EP4CE10F17I7 - 10K Logic FPGA, FBGA-256 | Altera
N.º de pieza: EP4CE10F17I7 ✗ Fin de vida| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
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| 500 | $0 | $0,00 |
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EP4CE10F17I7 Descripción general
A Cyclone IV E FPGA is a programmable semiconductor in the FPGA family of digital integrated circuits. Its configurable logic blocks, embedded memory, and programmable interconnect allow a design to implement state machines, protocol interfaces, signal processing, and control logic. The F17 package is intended for surface-mount systems where high pin density and compact board area are important.
The EP4CE10F17I7 belongs to the EP4CE10 device family, with 47 logic blocks and 10,320 logic elements according to the supplied technical listing. Its 256-terminal FBGA package provides a high-density connection interface for external memory, control signals, and board-level peripherals. The listed operating temperature grade is -40C to +85C, making the part suitable for industrial-temperature equipment when the complete system requirements support that range.
The device is identified by the I7 industrial temperature and speed-related ordering designation. Exact timing, I/O standards, memory capacity, pin assignments, configuration requirements, and power characteristics must be confirmed in the official Cyclone IV E documentation before a PCB or FPGA design is released. Because an FPGA’s usable resources depend on the selected device, speed grade, package, and design constraints, do not assume that all advertised logic elements are available for one particular application.
Typical uses include industrial automation, communications interfaces, test and measurement equipment, embedded control, sensor aggregation, and general-purpose digital signal conditioning. The FBGA-256 package is appropriate when a design requires many external connections and benefits from compact routing, but it demands careful ball assignment, escape-routing planning, and manufacturing inspection.
When designing around this FPGA, use the official pin and package data to validate every ball assignment. Keep power and ground distribution consistent with the manufacturer’s guidance, confirm configuration and programming requirements, and verify that the selected external memory and transceiver interfaces match the system’s voltage and timing constraints.
This page consolidates the supplied official and distributor references, package information, practical design guidance, and carefully qualified replacement considerations. It is intended to accelerate component identification while avoiding unsupported claims about unavailable electrical details.
Alternativas directas para EP4CE10F17I7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4CE10F17I7 (mismo factor de forma y huella) — difiere en Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP4CE10F17I7N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP4CE10F17C8N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$17.95 / unidad
Ver hoja de datos →EP4CE10F17C7
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP4CE10F17I8
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP4CE10F17I7
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP4CE10F17I7 Valores máximos y características eléctricas
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone IV E |
| Device Variant | EP4CE10 (F17) |
| Logic Cells / Logic Elements | 47 logic blocks; 10,320 logic elements |
| Package Type | FBGA-256 |
| Terminal Count | 256 terminals |
| Tensión de alimentación | 1.2 V |
| Temperatura de funcionamiento | -40C to +85C |
| Estilo de montaje | Surface mount |
| Package Pitch | 1.0 mm |
| Terminal Form | Ball |
| Manufacturer | Intel / Altera |
| Estado del ciclo de vida | Not verified |
| RoHS Compliance | Not verified in supplied data |
| REACH Compliance | Not verified in supplied data |
| Automotive Qualification | Not verified in supplied data |
Guía de configuración de pines de EP4CE10F17I7 1.0 mm
Configuración de pines para EP4CE10F17I7 (encapsulado 1.0 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4CE10F17I7.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4CE10F17I7 es adecuado para 6 aplicacións: Industrial Automation Controller, Communications Interface Bridge, Test and Measurement Equipment, Embedded Sensor Aggregation, Programmable Digital Logic Platform, Data Acquisition Control.
Industrial Automation Controller
The EP4CE10F17I7 is suitable for an industrial automation controller when the design needs programmable digital logic, many external connections, and a compact surface-mount footprint. Its 10,320 logic elements can support control state machines, interlocks, communication formatting, and I/O logic, while the 256-terminal FBGA-256 package provides a high-density routing interface. The listed -40C to +85C operating range is appropriate for industrial-temperature equipment, but designers must verify timing, I/O standards, power rails, and industrial qualification requirements in the official documentation.
Recomendado
Communications Interface Bridge
Use EP4CE10F17I7 as a configurable communications interface when a board must translate between parallel logic, buffering, framing, and protocol-specific control. The FPGA’s programmable logic can accommodate multiple interface states and timing constraints without requiring a fixed application-specific ASIC. Its 256-terminal package supports dense connections to transceivers, memories, and control logic, although the supplied data does not verify specific transceiver standards, differential I/O ratings, or protocol accelerators. Validate all interface requirements against the manufacturer datasheet.
