EPF10K100EFI484-2 - FLEX 10KE FPGA 100K Gates 484-FBGA | Intel / Altera
N.º de pieza: EPF10K100EFI484-2 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 500 | $105 | $52.500,00 |
| 1.000 | $92 | $92.000,00 |
EPF10K100EFI484-2 Descripción general
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can program after manufacture to implement arbitrary digital circuits. FPGAs sit between fixed-function ASICs (higher performance, higher NRE, longer lead time) and CPLDs (simpler, lower density) in the programmable logic hierarchy, and are widely used for glue logic, bus bridging, signal processing, and rapid prototyping.
The FLEX 10KE architecture embeds an "Embedded Array" block (EAB) alongside the logic array, enabling efficient on-chip RAM and DSP-style functions. Each EAB provides up to 2,048 bits of memory, and the device includes dedicated carry chains for fast arithmetic, a 4-input look-up table (LUT) per logic element, and JTAG-compliant boundary-scan testing. The part operates from a 2.5 V core supply with 3.3 V multi-voltage I/O support and is specified over the industrial 0 °C to +70 °C range.
Typical applications include telecommunications line cards, industrial control and glue logic, high-speed data acquisition front-ends, networking bridges, and legacy digital design replacement. The 338 I/O count supports wide parallel buses and multiple serial channels simultaneously, which is critical for backplane interfaces and processor-coprocessor pipelines in 1990s and early-2000s equipment that still requires long-term support.
When designing with this device, ensure your Quartus or MAX+PLUS II toolchain is configured for the FLEX 10KE family; verify core and I/O voltage sequencing at power-up; and respect the FBGA-484 PCB land pattern, which differs from BGA-356 variants of the same family.
Alternativas directas para EPF10K100EFI484-2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF10K100EFI484-2 (mismo factor de forma y huella) — difiere en Package, Logic Elements / Cells, Mounting Type, Operating Temperature, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF10K100EFC484-3
✅ Sustitución directa✓ En stock
$65 / unidad
Ver hoja de datos →EPF10K100EFC484-3N
✅ Sustitución directa✓ En stock
$142 / unidad
Ver hoja de datos →EPF10K100EFC484-2
✅ Sustitución directa✓ En stock
$185.4 / unidad
Ver hoja de datos →EPF10K100EFC484-2X
✅ Sustitución directa✓ En stock
$237.71 / unidad
Ver hoja de datos →EPF10K100EFC484-1
✅ Sustitución directa✓ En stock
$142 / unidad
Ver hoja de datos →EPF10K100EFI484-2 Valores máximos y características eléctricas
| Series | FLEX 10KE |
| Family | FLEX 10KE |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 4,992 |
| Total System Gates | 100,000 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Memory (bits) | 49,152 |
| User I/Os | 338 |
| Encapsulado | 484-FBGA (FineLine BGA) |
| Temperatura de funcionamiento | 0 °C to +70 °C |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V |
| Process Technology | 0.25 µm CMOS SRAM |
| Propagation Delay | 0.6 ns |
| Maximum Frequency | 250 MHz |
| Programming Method | SRAM (in-system reconfigurable) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Estado RoHS | Compliant |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de EPF10K100EFI484-2 484-fbga (fineline bga)
Configuración de pines para EPF10K100EFI484-2 (encapsulado 484-fbga (fineline bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF10K100EFI484-2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF10K100EFI484-2 es adecuado para 6 aplicacións: Telecommunications Line Cards, Industrial Control and Factory Automation, High-Speed Data Acquisition Front-End, Networking Bridge and Protocol Converter, Legacy Digital Design Replacement, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF10K100EFI484-2 is well suited for telecom line-card glue logic and protocol bridging. Its 4,992 logic elements and 624 LABs provide sufficient capacity for HDLC framers, UTOPIA / POS-PHY interfaces, and TDM time-slot crossbars, while the 338 user I/Os in the 484-FBGA package connect to multiple serial links and a wide backplane bus simultaneously. The 49,152 bits of embedded array memory enable on-chip FIFO buffers that smooth cell/packet traffic between PHY and network processor without external SSRAM. Operating from a 2.5 V core with 3.3 V I/O, the device interfaces directly to legacy 3.3 V ASICs, line-driver ICs and framers without level shifters. Designers should place configuration PROMs (e.g. EPC2) within 2 inches of the configuration pins and keep JTAG TCK shielded from high-speed serial traces.
Recomendado
Industrial Control and Factory Automation
In industrial control systems, the EPF10K100EFI484-2 serves as a flexible I/O expander and protocol converter between PLC backplanes, encoder counters, motor-driver interfaces and fieldbus networks. Its 338 I/Os support a large number of parallel discrete signals (limit switches, sensor inputs, contactor drives) and multi-channel quadrature encoder inputs at the same time. The FLEX 10KE architecture supports deterministic registered I/O with predictable clock-to-out timing, which simplifies meeting real-time loop budgets for servo control loops. The 2.5 V core and 3.3 V I/O are robust against the 24 V industrial bus noise when paired with proper isolation and TVS protection. Software-defined logic allows late-stage I/O map changes without PCB rework, accelerating commissioning of custom machinery.
