EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
N.º de pieza: EP3SL340F1760I3 ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1725 | $17.250,00 |
| 100 | $1610 | $161.000,00 |
| 500 | $1520 | $760.000,00 |
| 1.000 | $1450 | $1.450.000,00 |
EP3SL340F1760I3 Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing via a configuration bitstream. FPGAs sit hierarchically between fixed-function ASICs and software-programmable processors, offering hardware-timed parallelism with no instruction-fetch overhead. Within Intel's portfolio, Stratix III L occupies the high-performance, low-power segment, succeeding the Stratix II generation and superseded in time by Stratix IV/Stratix V. The 'L' (low-power) variant reduces dynamic power by approximately 50 percent compared with the standard Stratix III family through selective usage of programmable power technology on each LAB.
Key features include 24 transceivers (where populated), high-speed DSP blocks for fixed- and floating-point arithmetic, hard memory controllers for DDR/DDR2/DDR3, and rich clock-management PLL resources. The industrial temperature grade supports operation from -40 °C to 100 °C junction, while the 1760-ball BGA package enables dense I/O allocation for parallel memory buses, multi-gigabit serial links, and processor interface fan-out. The Stratix III L family is widely deployed in high-performance DSP, ASIC prototyping, and communications infrastructure.
Typical applications include high-end digital signal processing for radar and beamforming, software-defined radio (SDR) baseband, ASIC prototyping and emulation, high-speed networking line cards, medical imaging accelerators, and high-resolution video broadcast equipment. The combination of high logic density, abundant block RAM, and integrated transceivers makes the EP3SL340F1760I3 well suited to designs previously implemented as multi-FPGA partitions.
When designing with this device, attention must be paid to power-rail sequencing (1.1 V core, 2.5 V/3.0 V aux, 1.5 V/1.8 V I/O), thermal management via the exposed-die BGA substrate, and PCB stack-up for impedance-controlled transceiver channels. Use the Quartus II (or later) design toolchain for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, Stratix III L same-package drop-in alternatives from the Site MPN list, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para EP3SL340F1760I3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SL340F1760I3 (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Speed Grade, Embedded Memory Bits, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SL340F1760I4
✅ Sustitución directa✓ En stock
$12750 / unidad
Ver hoja de datos →EP3SL340F1760C4
✅ Sustitución directa✓ En stock
$9750 / unidad
Ver hoja de datos →EP3SL340F1760C3
✅ Sustitución directa✓ En stock
$12480 / unidad
Ver hoja de datos →EP3SL340F1760C4N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1820 / unidad
Ver hoja de datos →EP3SL340F1760C3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2950 / unidad
Ver hoja de datos →EP3SL340F1760C2
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$18500 / unidad
Ver hoja de datos →EP3SL340F1760I3 Valores máximos y características eléctricas
| Series | Stratix III L |
| Logic Elements | 337,500 LE |
| LABs (Logic Array Blocks) | 13,500 |
| Embedded Memory Bits | 18,822,144 bit |
| User I/Os | 1120 |
| Number of Pins / Balls | 1760 |
| Package Type | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | BGA1760, 42x42, 40 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Temperatura de funcionamiento | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| Speed Grade | I3 (Industrial, mid-speed bin) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant (Pb-free BGA balls) |
| Configuration Memory | SRAM-based, volatile (requires external configuration device) |
| Nivel MSL | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |
Guía de configuración de pines de EP3SL340F1760I3 bga1760, 42x42, 40
Configuración de pines para EP3SL340F1760I3 (encapsulado bga1760, 42x42, 40). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SL340F1760I3.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SL340F1760I3 es adecuado para 6 aplicacións: ASIC Prototyping and Emulation, High-Performance Digital Signal Processing, High-Speed Networking Line Cards, Medical Imaging Accelerators, Broadcast Video Processing, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL340F1760I3 is well matched to ASIC prototyping and in-circuit emulation, where 337,500 logic elements and 18,822,144 bits of embedded memory allow partitioning of large ASIC RTL into a single device rather than multi-FPGA arrays. The 1760-ball FC-BGA exposes 1120 user I/Os that fan out to ASIC test headers, validation logic analyzers, and speed-bridge daughter cards. Compared with using a smaller FPGA, the EP3SL340F1760I3 reduces inter-FPGA pin multiplexing penalties (often 30–50% timing overhead) and accelerates bring-up. Designers typically run the bitstream at 50–100 MHz to mirror ASIC timing with reasonable margin.
