EPM5192GM-2/883B - 192-Macrocell MAX 5000 EPLD, PGA-84, 55ns | Altera
N.º de pieza: EPM5192GM-2/883B ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $260 | $2.600,00 |
| 100 | $235 | $23.500,00 |
| 500 | $210 | $105.000,00 |
| 1.000 | $195 | $195.000,00 |
EPM5192GM-2/883B Descripción general
An EPLD (Erasable Programmable Logic Device) is a non-volatile programmable logic IC that preceded modern CPLDs and FPGAs, offering fast deterministic propagation delay, low power, and one-time or erasable programming. EPLDs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically within logic ICs -> programmable logic -> digital semiconductors. The MAX 5000 architecture extends classic PAL/GAL logic with macrocell-based sum-of-products implementation, programmable interconnect, and JTAG-supportable test features. Compared with SRAM-based FPGAs, the EPM5192's EPROM cells retain configuration without external boot memory, while compared with pure PALs it offers 5-10x higher logic density and predictable timing.
Key features of the EPM5192GM-2/883B include 192 macrocells (768 usable gates), 55 ns tPD, 80 MHz fCNT, 192 flip-flops, 16 LABs, dedicated input and global clock networks, 5 V VCC single supply, in-system programmability via ByteBlaster, JTAG support through the legacy JTAG block, and a 100 mA typical operating current. The ceramic windowed PGA-84 package provides hermetic environmental protection for military and aerospace applications, where the MIL-STD-883B screening guarantees operation across -55C to +125C and resilience against thermal, mechanical, and solder-shock stresses.
Architecturally, the EPM5192 uses a programmable-AND/fixed-OR PLA-like macrocell structure where each macrocell contains 5 product terms (expandable to 20 via parallel expanders) feeding a D flip-flop with programmable clock, preset, clear, and output enable. The 16 LABs each contain 12 macrocells and a global interconnect that routes signals between LABs through a fixed but high-fanout network. This architecture delivers short, predictable propagation delays independent of design complexity, contrasting with the routing-dependent timing of SRAM FPGAs.
Typical applications for the EPM5192GM-2/883B include military and aerospace digital control systems, defense electronics modules requiring MIL-STD-883B screening, industrial control logic, legacy bus arbitration and address decoding, telecommunications backplane glue logic, and avionics line-replaceable units (LRUs). Engineers use it as a deterministic state-machine and decoder platform where both radiation-tolerant/hi-rel packaging and 5 V tolerance are required. When designing with this part, verify power sequencing (no hot-plug), confirm ByteBlaster programming voltage levels (VPP = 12 V during in-system programming), and observe the PGA-84 socket footprint clearance requirements.
Alternativas directas para EPM5192GM-2/883B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPM5192GM-2/883B (mismo factor de forma y huella) — difiere en Package, Device Type, Mounting Type, Process Technology, Supply Voltage (VCC).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPM5192GM-1/883B
✅ Sustitución directa✓ En stock
$195 / unidad
Ver hoja de datos →EPM5192GM
✅ Sustitución directa✓ En stock
$58 / unidad
Ver hoja de datos →EPM5192GM-1
✅ Sustitución directa✓ En stock
$27.8 / unidad
Ver hoja de datos →EPM5192GM-2
✅ Sustitución directa✓ En stock
$92 / unidad
Ver hoja de datos →EPM5192GI84
✅ Sustitución directa✓ En stock
$19.8 / unidad
Ver hoja de datos →EPM5192GI
✅ Sustitución directa✓ En stock
$18.95 / unidad
Ver hoja de datos →EPM5192GM-2/883B Valores máximos y características eléctricas
| Product Type | UV Erasable Programmable Logic Device (EPLD) |
| Family | MAX 5000 |
| Macrocells | 192 |
| Usable Gates | 768 (approx., per Altera legacy gate count) |
| Logic Array Blocks (LABs) | 16 |
| Propagation Delay (tPD) | 55 ns (max, -2 speed grade) |
| Maximum Toggle Frequency (fCNT) | 80 MHz |
| Supply Voltage (VCC) | 5 V (typical, single supply) |
| Operating Supply Current (ICC) | 100 mA (typical) |
| Package Type | Ceramic Windowed PGA-84 (Pin Grid Array) |
| Recuento de pines | 84 |
| Rango de temperatura de funcionamiento | -55C to +125C (military grade per 883B screening) |
| Process Technology | 0.75 um CMOS EPROM |
| Programming Method | In-system via ByteBlaster; UV erasure (windowed lid) |
| Compliance / Screening | MIL-STD-883B |
Guía de configuración de pines de EPM5192GM-2/883B ceramic windowed pga-84 (pin grid array)
Configuración de pines para EPM5192GM-2/883B (encapsulado ceramic windowed pga-84 (pin grid array)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPM5192GM-2/883B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPM5192GM-2/883B es adecuado para 7 aplicacións: Military Avionics Line-Replaceable Units, Defense Electronics Glue Logic, Industrial Control Logic, Telecommunications Backplane Interface, Legacy Bus Arbitration and Address Decoding, Aerospace Flight Control Subsystems, High-Reliability Embedded State Machines.