Recomendado
High-Speed Data Acquisition Front-End
The EPF10K100EFI484-2 is a strong fit for data-acquisition front-ends that aggregate parallel ADC/DAC channels, perform digital down-conversion and packetize the data into a high-speed serial link. Its 4,992 logic elements implement FIR / CIC filter pipelines, while the 49,152 bits of embedded memory provide deep sample buffers and channel-lookup tables. The 338 user I/Os accept wide parallel LVCMOS interfaces from multiple 14-/16-bit ADCs running up to 100 MSPS without external bus multiplexing. SRAM-based in-system reconfigurability lets the same board boot from different configuration PROMs depending on the active front-end daughtercard, enabling one platform to support multiple acquisition modes.
Recomendado
Networking Bridge and Protocol Converter
Network bridges converting between Ethernet, RapidIO, ATM, POS and proprietary backplane protocols are a classic application for the EPF10K100EFI484-2. Its 624 LABs and abundant user I/Os allow simultaneous termination of multiple SERDES lanes and parallel data buses, with the embedded memory blocks implementing per-flow FIFOs and lookup tables for address translation. The 2.5 V core keeps power dissipation manageable at full I/O loading, an important consideration when a bridge sits between two hot ASICs. In-system reconfigurability means the same hardware can support several protocol personalities via different configuration images, which is useful in OEM networking equipment that ships worldwide.
Recomendado
Legacy Digital Design Replacement
The EPF10K100EFI484-2 is frequently used as a long-term spare or lifecycle-extension replacement for obsolete discrete logic, gate arrays and PLDs in long-life programs such as avionics retrofits, military radios and railway signalling. Its SRAM-based reconfigurability means one part number can replace dozens of legacy TTL/CMOS ICs, dramatically reducing the BOM count and improving reliability through fewer solder joints. The 484-FBGA package supports 338 I/Os, sufficient for typical 32-bit processor-coprocessor, memory and peripheral replacement designs. When replacing legacy glue logic, designers should re-validate timing because FLEX 10KE 0.6 ns propagation delay differs from TTL/HC logic delays.
Recomendado
Test and Measurement Instrumentation
Test and measurement instruments (logic analyzers, protocol testers, ATE pin electronics) use the EPF10K100EFI484-2 to implement pattern generators, capture comparators and clock-distribution networks. The 4,992 logic elements deliver sufficient capacity for 64-channel parallel pattern generation at 200 MHz, while the 49,152-bit embedded memory serves as deep sample memory. The 338 user I/Os in the 484-FBGA footprint allow direct fan-out to a pin-electronics ASIC without external bus multiplexers, simplifying board layout. Deterministic FLEX 10KE clock-to-out timing simplifies ATE calibration, and JTAG boundary-scan support helps board-level test coverage during instrument manufacturing.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF10K100EFI484-2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF10K100EFC484-3 | EPF10K100EFC484-3N | EPF10K100EFC484-2 | EPF10K100EFC484-2X | EPF10K100EFC484-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| User I/Os | 338 | 338 | 338 | 338 | 338 | 338 |
| Speed Grade | -2 (industrial) | -3 (commercial, faster) | -3 (commercial, Pb-free) | -2 (commercial) | -2 (commercial, Pb-free) | -1 (slower) |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial, Pb-free) | 0 °C to +70 °C (commercial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded Memory (bits) | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| RoHS / Pb-Free | RoHS compliant | RoHS status varies | Yes (Pb-free) | RoHS status varies | Yes (Pb-free) | RoHS status varies |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Speed-grade -2 industrial balance (frente a EPF10K100EFC484-3)
- RoHS / Pb-free option available in the same footprint (frente a EPF10K100EFC484-2X)
- Highest I/O density in the FLEX 10KE family (frente a EPF10K100EFC256-2 (256-BGA variant))
Notas de diseño
The EPF10K100EFI484-2 requires a 2.5 V core rail and a 3.3 V I/O rail; both must ramp monotonically and reach regulation within the FLEX 10KE power-on-reset timing window. Recommended sequencing is core-before-I/O to avoid I/O latch-up; use a tracker such as the LTC3556 or a simple RC + Schottky network if no sequencer IC is present. Decouple the 484-FBGA with one 100 µF bulk + ten 10 µF ceramic + one 0.1 µF per power pin, placed within 50 mils of the ball. Estimated: at 250 MHz with 100 % I/O switching, ICC(core) ≈ 0.4 A and ICC(IO) ≈ 0.6 A, so budget 2.5 W core + 2.0 W I/O in thermal analysis.
The 484-FBGA package uses a 1.0 mm pitch ball array (per the FLEX 10KE package mechanical drawing). Use a 4–6 layer PCB stack-up with the inner layers as continuous GND / PWR planes directly under the BGA. Microvia-in-pad is recommended for inner-row balls to escape the dense center pattern; otherwise use dog-bone fan-out with via-in-pad where permitted by assembly house. Match the package land pattern exactly to the manufacturer-supplied mechanical drawing — note that the 484-FBGA differs from the 356-BGA variant of the same family, so a layout for one will not work for the other.
Do not assume the EPF10K100EFI484-2 boots on power-up without an EPC1/EPC2 configuration PROM or external controller — it is SRAM-based and loses its configuration when VCC drops below the POR threshold. Verify in-system reconfigurability is enabled via the nCONFIG pull-up and MSEL pins before laying out the board. A common pitfall is conflating the 484-FBGA variant with the 356-BGA variant of the FLEX 10KE family — they share logic resources but their ball maps differ, so direct PCB swap is impossible.
Información de cumplimiento
RoHS and Pb-free status confirmed via Altera/Intel product page. AEC-Q100 not applicable — FLEX 10KE is a commercial/industrial family, not automotive qualified. Conflict-minerals compliance per Intel corporate statement.