Recomendado
High-Performance Digital Signal Processing
The EP3SL340F1760I3 is deployed in radar, beamforming, and software-defined radio (SDR) baseband systems where its abundant DSP blocks and block RAM sustain multi-gigasample-per-second processing. The 65 nm low-power Stratix III L core runs compute-intensive FFTs and FIR filters at several hundred MHz with deterministic latency. Its 1760-ball package supports wide parallel DDR3 banks for ADC/DAC data capture, while integrated transceivers (where populated) link to backplanes at multi-Gbps. Power efficiency is roughly 50% better than the standard Stratix III, important for airborne and vehicle-mounted radar where cooling is constrained.
Recomendado
High-Speed Networking Line Cards
In telecom and datacom line cards the EP3SL340F1760I3 implements packet classification, encryption, and traffic management with throughput exceeding 100 Gbps when paired with external PHY devices. The 1120 user I/Os support SFI/XFI sideband signals, while integrated transceivers (where populated) drive 10 Gbps SFP+ and 40 Gbps QSFP+ links. Hard memory controllers handle DDR3 with ECC for deep packet buffers. The industrial temperature grade qualifies the part for outdoor cellular base-station cabinets and central-office deployments where ambient can swing widely.
Recomendado
Medical Imaging Accelerators
The EP3SL340F1760I3 serves as the compute engine in CT, MRI, and ultrasound image reconstruction pipelines, where its 337,500 LEs deliver the parallelism required for back-projection and iterative reconstruction. The 1760-ball FC-BGA provides ample I/O to ingest raw detector data at multi-Gsample/s rates and drive HDMI/DVI display outputs simultaneously. Industrial temperature grading and 1.1 V low-power operation reduce thermal load inside sealed medical enclosures, an important consideration for patient-adjacent equipment. Embedded RAM sustains line buffers for real-time image processing without external SRAM.
Recomendado
Broadcast Video Processing
The EP3SL340F1760I3 handles real-time 4K and 8K video processing in broadcast studios and outside-broadcast vans, performing up/down/cross-conversion, color correction, and HDR tone mapping. The 1120 user I/Os fan out to multiple SDI/HDMI interfaces (typically via external serializers), while abundant block RAM stores multiple frames for motion-adaptive deinterlacing. Industrial temperature grading supports OB truck operation in extreme climates. Low-power Stratix III L operation reduces air-conditioning load, an important consideration for compact mobile production units.
