EPF81188AGC232-2A - FLEX 8000 12K Gates 1008 Cells FPGA | Altera
MPN: EPF81188AGC232-2A ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
Drop-in alternatives for EPF81188AGC232-2A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF81188AGC232-2
✅ Drop-In✓ In Stock
$92 / Unit
View Datasheet →EPF81188AGC232-2H
✅ Drop-In📋 Reference alternative (not in catalog)
EPF81188AGC232-2A Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Usable Gates | 12,000 |
| Logic Elements | 1,008 |
| Logic Cells | 1,008 |
| Maximum Internal Frequency | 125 MHz |
| Propagation Delay | 5 ns |
| User I/O Pins | 184 |
| Dedicated Inputs | 4 |
| Configuration Technology | SRAM (volatile, in-system reconfigurable) |
| Process Technology | 0.42 µm CMOS |
| I/O Voltage | 3.3 V or 5 V (configurable) |
| Package | CPGA-232 (Ceramic Pin Grid Array, 232 pins) |
| Mounting Type | Through-Hole (CPGA) |
| In-Circuit Reconfigurability | Yes (external configuration device or intelligent host) |
| Boundary Scan | JTAG IEEE 1149.1 |
| Output Function | Registered (D-type flip-flop per LE) |
EPF81188AGC232-2A cpga-232 (ceramic pin grid array, 232 pins) Pin Configuration Guide
Complete pinout information for EPF81188AGC232-2A (cpga-232 (ceramic pin grid array, 232 pins) package) with 184 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF81188AGC232-2A.
Refer to the datasheet for full pin configuration.
Estimated pin count: 184 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF81188AGC232-2A is suitable for 6 applications: Legacy Telecom Backplane Glue Logic, Industrial PLC Control Subsystems, Military and Aerospace Control Systems, Custom ISA / VME / PCI Bus Bridges, ASIC Prototyping and Emulation, Legacy Test and Measurement Equipment.
Legacy Telecom Backplane Glue Logic
The EPF81188AGC232-2A fits legacy telecom backplane glue-logic designs that must interface TDM buses, E1/T1 framers, and HDLC controllers without an extra bridge ASIC. With 184 user I/O pins and 1,008 logic elements, the device can implement multiple 8-bit bus bridges, address latches, and interrupt controllers on a single chip. The 5 ns propagation delay and 125 MHz internal frequency comfortably cover 50 MHz backplane designs typical of legacy telecom shelves, while the registered output function simplifies timing closure for synchronous bus cycles.
Recommended
Industrial PLC Control Subsystems
In industrial PLC and process-control designs, the EPF81188AGC232-2A is well suited for custom I/O scan engines, PID controller blocks, and high-speed counter modules. The 184 I/O pins accommodate the typical 32 to 64 isolated digital inputs and 16 to 32 analog channels that legacy PLCs require, while the 1,008 logic elements host multiple parallel PID loops and ladder-logic interpreters. The 0.42 µm CMOS process and ceramic CPGA package tolerate industrial thermal ranges and through-hole assembly required by chassis-based control cabinets.
Recommended
Military and Aerospace Control Systems
The EPF81188AGC232-2A in its ceramic CPGA-232 package is qualified for many legacy military and aerospace control subsystems where hermeticity and through-hole leaded pins are mandatory. The device implements flight-control state machines, sensor-fusion pre-processors, and redundant bus arbitrators that demand deterministic 5 ns pin-to-pin delays and 184 user I/Os for parallel sensor arrays. JTAG boundary-scan testability supports the in-system testability requirements common to DO-254 and MIL-STD-882 design programs that pre-date modern FPGA obsolescence.
Recommended
Custom ISA / VME / PCI Bus Bridges
The EPF81188AGC232-2A is commonly deployed as a custom ISA, VME, or PCI bus bridge in legacy computer systems and industrial PCs, where its 184 I/O count accommodates the wide parallel data, address, and control buses of these standards. The 1,008 logic elements can implement bus-state machines, address decoding, wait-state generators, and DMA controllers on a single device, while the 5 ns propagation delay covers the bus-cycle timing of 8 MHz ISA and 33 MHz PCI without external wait states. The registered outputs ensure clean bus arbitration in multi-master configurations.
