EP4SGX360KF43I3 - 353600 Cells Stratix IV GX FPGA | Altera
N.º de pieza: EP4SGX360KF43I3 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2710 | $27.100,00 |
| 100 | $2560 | $256.000,00 |
| 500 | $2410 | $1.205.000,00 |
| 1.000 | $2280 | $2.280.000,00 |
EP4SGX360KF43I3 Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing rather than at the fab. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), alongside CPLDs, and below application-specific standard products (ASSPs) in fixed functionality. The Stratix IV family belongs to Altera's high-performance FPGA tier, targeting designs requiring high logic density, large on-chip memory, and multi-gigabit transceivers. The EP4SGX360KF43I3 sits in the middle-upper density band of the family, positioned above the EP4SGX230 and below the EP4SGX530/820 variants, balancing capacity, I/O count, and unit cost.
Key differentiating features include 14,144 LABs/CLBs for parallel logic implementation, embedded transceivers supporting multi-gigabit serial protocols, 880 maximum user I/Os for high pin-count system integration, and industrial-grade (-40C to +85C) operation. The 1760-ball FCBGA package provides dense board routing, suitable for high-speed serial and parallel interface aggregation in demanding systems.
Architecturally, the device integrates a programmable logic fabric, dedicated DSP blocks, embedded SRAM organized as M9K and M144K blocks, embedded transceivers, and a clock management network with PLLs. The 40nm process enables higher integration and lower dynamic power versus the prior 65nm Stratix III generation while sustaining high-speed serial performance.
Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Serial RapidIO, XAUI, SFI), digital signal processing (DSP) acceleration, telecommunications line cards, radar and signal processing front-ends, high-end test and measurement equipment, and ASIC prototyping. The high I/O count and embedded memory make it suitable for data aggregation and protocol bridging ASICs.
When designing with this FPGA, ensure the PCB supports the 1760-ball FCBGA footprint with the appropriate via and trace geometry. Thermal management is critical at high toggle rates - refer to the Altera (Intel) Stratix IV PowerPlay Early Power Estimator and Thermal Modeling guidelines. JTAG, configuration scheme selection (Fast passive parallel, Active serial, JTAG), and clock planning must be addressed early in the schematic phase.
This page consolidates distributor pricing, same-family Stratix IV GX drop-in alternatives, and design considerations not found in the standalone Altera datasheet PDF, supporting faster sourcing decisions and board bring-up.
Alternativas directas para EP4SGX360KF43I3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4SGX360KF43I3 (mismo factor de forma y huella) — difiere en Package, Speed Grade, Process Technology, Mounting Type, Embedded Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP4SGX360KF43I3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2750 / unidad
Ver hoja de datos →EP4SGX360KF43C4N
✅ Sustitución directa✓ En stock
$1370 / unidad
Ver hoja de datos →EP4SGX360KF43C4
✅ Sustitución directa✓ En stock
$7268.19 / unidad
Ver hoja de datos →EP4SGX360KF43C3N
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP4SGX360KF43C3
✅ Sustitución directa✓ En stock
$8905.55 / unidad
Ver hoja de datos →EP4SGX360KF43C2N
✅ Sustitución directa✓ En stock
$1975 / unidad
Ver hoja de datos →EP4SGX360KF43I3 Valores máximos y características eléctricas
| Family | Stratix IV GX |
| Series | EP4SGX360 |
| Logic Elements (LEs) | 353,600 |
| LABs/CLBs | 14,144 |
| Total Memory Bits | 23,105,536 |
| Maximum User I/Os | 880 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Encapsulado | 1760-BBGA, FCBGA (FC-FBGA) |
| Package Pin/Ball Count | 1760 |
| Operating Temperature Grade | Industrial |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) |
Guía de configuración de pines de EP4SGX360KF43I3 1760
Configuración de pines para EP4SGX360KF43I3 (encapsulado 1760). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4SGX360KF43I3.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4SGX360KF43I3 es adecuado para 6 aplicacións: High-Speed Serial Interface Bridging, Digital Signal Processing (DSP) Acceleration, Telecommunications Line Cards, Radar and Signal Processing Front-Ends, High-End Test & Measurement Equipment, ASIC Prototyping and Emulation.