Recomendado
Test and Measurement Instrumentation
The EP3SL340F1760I3 is used as the core DSP engine in high-end oscilloscopes, logic analyzers, and arbitrary waveform generators. Its high logic density supports deep acquisition memory and complex trigger logic, while the 1120 I/Os sustain high-bandwidth probe interfaces. The 65 nm low-power process reduces heat in densely populated benchtop and modular instruments. Industrial temperature grading enables operation in production-line test cells where ambient temperature can exceed 50 °C. Designers can leverage Quartus II's Qsys tool for rapid integration of measurement IP.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SL340F1760I3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SL340F1760I4 | EP3SL340F1760C4 | EP3SL340F1760C3 | EP3SL340F1760C4N | EP3SL340F1760C3N | EP3SL340F1760C2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1760-ball FC-BGA, 42x42 mm, 1.0 mm pitch | 1760-ball FC-BGA - identical | 1760-ball FC-BGA - identical | 1760-ball FC-BGA - identical | 1760-ball FC-BGA - identical | 1760-ball FC-BGA - identical | 1760-ball FC-BGA - identical |
| Logic Elements | 337,500 LE | 337,500 LE | 337,500 LE | 337,500 LE | 337,500 LE | 337,500 LE | 337,500 LE |
| Speed Grade | I3 (industrial) | I4 (industrial, faster) | C4 (commercial, fast) | C3 (commercial, mid) | C4 lead-free | C3 lead-free | C2 (commercial, slowest) |
| Operating Temperature | -40 °C to 100 °C (industrial) | -40 °C to 100 °C (industrial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) |
| User I/Os | 1120 | 1120 | 1120 | 1120 | 1120 | 1120 | 1120 |
| Embedded Memory | 18,822,144 bit | 18,822,144 bit | 18,822,144 bit | 18,822,144 bit | 18,822,144 bit | 18,822,144 bit | 18,822,144 bit |
| Lead-free (RoHS) | Compliant (modern Altera/Intel stock) | Compliant | Compliant | Compliant | Explicit lead-free (N) | Explicit lead-free (N) | Compliant |
Diferenciadores clave
- Same-package industrial speed grade variants (frente a EP3SL340F1760C4)
- Faster Fmax available in same package (frente a EP3SL340F1760C2)
- High logic density with low power architecture (frente a Standard Stratix III EP3S340 (non-L))
Notas de diseño
Estimated: At typical Stratix III L utilization (~70% LE, ~50% toggle rate, 1.1 V core), the EP3SL340F1760I3 dissipates approximately 8–12 W. The 1760-ball FC-BGA exposes a large thermal pad array on the underside that must be soldered to a PCB land pattern with thermal vias to an inner copper plane. Without a heatsink or sufficient PCB copper area, junction temperature can exceed 100 °C even at moderate ambient. Use the Stratix III PowerPlay early power estimator before PCB commitment.
The EP3SL340F1760I3 requires multiple sequenced rails: VCCINT (1.1 V core), VCCAUX (2.5 V), VCCPD (3.0 V), and per-bank VCCIO (1.5/1.8/2.5/3.0 V). Per the Stratix III handbook, VCCINT must reach 90% of nominal before VCCAUX ramps. Use a multi-rail controller such as the LM3880 or UCD9222 to enforce the sequence; violation can cause in-rush currents that latch-up the device. Decouple each rail with 0.1 µF X7R close to each power pin plus bulk 47–100 µF tantalum or polymer.
The 1760-ball FC-BGA at 1.0 mm pitch demands a 6+ layer PCB stack-up with 50 Ω controlled-impedance single-ended traces and 100 Ω differential traces for LVDS pairs. Use laser-drilled or mechanical micro-vias for breakout; escape routing typically uses 4–5 routing layers beneath the BGA. Apply a 0.4 mm via-in-pad with filled-and-capped plating for clean fan-out. Reference the Altera AN583 design example for via pattern and trace width guidance.
Place the EPCS or EPCQ configuration flash within 50 mm of the FPGA's dedicated configuration pins to keep the AS (active serial) interface within timing budget. The MSEL[2:0] pins select configuration mode and must be tied to the correct logic levels per Quartus II device programmer selection. For JTAG, daisy-chain the TCK/TMS/TDO/TDI through 10 kΩ pull-ups on TCK/TMS and a 10 kΩ pull-down on TDI per IEEE 1149.1 best practice.
Do not hot-swap or live-insert the EP3SL340F1760I3 - the BGA balls cannot withstand repeated thermal-mechanical stress and configuration memory may load incorrectly. Verify Quartus II version compatibility: only releases 9.1 through 13.1 include Stratix III device support, with 13.1 the final maintenance release. Mixing bitstreams generated by later Quartus versions with the older device database will fail. Always regenerate the JIC/POF using a supported toolchain.
Información de cumplimiento
RoHS compliant per Intel/Altera product page and DigiKey catalog entry. AEC-Q100 not applicable - this is a high-density FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in provided data; left as 'unknown'.