Military Avionics Line-Replaceable Units
The EPM5192GM-2/883B is well matched to military avionics LRU applications requiring MIL-STD-883B Class B environmental screening. The 192-macrocell density accommodates typical LRU glue-logic such as MIL-STD-1553 bus arbitration, ARINC 429 channel decoding, and discrete-to-processor interface logic. The 55 ns tPD at -2 speed grade is sufficient for 1553B response timing and ARINC 429 bit-rate decoding up to 100 kbps. The PGA-84 ceramic windowed package provides hermetic sealing against humidity and altitude cycling, critical for avionics line-replaceable modules where field repairability is not expected.
Recomendado
Defense Electronics Glue Logic
The EPM5192GM-2/883B serves as a deterministic glue-logic platform for defense electronics modules where SRAM-based FPGAs are unsuitable due to radiation, configuration-volatility, or boot-time concerns. The EPROM non-volatile configuration eliminates boot memory and ensures deterministic behavior at power-up, a key requirement for defense command-and-control subsystems. The 192 macrocells support typical decoder/intensive logic functions such as memory bank selection, interrupt prioritization, and DMA arbitration. Ceramic 883B packaging meets MIL-HDBK-454 environmental baselines for ground-mobile and naval defense systems.
Recomendado
Industrial Control Logic
The EPM5192GM-2/883B provides deterministic timing for legacy industrial control logic such as motor drive sequencing, sensor multiplexing, and PLC inter-board communication. The 55 ns tPD is well below typical PLC scan-cycle requirements, and the 192 macrocells support complex ladder-equivalent state machines. The PGA-84 package and -55C to +125C temperature range permit deployment in harsh factory environments with vibration and thermal cycling. However, for new industrial designs, consider MAX II or MAX V CPLDs as modern pin-compatible equivalents with lower power.
Recomendado
Telecommunications Backplane Interface
The EPM5192GM-2/883B is suited to telecommunications backplane applications requiring reliable bus arbitration, address decoding, and protocol conversion in legacy TDM and ATM systems. The 192 macrocells support parallel bus interfaces (up to 64 I/O) needed for legacy backplane widths, while the 55 ns tPD handles typical 25-40 MHz backplane clocks. The non-volatile EPROM configuration is advantageous in telecom central-office environments where predictable cold-start behavior is required. The 883B variant is preferred for telecom-grade hardware deployed in extended-temperature outdoor cabinets.
Recomendado
Legacy Bus Arbitration and Address Decoding
The EPM5192GM-2/883B excels in classic address-decoding and bus-arbitration roles in legacy VME, VXI, and proprietary backplane systems. The 192 macrocells easily accommodate 24-32 bit address decoders with multiple chip-select outputs and timing strobes. The 55 ns tPD ensures the device does not bottleneck even 25 MHz VME bus cycles. Deterministic propagation delay is critical here because SRAM FPGAs introduce routing-dependent delay variation that complicates bus arbitration timing closure.
Recomendado
Aerospace Flight Control Subsystems
The EPM5192GM-2/883B's MIL-STD-883B screening and 192-macrocell density suit flight-control subsystems in unmanned aerial vehicles (UAVs) and tactical aircraft. The device handles sensor-fusion glue logic, servo-driver interface, and flight-control surface actuator command sequencing. The ceramic PGA-84 package is hermetic against humidity encountered at altitude, and the -55C to +125C operating range covers the aerospace thermal envelope. Designers should note that for new flight-control designs, Altera/Intel recommends MAX 10 or Cyclone IV with radiation-tolerant packaging as modern equivalents.