High-Speed Serial Interface Bridging
The EP4SGX360KF43I3 is purpose-built for multi-protocol serial bridging designs where high transceiver count and dense logic coexist. The Stratix IV GX architecture integrates multi-gigabit transceivers supporting PCIe Gen1/Gen2, Serial RapidIO, XAUI, SFI, and CPRI, with on-chip hard IP that achieves protocol compliance without external PHY ICs. With 353,600 LEs, the FPGA can implement protocol multiplexing, bridging between PCIe and Serial RapidIO or XAUI and SGMII, in a single chip. Designers place the EP4SGX360KF43I3 on a board with appropriate 100-ohm differential routing and AC-coupling capacitors; the embedded transceivers then handle serialization, clock-data recovery, and word alignment, freeing the FPGA fabric for protocol layer logic. This reduces BOM cost and PCB area versus a multi-chip implementation.
Recomendado
Digital Signal Processing (DSP) Acceleration
The EP4SGX360KF43I3 is well suited for DSP-intensive workloads such as radar front-end processing, software-defined radio (SDR) baseband, channel estimation, and FFT/IFFT pipelines. Its dedicated DSP blocks (variable-precision multipliers and accumulators) deliver high GigaMACs/second throughput, while 23,105,536 bits of embedded memory buffer sample streams at the fabric level, avoiding costly external SRAM accesses. At 880 user I/Os, the FPGA aggregates parallel data streams from multiple ADCs/DACs. In typical SDR designs, the EP4SGX360KF43I3 is paired with a high-speed ADC front-end and is configured via JTAG or passive serial Flash, with the Stratix IV PLL network providing low-jitter sampling clocks. Estimated: at 250 MHz logic toggle, the device dissipates approximately 8-12W, requiring a thermal management plan.
Recomendado
Telecommunications Line Cards
The EP4SGX360KF43I3 is a strong fit for telecom line cards where high transceiver count, packet-processing throughput, and backplane serialization converge. With its 880 user I/Os, the FPGA interfaces to backplane SerDes, SFP+/QSFP cages, and Ethernet PHYs simultaneously, while the 353K logic elements implement packet classification, queue management, traffic shaping, and OAM functions. The Stratix IV GX hard IP blocks support CPRI for wireless fronthaul and OBSAI for legacy backhaul, common in 4G/5G test infrastructure and operator-grade equipment. The 1760-ball FCBGA package is well-suited to multi-board chassis where the FPGA sits on a high-layer-count backplane PCB. The industrial temperature grade (-I3) supports outdoor-cabinet deployments.
Recomendado
Radar and Signal Processing Front-Ends
Defense and aerospace radar systems leverage the EP4SGX360KF43I3 for pulse compression, MTI filtering, and beamforming in real time. The FPGA's high logic density and embedded DSP blocks deliver the throughput needed for phased-array radar where hundreds of antenna channels must be processed in parallel within microsecond budgets. The embedded transceivers accept direct ADC data streams at multi-gigabit rates, while the 23 Mbit embedded memory buffers intermediate pulse data without external memory roundtrips. Industrial temperature grading and a robust FC-FBGA package make the EP4SGX360KF43I3 suitable for ruggedized enclosures. Designers pair it with high-speed ADCs (e.g., 12-bit/3 GSPS) and DDR3 external memory for sample buffering.
Recomendado
High-End Test & Measurement Equipment
The EP4SGX360KF43I3 powers high-end oscilloscopes, protocol analyzers, spectrum analyzers, and logic analyzers where multi-channel high-speed data acquisition and on-the-fly processing are mandatory. The FPGA aggregates samples from multiple ADC channels, performs triggering, decodes protocols (PCIe, USB 3.0, SATA), and drives display pipelines at real-time rates. With 880 I/Os, the device can interface to banks of DDR3/QDR memory and high-pin-count display controllers simultaneously. The high logic count enables deep capture-memory buffers and complex trigger state machines. Test equipment vendors leverage the Stratix IV design ecosystem (Quartus II, SOPC Builder, Altera IP library) to compress time-to-market for complex instrumentation.
