EP3SL340F1760I3 vs EP3SL340F1760C4 Comparación
Comparación detallada lado a lado de EP3SL340F1760I3 por Intel y EP3SL340F1760C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Última compraIntel
EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
EP3SL340F1760C4 ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SL340F1760I3 | EP3SL340F1760C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.450,00 | $9.750,00 |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 337,500 LE | 337,500 |
| LABs (Logic Array Blocks) | 13,500 | — |
| Embedded Memory Bits | 18,822,144 bit | 18,821,144 |
| User I/Os | 1120 | — |
| Number of Pins / Balls | 1760 | — |
| Package Type | FC-FBGA (1760-ball, FineLine BGA) | — |
| Package Code | BGA1760, 42x42, 40 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | — |
| Temperatura de funcionamiento | -40 °C to 100 °C (Industrial grade, I3 suffix) | 0C to +85C (commercial) |
| Speed Grade | I3 (Industrial, mid-speed bin) | C4 (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant (Pb-free BGA balls) | Compliant |
| Configuration Memory | SRAM-based, volatile (requires external configuration device) | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] | [DATA_NEEDED: number of embedded transceiver channels] |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | [DATA_NEEDED: DSP block count] |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Nivel MSL | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) | — |
| User I/O Count | — | 1,120 |
| Encapsulado | — | 1760-BBGA, FCBGA (Flip-Chip) |
| Process Node | — | 65 nm |
| Maximum Core Frequency | — | 450 MHz |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X |
| Configuration Scheme | — | Passive serial, fast passive parallel, JTAG |
| Lead-Free | — | Yes |