Recomendado
High-Reliability Embedded State Machines
The EPM5192GM-2/883B is well suited to high-reliability state-machine applications such as protocol converters, redundant-system voters, and fault-tolerant controller designs. The 192 macrocells support sophisticated state machines with parallel and serial expander product-term expansion. The EPROM non-volatile configuration ensures the state machine is always defined at startup, eliminating configuration-corruption failure modes. The 883B screening makes it appropriate for nuclear, railway-signaling, and medical-implantable subsystems where component traceability and reliability data are mandated.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPM5192GM-2/883B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPM5192GM-1/883B | EPM5192GM | EPM5192GM-1 | EPM5192GM-2 | EPM5192GI84 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | PGA-84 (CPGA-84, ceramic windowed) | PGA-84 (CPGA-84, ceramic windowed) | PGA-84 (CPGA-84, ceramic windowed) | PGA-84 (CPGA-84, ceramic windowed) | PGA-84 (CPGA-84, ceramic windowed) | PGA-84 (CPGA-84, ceramic windowed) |
| MIL-STD-883B Screening | Yes (Class B) | Yes (Class B) | No | No | No | No (industrial grade) |
| Operating Temperature Range | -55C to +125C | -55C to +125C | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +85C (industrial) |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- MIL-STD-883B Class B screening vs commercial EPM5192GM (frente a EPM5192GM)
- Predictable deterministic timing vs SRAM FPGAs (frente a Cyclone-series FPGAs)
- Non-volatile EPROM configuration vs SRAM FPGAs (frente a Cyclone-series FPGAs)
Notas de diseño
The EPM5192GM-2/883B operates from a single 5 V supply (4.75 V to 5.25 V) and draws 100 mA typical Icc. Place 0.1 uF and 10 uF decoupling capacitors as close as possible to the VCC and GND pins, paying particular attention to the multiple VCC/GND pin pairs on the PGA-84 footprint. Add a bulk 47-100 uF tantalum capacitor at the supply entry to the device. For programming, supply VPP = 12 V (typical) during in-system programming via the ByteBlaster cable; VPP must be sequenced after VCC and removed before VCC falls below 4.75 V.
The ceramic PGA-84 package has a theta_JA of approximately 30-35 C/W (typical for windowed ceramic PGAs) without external heatsink. At 100 mA typical ICC and 5 V VCC, internal dissipation is about 0.5 W, yielding a junction-to-ambient rise of approximately 15-18 C. Within the -55C to +125C operating range, derating to 110 C ambient max is conservative. For higher-altitude deployments, account for reduced convective cooling in the thermal budget.
The PGA-84 footprint requires a through-hole socket (machine-pin or screw-machined) for thermal cycling and field replacement. PCB pad diameters should be 1.6 mm with 2.5 mm antipads, and pin-to-pin pitch follows the standard 2.54 mm PGA grid. Provide adequate keep-out around the ceramic windowed lid for UV erasure access (window diameter is typically 10-12 mm; check the package mechanical drawing). Ground planes should surround but not extend beneath the PGA socket to avoid capacitive loading on I/O pins.
Do not assume the EPM5192GM-2/883B is RoHS compliant without checking the lot date code and manufacturer compliance letter - military and aerospace ceramic parts often contain lead-bearing finishes exempt from RoHS. Always verify the ByteBlaster programming voltage (VPP = 12 V) is sequenced correctly; out-of-spec VPP can permanently damage the device. When migrating from EPM5192 (commercial) to EPM5192GM-2/883B (military), confirm the supply and JTAG chains support the higher capacitance of the ceramic package at high clock rates.
Información de cumplimiento
MIL-STD-883B Class B screened per /883B suffix; military and aerospace ceramic packages are typically exempted from RoHS under military exemption clauses. Compliance status (RoHS, REACH, lead-free, halogen-free) is [DATA_NEEDED] for the /883B variant; verify with distributor for specific lot date codes.