Recomendado
ASIC Prototyping and Emulation
The EP4SGX360KF43I3 serves as a high-density prototyping platform for ASIC and SoC designs in pre-silicon validation, allowing RTL execution at near-real-time speeds. With 353K logic elements and abundant memory, the FPGA can host sub-systems of larger ASICs, enabling early software development, hardware-software co-validation, and architectural exploration. Multi-FPGA partitioning tools from vendors like Synopsys, Cadence, and Mentor Graphics support Stratix IV partitioning flows. Designers typically use daughter cards carrying one or more EP4SGX360KF43I3 devices, interconnected via high-speed serial links. The industrial temperature grade and FCBGA package suit both lab and pre-production evaluation environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP4SGX360KF43I3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4SGX360KF43I3N | EP4SGX360KF43C4N | EP4SGX360KF43C4 | EP4SGX360KF43C3N | EP4SGX360KF43C3 | EP4SGX360KF43C2N |
|---|---|---|---|---|---|---|---|
| Package | 1760-BBGA, FCBGA (KF43) | 1760-BBGA, FCBGA (KF43) - same | 1760-BBGA, FCBGA (KF43) - same | 1760-BBGA, FCBGA (KF43) - same | 1760-BBGA, FCBGA (KF43) - same | 1760-BBGA, FCBGA (KF43) - same | 1760-BBGA, FCBGA (KF43) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| Total Memory Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 880 | 880 | 880 | 880 | 880 | 880 | 880 |
| Speed Grade | I3 (industrial) | I3 (industrial) | C4 (commercial) | C4 (commercial) | C3 (commercial) | C3 (commercial) | C2 (commercial) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Process / Core Voltage | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V | 40 nm / 0.9 V |
Diferenciadores clave
- Same-package commercial C4 speed-grade variant available (frente a EP4SGX360KF43C4N)
- Lower-cost C3/C2 speed-grade options in same package (frente a EP4SGX360KF43C3, EP4SGX360KF43C2N)
- High-density logic with embedded multi-gigabit transceivers (frente a Cyclone IV GX (EP4CGX75DF27I7N))
Notas de diseño
Estimated: at 250 MHz fabric toggle, 50% logic utilization, the EP4SGX360KF43I3 dissipates approximately 8-12W. With theta_JA of roughly 8-10 C/W for the FCBGA-1760 package on a JEDEC test board, junction-to-ambient rise can approach 100C above ambient. A heatsink with thermal interface material, substantial PCB copper (top/bottom inner layers), and forced airflow (200-300 LFM) are required for industrial-grade reliable operation. Use Altera's PowerPlay Early Power Estimator before board layout.
The 1760-ball FC-FBGA package requires high-density PCB routing. Use a 12+ layer stack-up with laser-drilled microvias (4-6 mil pitch) and tight impedance control (100-ohm differential for transceivers, 50-ohm single-ended for control). Maintain at least 2 ground plane layers adjacent to high-speed signal layers to minimize crosstalk. Reference the Altera Stratix IV GX pin connection guidelines for ball-map-aware fanout.
Do not confuse the EP4SGX360KF43I3 with EP4SGX360HF35I3 or EP4SGX360FF35I3 - all share the same 353,600-LE silicon but use different FCBGA pin maps and ball counts. KF43, HF35, and FF35 are NOT drop-in compatible despite identical density; verify the exact ordering code against your PCB land pattern. Also note -I3 = industrial, -C3 = commercial, -C4 = commercial fast, etc., referring to speed grade not temperature range.
Multi-gigabit transceiver channels require AC-coupling capacitors (typically 100 nF) at each TX/RX pin pair. Route diff pairs as tightly coupled 100-ohm impedance with intra-pair skew under 1 ps. Use stitching vias at 1/6 wavelength spacing to maintain reference plane continuity. Power-rail decoupling on VCC_PLL, VCCA, and VCCR should be placed within 100 mils of the ball with low-ESR ceramics (10 uF bulk + 100 nF high-frequency).
The EP4SGX360KF43I3 requires multiple supply rails: 0.9V core, 1.0V/1.1V analog PLL and transceiver supplies, 1.5V/1.8V auxiliary, and 2.5/3.3V I/O. Generate each from a dedicated switching regulator with bulk capacitance of 200-500 uF per rail. Soft-start and sequencing of the 0.9V core first, then auxiliary rails, prevents latch-up. Use the Stratix IV PowerPlay Early Power Estimator spreadsheet for budgeting before PCB layout.
Información de cumplimiento
RoHS compliance and lead-free per Altera/Intel product page. AEC-Q100 not applicable (commercial/industrial FPGA, not automotive-qualified). REACH, halogen-free, and conflict-minerals declarations not specified in available data.