Recommended
ASIC Prototyping and Emulation
For ASIC prototyping and emulation tasks, the EPF81188AGC232-2A provides 12,000 usable gates and 1,008 logic elements that allow partial emulation of mid-complexity ASIC designs before committing to silicon. The 184 I/O count lets the prototype fan out to standard logic analyzers and logic probes used in pre-silicon validation. In-circuit reconfigurability via external configuration devices means design iterations can be loaded in seconds, and JTAG boundary-scan helps debug prototype boards. The 5 ns propagation delay approximates the timing of typical 0.5 µm-cell ASIC libraries from the same era.
Recommended
Legacy Test and Measurement Equipment
The EPF81188AGC232-2A is widely deployed in legacy test and measurement instruments such as oscilloscope acquisition boards, logic analyzer pre-processors, and protocol exercisers. Its 184 I/O count accommodates the many synchronous parallel channels typical of high-pin-count digitizers and pattern generators, while the 125 MHz internal frequency supports real-time capture and stimulus generation at rates that match the legacy instrument market. The 5 ns propagation delay is ideal for state-machine sequencing in protocol-exerciser firmware.
Recommended
Recommended Products Summary
Engineering reference data for EPF81188AGC232-2A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF81188AGC232-2 | EPF81188AGC232-2H |
|---|---|---|---|
| Package | CPGA-232 | CPGA-232 | CPGA-232 |
| Brand | Altera | Altera | Altera |
| Usable Gates | 12,000 | 12,000 | 12,000 |
| Logic Elements | 1,008 | 1,008 | 1,008 |
| Propagation Delay | 5 ns | 5 ns | 5 ns |
| Internal Frequency | 125 MHz | 125 MHz | 125 MHz |
| User I/O | 184 | 184 | 184 |
| Speed Grade | -2A (enhanced) | -2 (base) | -2H (extended temp) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
| Qty-1 Unit Price (USD) | $145.00 | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-density FLEX 8000 family member with 12K usable gates (vs EPF10K50VRC240-3)
- Ceramic CPGA-232 package supports through-hole assembly and harsh environments (vs EPF81188AQC208-2)
- 184 user I/Os in a single device (vs EPF6024ATC144-3)
Design Notes
The EPF81188AGC232-2A is a volatile SRAM-based FPGA - it loses its configuration on every power cycle. A non-volatile configuration memory device (such as an Altera EPC series configuration PROM) must be present on the board, otherwise the device will not boot. Verify that the configuration PROM capacity matches the bitstream size of the EPF81188A variant, since a too-small PROM will produce incomplete configuration and unpredictable behavior at startup.
The CPGA-232 ceramic package requires plated through-holes (PTH) on the PCB and a socket or direct through-hole soldering. Plan for at least 1.6 mm hole diameter and 3.0 mm pad diameter per pin per IPC-2222 standards. The pin grid array has pins on a 2.54 mm pitch in a 17×17 array with center depopulation, and designers should allocate a keep-out area of at least 2 mm around the package for socket clearance and rework.
The FLEX 8000 family supports 5 V tolerant I/O, but mixing 5 V and 3.3 V banks on the same device requires careful bank-by-bank VCCIO supply routing. Each I/O bank has independent VCCIO pins and must be powered from a single rail; cross-bank voltage mixing without proper decoupling can cause latch-up. Place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCCIO and VCCINT pin to suppress switching noise on the 125 MHz internal clock.
Estimated: at 125 MHz with all 184 I/O toggling at 25 MHz, the EPF81188AGC232-2A dissipates approximately 1.5 W to 2 W under typical conditions. The ceramic CPGA-232 package provides good thermal conduction to a socket or PCB copper pour; however, designers should still verify junction temperature against the device's operating range. Add thermal vias under the package center depopulation to improve heat transfer to inner PCB planes.
Compliance Information
Original FLEX 8000 family pre-dates modern RoHS directives; ceramic CPGA packages typically use lead-based termination finishes. The -2H variant is qualified to MIL-STD-883 environmental screening for military applications. New designs should not target this family due to its obsolete status.
