the associated VCC/GND ball pairs, with bulk 10uF/47uF ceramics on the back side of the package. Power plane cuts and splits under the BGA should be avoided to prevent return-path discontinuities.
Estimated: at full LE utilization (75-85% logic density) and high switching activity, the EP3SE110F780C4N can dissipate 10-20W, requiring both forced airflow and a top-side thermal pad (TIM2 interface). Junction-to-ambient thermal resistance (theta_JA) for a properly heat-sunk FCBGA in still air is approximately 12-15 C/W. For designs where the commercial 85C junction limit is approached, the lower-power EP3SE110F780C4LN variant reduces static power by 10-15% and can extend thermal headroom by approximately 2-3 C in the same airflow profile.
Common design pitfalls include (1) omitting the JTAG chain pull-up on TCK/TMS/TDO which prevents configuration from completing, (2) failing to assert nCONFIG and nSTATUS in the correct sequence during multi-FPGA configuration, (3) under-estimating the configuration bitstream size which can exceed 30 Mbit for the EP3SE110F780C4N and requires a sufficiently large EPCS configuration flash, and (4) treating the C2/C3 speed grades as equivalent to C4 for high-fanout register-to-register paths - the C2 grade is approximately 40% slower and many Fmax-critical paths will fail timing closure without RTL rework.
合规信息
RoHS compliant per the Altera/Intel Stratix III E product family data. N suffix in the MPN denotes Pb-free terminal finish. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC.