EPF81188AGC232-3 - FLEX 8000 12K Gates 1008 Cells CPLD | Intel / Altera
N.º de pieza: EPF81188AGC232-3 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2.450,00 |
| 100 | $198 | $19.800,00 |
| 500 | $165 | $82.500,00 |
| 1.000 | $142 | $142.000,00 |
EPF81188AGC232-3 Descripción general
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL macrocell arrays with a programmable interconnect matrix, sitting in the programmable logic hierarchy between simple SPLDs/CPLDs and SRAM-based FPGAs. CPLDs typically provide deterministic pin-to-pin propagation delays, abundant flip-flops, and wide combinational logic support, making them well suited for glue logic, bus interface bridging, and control state machines in mixed-signal systems.
Key features of the EPF81188AGC232-3 include 188 user I/O pins, dedicated input pins, and 3.3 V or 5 V I/O signaling support. The 232-pin CPGA ceramic package delivers robust thermal and mechanical performance for industrial and military-grade applications. In-system programmability through the IEEE 1149.1 JTAG interface allows boundary-scan testing and configuration without removing the device from the board.
From an architecture standpoint, the FLEX 8000 family uses a continuous, hierarchical interconnect structure called the FastTrack, providing predictable routing delays across all logic cells. Each Logic Element (LE) contains a 4-input look-up table (LUT), a programmable flip-flop, and dedicated carry and cascade chains for arithmetic and wide fan-in logic. This design produces consistent timing closure for synchronous designs.
Typical applications include telecommunications line cards, industrial control boards, military/aerospace systems, and legacy peripheral glue-logic replacement where high I/O count and 5 V tolerance are required. The CPGA package supports through-hole mounting, ideal for high-reliability sockets and prototyping.
When designing with the EPF81188AGC232-3, observe the 5 V supply tolerance and ensure JTAG chain integrity for in-system programming. Use Altera/Intel Quartus design software (legacy MAX+PLUS II is also supported) for synthesis, fitting, and timing analysis. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para EPF81188AGC232-3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF81188AGC232-3 (mismo factor de forma y huella) — difiere en Mounting Type, RoHS Status, Package, User I/O Pins, Configuration Method.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF81188AGC232-2
✅ Sustitución directa✓ En stock
$92 / unidad
Ver hoja de datos →EPF81188AGC232-2A
✅ Sustitución directa✓ En stock
$92 / unidad
Ver hoja de datos →EPF81188AGC232-3 Valores máximos y características eléctricas
| Family | FLEX 8000 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Usable Gates | 12,000 |
| Logic Cells / Elements | 1008 |
| Registers | 1,500 |
| Maximum Internal Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS |
| Tensión de alimentación | 5 V |
| I/O Signaling | 3.3 V or 5 V |
| User I/O Pins | 188 |
| Dedicated Inputs | 4 |
| Package Type | 232-pin CPGA (Ceramic Pin Grid Array) |
| Tipo de montaje | Through-hole (Pin Grid Array socket) |
| Configuration Method | In-circuit reconfigurability (ICR) via JTAG / external devices |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Estado RoHS | Non-compliant (CPGA package, military/aerospace legacy) |
Guía de configuración de pines de EPF81188AGC232-3 232-pin cpga (ceramic pin grid array)
Configuración de pines para EPF81188AGC232-3 (encapsulado 232-pin cpga (ceramic pin grid array)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF81188AGC232-3.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF81188AGC232-3 es adecuado para 6 aplicacións: Telecommunications Line Cards, Industrial Control and Automation, Military and Aerospace Systems, Legacy Peripheral Glue Logic Replacement, Test and Measurement Equipment, Medical Device Control Boards.
Telecommunications Line Cards
The EPF81188AGC232-3's 12,000 usable gates and 188 user I/O pins make it well-suited for telecommunications line cards requiring bus interface bridging, protocol conversion, and timing control. Its 125 MHz internal frequency supports T1/E1 and low-speed SONET glue logic, while the 5 V tolerance simplifies interfacing with legacy telecom ASICs. The JTAG-based in-circuit reconfigurability allows field upgrades without board removal, critical for installed-base telecom equipment. Compared to modern FPGAs, the FLEX 8000's deterministic pin-to-pin delays simplify timing closure for protocol-specific state machines.
Recomendado
Industrial Control and Automation
Industrial control systems benefit from the EPF81188AGC232-3's 5 V tolerance, wide operating temperature range, and high I/O count for sensor multiplexing, motor control sequencing, and PLC backplane interfaces. The 232-pin CPGA package withstands vibration and thermal cycling typical of factory environments, while the 1008 logic elements provide ample capacity for ladder-logic-to-state-machine conversion. Its JTAG programmability simplifies factory-floor firmware updates without equipment disassembly, a key requirement for Industry 4.0 retrofit applications.
Recomendado
Military and Aerospace Systems
The EPF81188AGC232-3's ceramic CPGA package provides hermetic sealing and wide temperature operation, making it suitable for military and aerospace applications where plastic packages fail. With 12,000 usable gates and 188 I/O pins, it handles avionics bus interfaces (MIL-STD-1553, ARINC 429), radar signal preprocessing, and navigation system glue logic. The device's maturity and stable supply chain through authorized defense distributors support long-lifecycle programs. Its 5 V tolerance interfaces directly with legacy aerospace ASICs without level shifters.
Recomendado
Legacy Peripheral Glue Logic Replacement
The EPF81188AGC232-3 excels at replacing multiple discrete PAL/GAL devices and 74-series TTL glue logic on legacy peripheral boards. With 1008 logic elements and 1500 registers, it can consolidate address decoding, wait-state generation, interrupt prioritization, and DMA control into a single programmable device. The 125 MHz maximum frequency supports ISA, VME, and PCI bus bridging, while JTAG programming eliminates the need for UV erasure required by older EPLDs. This consolidation reduces board area and improves reliability in legacy system refresh projects.
Recomendado
Test and Measurement Equipment
Test and measurement instruments leverage the EPF81188AGC232-3's deterministic timing and high I/O count for waveform generation, switch matrix control, and instrument bus interfacing. The 188 user I/O pins support parallel data acquisition paths, while the 125 MHz internal frequency enables real-time signal processing for bench-top instruments. Its 5 V tolerance interfaces directly with legacy ADC/DAC and analog front-end circuits commonly found in oscilloscopes, logic analyzers, and spectrum analyzers. JTAG boundary-scan simplifies board-level test in production.
Recomendado
Medical Device Control Boards
Medical imaging and patient monitoring equipment historically used the EPF81188AGC232-3 for scan control, data path management, and user interface glue logic. The 5 V tolerance and CPGA package reliability support long-lifecycle medical device programs where component changes require FDA re-validation. With 1008 logic elements, the device handles ultrasound beamformer timing, MRI gradient control sequencing, and ventilator sensor multiplexing. The deterministic timing simplifies FDA documentation by providing predictable worst-case propagation delays for safety-critical paths.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF81188AGC232-3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF81188AGC232-2 | EPF81188AGC232-2A |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 232-pin CPGA | 232-pin CPGA (same) | 232-pin CPGA (same) |
| Usable Gates | 12,000 | 12,000 | 12,000 |
| Logic Elements | 1008 | 1008 | 1008 |
| Speed Grade | -3 (faster, 125 MHz) | -2 (slower) | -2A (slower, alternate) |
| Supply Voltage | 5 V | 5 V | 5 V |
| I/O Pins | 188 user I/O + 4 dedicated inputs | 188 + 4 | 188 + 4 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
| Process Technology | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS |
Diferenciadores clave
- Wider operating temperature range and hermetic packaging versus plastic FPGAs (frente a Plastic QFP/BGA FPGAs from same era)
- Mature supply chain through authorized defense and aerospace distributors (frente a Newer CPLD families (MAX II/MAX V))
- Highest speed grade in FLEX 8000 188-device family (frente a EPF81188AGC232-2 / EPF81188AGC232-2A)
Notas de diseño
The EPF81188AGC232-3 requires a stable 5 V ±5% supply (per the FLEX 8000 datasheet) with bulk decoupling of at least 100 µF near the package and 0.1 µF ceramic capacitors adjacent to each VCC pin group. Estimated: typical core current draw is 200-400 mA depending on logic utilization and toggle rate, so design the 5 V regulator for at least 1 A headroom to account for in-rush during JTAG configuration.
Route JTAG signals (TCK, TMS, TDI, TDO) with controlled impedance and keep them away from high-speed switching nets to avoid programming failures. The CPGA package benefits from a socketed footprint design for prototyping and field replacement; ensure the socket is rated for the device's thermal dissipation and operating temperature range. Decoupling capacitors should be placed within 5 mm of the VCC pins per Altera application note guidelines.
Do not assume the EPF81188AGC232-3 is RoHS compliant — the ceramic CPGA package contains lead-based terminations exempted for military/aerospace applications. Verify JTAG chain integrity before in-system programming; broken chains will fail CONF_DONE assertion. When migrating to MAX V or MAX 10 CPLDs, the package is not pin-compatible and PCB redesign is required. Source: Altera FLEX 8000 datasheet and Intel legacy CPLD documentation.
Información de cumplimiento
Ceramic CPGA package with lead-based terminations; exempted from RoHS for military/aerospace applications. Lifecycle status: obsolete per Intel/Altera product lifecycle policy.