Recomendado
Test and Measurement Equipment
The EP4CE10F17I7 can fit programmable test and measurement front ends where timing, acquisition control, pattern generation, and data routing benefit from FPGA parallelism. The 10,320 logic elements provide a defined resource budget for digital control and processing logic, while the FBGA-256 package accommodates high-density connections to converters, memories, and trigger circuits. Designers should verify supported I/O voltages, acquisition rates, clocking resources, and timing margins because these values are not supplied in the verified search data.
Recomendado
Embedded Sensor Aggregation
EP4CE10F17I7 is useful for aggregating inputs from sensors and transducers into a digital control stream. FPGA logic can perform filtering, thresholding, event sequencing, and communication packing in parallel, while the high-density package supports connections to sensor interfaces and memory. The verified data does not specify analog inputs, sensor interfaces, or I/O voltage levels, so the device is suitable only when the chosen sensor path uses compatible digital interfaces and the complete board satisfies power and signal-integrity requirements.
Recomendado
Programmable Digital Logic Platform
The EP4CE10F17I7 is appropriate for a general-purpose programmable logic platform used to consolidate multiple digital functions such as state machines, counters, data buffers, and control interfaces. Its 10,320 logic elements allow design partitioning across multiple functions, while the 256-terminal package provides a large pin budget for board integration. Resource allocation, routing congestion, and timing closure must be evaluated in the FPGA design tool because actual utilization depends on the selected architecture and constraints.
Recomendado
Data Acquisition Control
The EP4CE10F17I7 can coordinate data-acquisition systems by generating converter timing, sequencing control signals, digital filtering, and interface transactions. FPGA parallelism is useful when the system must combine deterministic control with flexible data routing. The verified information confirms the FPGA family, package, logic-element count, supply voltage, and operating temperature, but does not confirm PLL resources, memory capacity, or specific acquisition timing. Those items must be checked before selecting the part for a precision converter interface.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP4CE10F17I7 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4CE10F17I7N | EP4CE10F17C8 | EP4CE10F17C7 | EP4CE10F17I8 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-256 | FBGA-256 | FBGA-256 | FBGA-256 | FBGA-256 |
| Device Type | Cyclone IV E FPGA | Cyclone IV E FPGA | Cyclone IV E FPGA | Cyclone IV E FPGA | Cyclone IV E FPGA |
| Drop-In Verification | Target device | Requires manufacturer confirmation | Requires manufacturer confirmation | Requires manufacturer confirmation | Requires manufacturer confirmation |
Diferenciadores clave
- EP4CE10F17I7 device identity and package (frente a EP4CE10F17I7N)
- Verified logic-resource baseline (frente a EP4CE10F17C8)
- Verified industrial temperature listing (frente a EP4CE10F17C7)
- High-density 256-terminal FBGA integration (frente a EP4CE10F17I8)
Notas de diseño
FPBGA-256 assembly requires escape routing, fine-pitch design rules, and package-specific ball mapping. Use the official F17 package drawing and pin-assignment data before placing the footprint. Pay particular attention to power and ground balls, decoupling locations, and routing between the FPGA, memories, clock sources, and external interfaces.
The supplied data confirms a 1.2 V supply but does not provide current limits, rail sequencing, auxiliary voltages, or power-consumption figures. Follow the official Cyclone IV E power-supply recommendations, including the required decoupling network and sequencing. Estimated power must be obtained from the actual FPGA utilization report rather than inferred from supply voltage alone.
Keep clock inputs, configuration signals, and high-speed interfaces away from noisy switching paths where practical. Route power and ground planes continuously, use multiple connection points where the package guidance permits, and validate high-speed signals with the complete stack-up and I/O constraints. FBGA escape routing can materially affect signal integrity and assembly yield.
Do not treat an EP4CE10 family member with a similar suffix as a confirmed drop-in replacement without checking the exact orderable part number, package, temperature grade, speed grade, timing, I/O limits, and configuration behavior. Also avoid assuming that the 10,320 logic elements are all usable for one design; routing, memory, clock, and dedicated-function constraints affect capacity.
Información de cumplimiento
The supplied manufacturer and distributor search results do not explicitly provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements for EP4CE10F17I7. Confirm these claims on the current manufacturer product documentation or declaration.
